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Material: | TLX-8 | Thickness: | 31 Mil |
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Surface Finish: | Immersion Gold | Copper Weight: | 1 OZ |
High Light: | Immersion Gold Double Sided PCB,31mil Double Sided PCB,TLX-8 Double Sided PCB |
Introducing our newly shipment PCB which made of TLX-8 material. TLX-8 is an exceptional PTFE fiberglass laminate PCB designed to provide reliability and versatility in various RF applications. Engineered with a wide range of available thicknesses and copper cladding options, TLX-8 offers outstanding mechanical reinforcement and excels in challenging environments. Whether it's withstanding extreme temperatures, resisting vibration during space launches, or maintaining radiation resistance in space, TLX-8 delivers exceptional performance.
TLX-8 offers several key benefits. Firstly, it ensures superior Passive Intermodulation (PIM) values, measured lower than -160 dBc*, which ensures exceptional signal integrity and minimizes signal interference. Secondly, TLX-8 exhibits outstanding mechanical strength and thermal stability, making it ideal for applications subjected to harsh conditions. Its low and stable dielectric constant guarantees reliable signal transmission and optimal impedance control for high-frequency performance.
One of the notable features of TLX-8 is its dimensional stability, which allows it to maintain precise and reliable circuit performance even in demanding environments. Additionally, TLX-8 has low moisture absorption properties, enhancing its reliability and making it suitable for applications exposed to humid conditions. The tightly controlled dielectric constant of TLX-8 provides consistent performance and predictable electrical characteristics. Moreover, the low Dissipation Factor (DF) ensures minimal signal loss, facilitating efficient transmission of high-frequency signals.
TLX-8 TYPICAL VALUES | |||||
Property | Test Method | Unit | Value | Unit | Value |
DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
Flammability Rating | UL-94 | V-0 | V-0 |
In terms of safety, TLX-8 complies with the UL 94 V0 rating, ensuring high fire resistance in critical applications. It is specifically designed for low layer count microwave designs, offering optimal performance and ease of integration. The electrical properties of TLX-8 include a dielectric constant of 2.55 ± 0.04 at 10 GHz and a Dissipation Factor of 0.0018 at 10 GHz. The dimensional stability and coefficient of thermal expansion (CTE) of TLX-8 are within acceptable ranges for reliable performance.
This RF PCB is constructed as 2-layer rigid boards with a copper weight of 1oz (1.4 mils) on the outer layers. The board dimensions are 111.54mm x 116.75 mm with a finished thickness of 0.8mm. The minimum trace/space is 6/5 mils, and the minimum hole size is 0.25mm. The PCBs undergo thorough testing, including a 100% electrical test prior to shipment, ensuring their quality and reliability.
TLX-8 PCBs are suitable for a wide range of applications, such as radar systems, mobile communications, microwave test equipment, and microwave transmission devices. Whether you need reliable circuitry for these applications or require exceptional performance in challenging RF environments, TLX-8 PCBs provide the reliability and performance you need.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848