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Cutting Edge RF PCB Board,
30mil Dual Layer RF PCB Based,
Dual Layer Radio Frequency Circuit Board
Introducing our cutting-edge RF PCB, meticulously crafted using the innovative AD300D material from Rogers. This high-frequency laminate combines the power of ceramic-filled, glass-reinforced PTFE with exceptional electrical properties, making it the ultimate choice for RF applications that demand top-notch performance and reliability.
The AD300D material is a game-changer in the world of RF PCBs. Its ceramic-filled, glass-reinforced PTFE composition ensures a low and tightly controlled dielectric constant, minimizing signal loss and maximizing transmission efficiency. With excellent PIM (passive intermodulation) response, this material guarantees pristine signal quality, even in the most demanding RF environments. Not only does it offer superior electrical characteristics, but it also provides a cost-effective solution, improving both electrical and mechanical performance without breaking the bank.
We've harnessed the exceptional properties of the AD300D material to create an RF PCB that surpasses expectations. With a dielectric constant of 2.94 (±0.05) at 10 GHz/23°C, this PCB ensures precise and consistent electrical performance. Its low loss tangent of 0.0021 at 10GHz and 23°C, with a relative humidity of 50%, guarantees minimal signal distortion and maximum signal fidelity. The AD300D PCB boasts an impressive decomposition temperature (Td) exceeding 500°C, ensuring unmatched durability under extreme thermal conditions. With a moisture absorption rate of just 0.04%, it remains stable and reliable in humid environments. The CTE values of 24 ppm/°C (X-axis), 23 ppm/°C (Y-axis), and 98 ppm/°C (Z-axis) provide exceptional dimensional stability, contributing to consistent and reliable performance. With a low PIM of -159dBC at 30mils and a thermal conductivity of 0.37 W/m-K at 100°C, this PCB truly stands out in the RF realm.
The AD300D-based RF PCB brings a multitude of benefits to the table. Its wide range of applications showcases its versatility and adaptability to various RF systems. Improved power handling capabilities ensure efficient power transfer, while the low loss properties result in enhanced antenna efficiency, optimizing overall system performance. Moreover, the AD300D PCB maintains its mechanical form during handling, guaranteeing reliability and ease of use.
Crafted with precision, this RF PCB features a 2-layer rigid construction. The carefully designed stackup consists of a copper layer (35 μm), followed by the AD300D material (0.762 mm or 30mil), and another copper layer (35 μm). The board dimensions measure 53.18mm x 56.04 mm, with a tolerance of +/- 0.15mm. This PCB supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.25mm. It does not include blind vias. With a finished board thickness of 0.8mm and a finished copper weight of 1oz (1.4 mils) for the outer layers, this PCB strikes the perfect balance between durability and performance. The PCB surface is finished with immersion silver, providing excellent conductivity and corrosion resistance. Furthermore, it does not feature top or bottom silkscreens or solder masks. To ensure impeccable quality, each PCB undergoes a rigorous 100% electrical test prior to shipment.
Equipped with 16 components and a total of 33 pads, our RF PCB caters to a range of design requirements. Among these pads, 21 are thru-hole pads, and 12 are top SMT pads. Although there are no bottom SMT pads, the PCB features 31 vias and supports 2 nets.
Adhering to IPC-Class-2 standards, our RF PCB guarantees superior manufacturing and performance. It is available worldwide, providing customers across the globe with access to its exceptional features and unparalleled RF performance.
Unlock the full potential of your RF applications with AD300D-based RF PCB. Whether you're working on cellular infrastructure base station antennas, automotive telematics antenna systems, or commercial satellite radio antennas, our PCB is the pinnacle of RF excellence, ensuring reliable, high-performance solutions that push the boundaries of what's possible in the RF world.
Contact Person: Ms. Ivy Deng