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2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG

2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG
2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG 2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG 2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG

Large Image :  2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99/PCS-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

Radio Frequency Circuit Board With ENIG


2L RO3006 RF PCB


Copper White Silkscreen RF PCB

Introducing our newly shipped PCB made of RO306 substrates.


RO3006 Introduction:
Rogers RO3006 laminates are advanced circuit materials that utilize ceramic-filled PTFE composites. These materials are specifically designed to offer exceptional stability in both electrical and mechanical properties. One notable feature of RO3006 is its ability to maintain a stable dielectric constant (Dk) over a wide temperature range. This characteristic eliminates the step change in Dk that is commonly observed in PTFE glass materials near room temperature.


RO3006 laminates from Rogers consist of ceramic-filled PTFE composites. These materials exhibit a dielectric constant of 6.15 +/- 0.15 at 10 GHz and 23°C, along with a low dissipation factor of 0.002 at the same frequency and temperature. With a high thermal decomposition temperature exceeding 500°C, RO3006 demonstrates excellent thermal stability. It also offers a thermal conductivity of 0.79 W/mK, facilitating efficient heat transfer. In terms of moisture absorption, RO3006 boasts a low rate of 0.02%. Additionally, the material's coefficient of thermal expansion ranges from 17 ppm/°C to 24 ppm/°C (-55 to 288 °C) in the X, Y, and Z axes.


RO3006 laminates provide uniform mechanical properties across a range of dielectric constants, making them ideal for multi-layer board designs that require different dielectric constants. These laminates are also compatible with hybrid designs that involve epoxy glass multi-layer boards. Another advantage of RO3006 is its low in-plane expansion coefficient, which matches that of copper. This characteristic enhances the reliability of surface-mounted assemblies and makes it suitable for applications sensitive to temperature changes. Furthermore, RO3006 exhibits excellent dimensional stability. The volume manufacturing process used for these laminates ensures economical pricing, making them a cost-effective choice.


RO3006 Typical Value
Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.27
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC
Surface Resistivity 105   COND A IPC
Tensile Modulus 1498
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


PCB Stackup and Construction Details:
For this 2-layer rigid PCB, the stackup consists of a copper layer with a thickness of 35 μm, followed by the RO3006 substrate with a thickness of 25mil (0.635mm), and another copper layer with a thickness of 35 μm.


The PCB construction details include a board size of 30mm x 37mm for a single piece. The minimum trace/space is 5/5 mils, and the minimum hole size is 0.25mm. There are no blind vias in this configuration. The finished board thickness is 0.8mm, and the outer copper layers have a weight of 1 oz (1.4 mils). The via plating thickness is 20 μm. The surface finish is immersion gold, and the top silkscreen is white, while no silkscreen is applied to the bottom. Additionally, no solder mask is present on the top or bottom layers. Prior to shipment, a 100% electrical test is conducted to ensure quality.


PCB Statistics:
In terms of PCB statistics, this configuration includes 15 components and a total of 50 pads. Out of these pads, 31 are through-hole pads, while 19 are top surface-mount technology (SMT) pads. There are no bottom SMT pads. This PCB design incorporates 38 vias and consists of 2 nets.


2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG 0


Artwork and Standards:
The supplied artwork type for this PCB design is Gerber RS-274-X, a widely accepted industry standard. The accepted standard for this design is IPC-Class-2, ensuring compliance with quality and performance requirements.


Availability and Typical Applications:
RO3006 laminates are available worldwide, providing accessibility for various markets. These laminates find application in several industries. They are particularly suitable for automotive radar applications, global positioning satellite antennas, cellular telecommunications systems (including power amplifiers and antennas), patch antennas for wireless communications, direct broadcast satellites, cable systems for data link, remote meter readers, and power backplanes. Their exceptional electrical and mechanical properties make them versatile and reliable for a wide range of applications.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)