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Product Details:
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Material: | TLX-7 | Thickness: | 20 Mil |
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Surface Finish: | Immersion Silver | Copper Weight: | 1 OZ |
Highlight: | 20mil 2-layer TLX-7 RF PCB,TLX-7 RF PCB,20mil Immersion Silver TLX-7 RF PCB |
Introducing our newly shipped PCB built on TLX-7, a high-quality PTFE fiberglass laminate material designed to excel in a wide range of RF applications. Offering versatility with its wide range of available thicknesses and copper cladding, TLX-7 is particularly suitable for low layer count microwave designs. This exceptional material provides mechanical reinforcement in severe environments, making it an excellent choice for various applications.
Key Benefits:
Excellent PIM Values in PCBs (measured below -160 dBc*)
Outstanding Mechanical & Thermal Properties
Low and Stable Dk (Dielectric constant)
Dimensional Stability
Low Moisture Absorption
Tightly Controlled DK
Low DF (Dissipation factor)
UL 94 V0 Rating for superior flammability resistance
Specifically designed for low layer count microwave designs
Main Properties:
Electrical Properties:
Dk @ 10 GHz: 2.6 +/- 0.04 (IPC-650 2.5.5.3)
Df @ 1.9 GHz: 0.0014 (IPC-650 2.5.5.5.1)
Df @ 10 GHz: 0.002 (IPC-650 2.5.5.5.1)
Outgassing (% TML): 0.02 (ASTM E 595, 24 H 257 °F @ ≤ 5 x 10-5 Torr)
Outgassing (% CVCM): 0 (ASTM E 595, 24 H 257 °F @ ≤ 5 x 10-5 Torr)
Outgassing (% WVR): 0.01 (ASTM E 595, 24 H 257 °F @ ≤ 5 x 10-5 Torr)
Dielectric available thickness ranges from 0.13mm to 0.76mm
Peel strength of 12 lbs/in
Moisture Absorption: 0.02% (IPC-650 2.6.2.1)
Type | DK | |
TLY-5A | 2.17 | |
TLY-5 | 2.20 | |
TLY-3 | 2.33 | |
TLT-0 | TLX-0 | 2.45 |
TLT-9 | TLX-9 | 2.50 |
TLT-8 | TLX-8 | 2.55 |
TLT-7 | TLX-7 | 2.60 |
TLT-6 | TLX-6 | 2.65 |
TLE-95 | 2.95 | |
TLC-27 | 2.75 | |
TLC-30 | RF-30 | 3.00 |
TLC-32 | 3.20 | |
TLF-35 | 3.50 | |
TLF-35-xxxx-A | 3.50 | |
RF-35 | RF-35A2 | 3.50 |
TRF-41 | 4.10 | |
TRF-43 | 4.30 | |
TRF-45 | 4.50 | |
RF-60A | 6.15 | |
CER-10 | 10 |
Thermal Conductivity: 0.22 W/M*K (ASTM F433/ASTM 1530-06)
CTE (Coefficient of Thermal Expansion, 25-260 °C):
X: 21 ppm/°C (IPC-650 2.4.41/ASTM D 3386)
Y: 23 ppm/°C (IPC-650 2.4.41/ASTM D 3386)
Z: 215 ppm/°C (IPC-650 2.4.41/ASTM D 3386)
Flammability Rating: V-0 (UL-94)
This PCB constructed with TLX-7 follows a 2-layer rigid design, featuring copper layers with a thickness of 35 μm on both sides and a Taconic TLX-7 core with a thickness of 0.508 mm (20mil). The board dimensions are precisely measured at 91mm x 75mm, with a tolerance of +/- 0.15mm. The minimum trace/space is 4/5 mils, and the minimum hole size is 0.3mm. The finished board thickness is 0.6mm, with a 1oz (1.4 mils) outer layer copper weight. Via plating thickness is 20 μm, and the surface finish is immersion silver. There is no top or bottom silkscreen or solder mask applied. Each PCB undergoes a 100% electrical test before shipment to ensure its quality and functionality.
TLX-7 PCBs have been designed to meet IPC-Class-2 quality standards. They are available worldwide, making them accessible for various projects and applications. With their exceptional properties, TLX-7 PCBs find applications in radar systems, mobile communications, microwave test equipment, microwave transmission devices, and components such as couplers, splitters, combiners, amplifiers, and antennas.
Experience unparalleled reliability, outstanding performance, and seamless integration with TLX-7 PCBs, the perfect choice for your RF applications.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848