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IT-180ATC ENIG HDI PCB Board 6-Layer With Blind Via And Buried Via

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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IT-180ATC ENIG HDI PCB Board 6-Layer With Blind Via And Buried Via

IT-180ATC ENIG HDI PCB Board  6-Layer With Blind Via And Buried Via
IT-180ATC ENIG HDI PCB Board  6-Layer With Blind Via And Buried Via IT-180ATC ENIG HDI PCB Board  6-Layer With Blind Via And Buried Via IT-180ATC ENIG HDI PCB Board  6-Layer With Blind Via And Buried Via

Large Image :  IT-180ATC ENIG HDI PCB Board 6-Layer With Blind Via And Buried Via

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99/PCS-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

Buried Via HDI PCB




Blind Via RF PCB Board

Today we're gald to introduce our newly shipped 6-layer rigid PCB. Crafted with ITEQ IT-180ATC material, this PCB offers outstanding properties for a wide range of applications, from automotive to telecommunications. Let's delve into the remarkable features and specifications that make this PCB an ideal choice for your electronic projects.


1. PCB Material:
This PCB is constructed using ITEQ IT-180ATC, a high-quality material renowned for its exceptional performance. With a permittivity (Dk) of 4.5 at 1MHz and 4.4 at 1GHz, and a low loss tangent (Df) of 0.0014 at 1MHz and 0.0015 at 1GHz, this PCB ensures efficient signal transmission and minimal signal loss. It exhibits a glass transition temperature (DSC) of 175 °C and a decomposition temperature of 345 °C, ensuring high heat resistance. Operating within a temperature range of -40℃ to +130℃, it offers reliability in various environments.


2. Key Features:
This PCB boasts several key features that set it apart from the competition. Its low coefficient of thermal expansion (CTE) ensures stability and reliability in different temperature conditions. The high heat resistance enables it to withstand demanding applications. It excels in CAF (Conductive Anodic Filament) resistance, ensuring long-term reliability. With excellent through-hole reliability, this PCB provides robust connectivity and durability.


3. Stackup:
This 6-layer rigid PCB features a well-designed stackup for optimal performance. It consists of three 35-micron copper layers sandwiched between prepreg and FR-4 core layers. This configuration ensures efficient signal routing, power distribution, and heat dissipation.


4. Construction Details:
This PCB comes in a compact form factor measuring 113mm x 90mm, with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 3/4 mils, accommodating intricate designs. The minimum hole size of 0.10mm (laser drill) enables precise and intricate component placement. The PCB utilizes HDI (High Density Interconnect) technology, incorporating blind vias and buried vias, interconnected across layers. The finished board thickness is 0.66mm, providing a balance between flexibility and durability. It features a 1oz (1.4 mils) copper weight on each layer, ensuring optimal conductivity. The via plating thickness is 20 μm, guaranteeing reliable connections. The surface finish is Electroless Nickel Immersion Gold (ENIG), offering excellent solderability and corrosion resistance. The top and bottom layers feature white silkscreen, while the solder mask is green. Silkscreen is forbidden onto solder pads to ensure optimal soldering. The PCB incorporates filled and capped vias, meeting IPC-4761 Type VII specifications. It also includes 100-ohm impedance control on the top layer with a 6mil trace, referencing L2. Castellated holes/half holes provide additional flexibility and connectivity. Each PCB undergoes a 100% electrical test prior to shipment, ensuring the highest quality and reliability.


5. PCB Statistics:
With 93 components and a total of 153 pads, including 78 through-hole pads, 39 top SMT pads, and 36 bottom SMT pads, this PCB offers ample space for your circuitry needs. It features 94 vias and supports 7 nets, enabling efficient connectivity and integration.


6. Artwork and Standards:
This PCB artwork is supplied in Gerber RS-274-X format, ensuring compatibility with various design tools. It adheres to the widely accepted IPC-Class-2 standard, guaranteeing high manufacturing and assembly quality.


7. Worldwide Availability:
Our PCB is available worldwide, allowing you to access top-notch quality regardless of your location. Whether you're working on a local project or require international shipping, we've got you covered.


8. Typical Applications:
This PCB is specifically designed for a wide range of applications, including automotive (engine room ECU), backplanes, data storage, server and networking, and telecommunications. Its versatility ensures it meets your specific requirements in these demanding fields.


9. Contact Information:
For any technical inquiries or further information, please don't hesitate to reach out to our dedicated team at


IT-180ATC ENIG HDI PCB Board  6-Layer With Blind Via And Buried Via 0

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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