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Material: | RT Duroid 6035HTC | Thickness: | 10mil |
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Layer Count: | 2-layer | Surface Finish: | Immersion Gold |
Highlight: | Black Silkscreen Double Sided RF PCB,10mil Double Sided RF PCB,6035HTC Double Sided RF PCB |
Introducing the RF PCB based on RT duroid 6035HTC material, an exceptional solution designed specifically for high power RF and microwave applications. Leveraging the latest advancements in technology, this PCB offers unparalleled features and benefits that make it the ideal choice for demanding high power requirements.
Rogers RT duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites renowned for their exceptional performance in high power applications. These laminates have been specifically engineered to excel in dissipating heat, making them an excellent choice for applications that demand efficient thermal management. With a thermal conductivity nearly 2.4 times higher than standard RT duroid 6000 products, this PCB ensures optimum heat dissipation and enables lower operating temperatures, thereby maximizing the performance and reliability of high power circuitry.
One of the standout features of this PCB is its impressive dielectric performance. It boasts a DK (dielectric constant) of 3.5 +/- 0.05 at 10 GHz/23°C, ensuring consistent and reliable signal propagation across a wide range of frequencies. The dissipation factor of 0.0013 at 10 GHz/23°C guarantees minimal signal loss and optimal high frequency performance. Moreover, the thermal coefficient of the dielectric constant of -66 ppm/°C ensures stable electrical performance even in environments with fluctuating temperatures.
RT/duroid 6035HTC Typical Value | |||||
Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.6 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
Dissipation Factor | 0.0013 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
Volume Resistivity | 108 | MΩ.cm | A | IPC-TM-650, 2.5.17.1 | |
Surface Resistivity | 108 | MΩ | A | IPC-TM-650, 2.5.17.1 | |
Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
Moisure Absorption | 0.06 | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 | |
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
Thermal Conductivity | 1.44 | W/m/k | 80℃ | ASTM C518 | |
Density | 2.2 | gm/cm3 | 23℃ | ASTM D792 | |
Copper Peel Stength | 7.9 | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-Free Process Compatible | Yes |
To further enhance its reliability, the RT duroid 6035HTC-based PCB exhibits a low moisture absorption rate of 0.06%. This feature minimizes the impact of moisture on electrical performance and ensures consistent operation even in humid conditions. Additionally, the PCB's thermal conductivity of 1.44 W/m/K at 80°C facilitates efficient heat dissipation, allowing the circuit to operate at lower temperatures and reducing the risk of component failure.
Mechanical stability is another key advantage offered by this PCB. With a CTE (coefficient of thermal expansion) of 19 ppm/°C in the X and Y axes, and 39 ppm/°C in the Z-axis, the PCB maintains its structural integrity during temperature variations. This ensures reliability and longevity, making it suitable for challenging environments and applications that require high durability.
The construction of the RT duroid 6035HTC-based PCB is carefully designed to meet the demands of high power circuitry. It features a 2-layer rigid stackup with copper layers of 35 μm each, providing excellent electrical conductivity. The core comprises RT duroid 6035HTC material with a thickness of 0.254 mm (10mil), which offers a balance of electrical performance, thermal management, and mechanical stability. The finished board thickness is 0.3mm, and the outer layers have a finished copper weight of 1oz (1.4 mils). The surface finish is Immersion Gold, ensuring not only optimal conductivity but also corrosion resistance, thereby extending the lifespan of the PCB.
PCB Material: | Ceramic-filled PTFE composites |
Designation: | RT/duroid 6035HTC |
Dielectric constant: | 3.50±0.05 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
In terms of quality assurance, this RF PCB adheres to IPC-Class-2 standards, guaranteeing reliability and performance consistency. It has undergone rigorous testing and inspection to ensure that it meets the industry's highest standards of quality and performance. This certification provides peace of mind and reassurance, especially in critical high power applications where reliability is of utmost importance.
The RT duroid 6035HTC-based RF PCB is readily available worldwide, ensuring convenient access for various projects and applications. Its availability on a global scale facilitates the development and deployment of high power RF and microwave systems in various industries, including telecommunications, aerospace, defense, and more.
With its exceptional material properties, precise construction, and versatile applications, the RT duroid 6035HTC-based RF PCB is the ultimate solution for high power RF and microwave projects. It has found widespread use in high power RF and microwave amplifiers, power amplifiers, couplers, filters, combiners, and power dividers. Its high thermal conductivity, low loss tangent, thermal stability, and mechanical reliability make it the preferred choice for demanding applications that require optimal performance and longevity.
Enhance your high power circuit designs by incorporating the RT duroid 6035HTC-based RF PCB, and witness unmatched performance and reliability firsthand. Rely on its remarkable capabilities to achieve exceptional outcomes, ensuring the triumph of your high power RF and microwave applications.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848