2.3mm Hybrid PCB Built On RO3010 RO3006 And RO4003C Substrates

Today, we're excited to showcase our groundbreaking hybrid PCB built on the combined strengths of three exceptional substrates: RO3010, RO3006, and RO4003C. This cutting-edge PCB opens up a world of possibilities for engineers and designers seeking unrivaled performance and reliability. Let's dive into the details of this remarkable creation.

1.1 PCB Substrates (RO3010):
The first substrate in our hybrid PCB is Rogers RO3010, a ceramic-filled PTFE composite known for its superior characteristics. With a dielectric constant of 10.2 +/- .30 at 10 GHz/23°C and a low dissipation factor of 0.0022 at the same frequency and temperature, RO3010 ensures efficient signal transmission and minimal signal loss. It boasts a high thermal stability with a temperature rating exceeding 500°C (Td), making it suitable for demanding applications. The thermal conductivity of 0.95 W/mK enables effective heat dissipation, and its moisture absorption of 0.05% ensures long-term reliability.

1.2 PCB Substrates (RO3006):
The second substrate, Rogers RO3006, is another ceramic-filled PTFE composite that offers exceptional performance. It features a dielectric constant of 6.15 +/- .15 at 10 GHz/23°C and a low dissipation factor of 0.0020 at the same frequency and temperature. With a temperature rating surpassing 500°C (Td), it guarantees stability in harsh environments. The thermal conductivity of 0.79 W/mK enables efficient heat transfer, while the moisture absorption of 0.02% enhances its reliability.

1.3 PCB Substrates (RO4003C):
Completing our trio of substrates is Rogers RO4003C, a hydrocarbon ceramic laminate that delivers reliable performance. It exhibits a dielectric constant of 3.38 +/- .05 at 10 GHz/23°C and a dissipation factor of 0.0027 at the same frequency and temperature. With a temperature rating of over 425°C (Td), it ensures stability under demanding conditions. The thermal conductivity of 0.71 W/mK facilitates effective heat dissipation, while the moisture absorption of 0.06% adds to its long-term reliability.

2. Stackup: No Copper Rigid PCB
This hybrid PCB features a unique stackup comprising the three substrates without any copper layers. The stackup consists of RO3010 with a thickness of 0.635mm (25mil), a prepreg layer, RO3006 with a thickness of 0.635mm (25mil), another prepreg layer, and finally RO4003C with a thickness of 0.813mm (32mil). This configuration leverages the individual strengths of each substrate to achieve optimal performance.

3. Construction Details:
This PCB measuring 3mm x 3mm, with a tolerance of +/- 0.15mm. With no copper layers, there are no specific requirements for trace/space or hole sizes. The finished board thickness is 2.3mm, ensuring robustness and durability. As there are no copper layers, no copper weight or via plating thickness is specified. The PCB does not require surface finish, silkscreen, or solder mask. Each PCB undergoes a 100% electrical test to ensure adherence to the highest quality standards.

4. PCB Statistics:
This hybrid PCB utilizes bare dielectric material with a laser profile/contour. The absence of copper layers allows for greater flexibility in design and application.

5. Artwork and Standards:
This PCB artwork is supplied in Gerber RS-274-X format. It adheres to the widely accepted IPC-Class-2 standard, signifying high manufacturing and assembly quality.

6. Worldwide Availability:
Our hybrid PCB is available worldwide, enabling engineers and designers from all corners of the globe to experience its exceptional performance. No matter where you are, our PCB is ready to power your innovations.

7. Contact Information:
For any technical inquiries or further information, please don't hesitate to reach out to our dedicated team at sales10@bichengpcb.com. We are here to assist you and provide the necessary support to maximize the potential of our hybrid PCB.

Unleash the power of our hybrid PCB built on the synergy of RO3010, RO3006, and RO4003C substrates. Experience unmatched performance, reliability, and innovation in your electronic projects.