8 Layer 1mm High Frequency PCB Based On 370HR Substrates With Immersion Gold

Introducing our high-frequency PCB built on the robust 370HR substrate. Designed for applications that demand exceptional performance in the realm of high frequencies, this PCB surpasses expectations in thermal stability, reliability, and compatibility with advanced manufacturing processes. With its cutting-edge features and superior construction, it is the ideal choice for industries requiring reliable high-frequency solutions, such as telecommunications, aerospace, and radar systems.

The 370HR substrate, renowned for its high-performance characteristics, utilizes a patented 180°C Tg FR-4 multifunctional epoxy resin system. This innovative design ensures optimal thermal performance and reliability, meeting the stringent requirements of high-frequency applications. The 370HR laminate and prepregs incorporate high-quality E-glass glass fabric, guaranteeing superior resistance to Conductive Anodic Filament (CAF) formation, a leading concern in high-frequency circuitry. Additionally, the 370HR PCB surpasses traditional FR-4 materials with its exceptional mechanical, chemical, and moisture resistance properties.

Key Features:
- UL Certified and RoHS compliant, demonstrating adherence to stringent quality and environmental standards.
- CAF resistant, safeguarding against conductive filament formation and ensuring long-lasting performance.
- Glass Transition Temperature (Tg) of 180°C, providing exceptional thermal stability under high-frequency conditions.
- Decomposition Temperature (Td) of 340°C, ensuring durability and resistance to elevated temperatures.
- Time to Delaminate by TMA (Copper removed): T260 of 60 minutes, T288 of 30 minutes, indicating excellent thermal performance.

Benefits:
- FR-4 process compatible, enabling seamless integration into existing manufacturing processes.
- UV blocking and AOI fluorescence, enhancing visual inspection and quality control during production.
- Multiple reflow capable, facilitating efficient assembly and rework processes.
- HDI technology compatible, allowing for advanced high-density interconnect designs.

This high-frequency PCB boasts an 8-layer rigid construction, optimized to deliver superior signal integrity and power distribution. The stackup consists of signal, plane, and HR370 core layers, ensuring optimal performance in high-frequency applications. With a finished board thickness of 1.0mm, it strikes a balance between durability and compactness.

The construction details of this PCB include a minimum trace/space of 4/4 mils, minimum hole size of 0.2mm, and a finished copper weight of 1oz (1.4 mils) for both inner and outer layers. Via plating thickness is 20 μm, while the surface finish is immersion gold (4 micro-inches), providing exceptional conductivity and ensuring reliable soldering. The top and bottom silkscreens are white, and the top and bottom solder masks are green, further enhancing the PCB's visual aesthetics and protection.

Prior to shipment, each PCB undergoes a rigorous 100% electrical test to guarantee optimal performance and reliability. With 71 components, 116 pads, 65 through-hole pads, 51 top SMT pads, and 152 vias, this high-frequency PCB offers versatility for various design requirements. It adheres to IPC-Class-2 standards, ensuring adherence to high manufacturing and performance standards.

The high-frequency PCB built on the 370HR substrate is available for global customers. They can benefit from its exceptional features and performance. Choose this advanced solution for your high-frequency applications in telecommunications, aerospace, radar systems, and more, and experience unparalleled reliability and performance in the realm of high frequencies.