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| Highlight: | Immersion Gold RT duroid 6010.2LM PCB,2layer RT duroid 6010.2LM PCB,25mil RT duroid 6010.2LM PCB |
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Introducing an RF PCB crafted using the advanced RT duroid 6010.2LM material. This cutting-edge PCB ensures exceptional performance in electronic and microwave circuit applications. Designed specifically to meet high dielectric constant requirements, it offers an array of impressive features and benefits that set it apart from the competition.
The RT/duroid 6010.2LM laminates provide high dielectric constants (Dk) to enable circuit size reduction. With a Dk of 10.2 +/- 0.25 at 10GHz, this PCB allows for more compact designs without compromising on performance. Its low dissipation factor of .0023 at 10GHz ensures minimal signal loss, making it ideal for operating at X-band or below.
Additionally, the RT duroid 6010.2LM material exhibits remarkable thermal stability, with a decomposition temperature (Td) of 500 °C TGA. This ensures reliable performance even in high-temperature environments. With a low moisture absorption rate of 0.01%, it minimizes the impact of moisture on electrical loss, guaranteeing consistent and reliable operation.
The tight control of dielectric constant (Dk) and thickness in the RT duroid 6010.2LM material ensures repeatable circuit performance. This means consistent and predictable results, allowing for precise circuit designs. Moreover, the PCB's low Z-axis expansion ensures reliable plated through holes in multilayer boards for enhanced overall reliability.
| RT/duroid 6010 Typical Value | |||||
| Property | RT/duroid 6010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 25 | Z | % | ||
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 24 24 47 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 3.1 | g/cm3 | ASTM D792 | ||
| Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) |
Calculated | ||
| Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
The construction details of this RF PCB include a 2-layer rigid design with copper layers of 35 μm each. The Rogers RT duroid 6010.2LM material forms the core, with a thickness of 0.635 mm (25mil). The finished board thickness is 0.7mm, and the outer layers feature a 1oz (1.4 mils) copper weight. With an immersion gold surface finish, it offers excellent conductivity and corrosion resistance.
Adhering to IPC-Class-2 quality standards, this RF PCB meets industry requirements and guarantees reliable performance. It is readily available worldwide, ensuring convenient access for various projects and applications.
| PCB Material: | Ceramic-PTFE composite |
| Designator: | RT/duroid 6010LM |
| Dielectric constant: | 10.2 ±0.25 (process); 10.7 (design) |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
The RT duroid 6010.2LM-based RF PCB finds typical applications in patch antennas, satellite communications systems, power amplifiers, aircraft collision avoidance systems, and ground radar warning systems. Its outstanding electrical and thermal properties make it a preferred choice for demanding applications where high performance and reliability are indispensable.
Upgrade your electronic and microwave circuit designs with this high-performance RF PCB based on the RT duroid 6010.2LM material. Experience the benefits of its high dielectric constant, low loss, and reliable performance. With its exceptional material properties, precise construction, and versatile applications, this RF PCB is the perfect solution for demanding projects.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
