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30mil Double Sided RO3035 RF PCB Board Ceramic PTFE Composite

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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30mil Double Sided RO3035 RF PCB Board Ceramic PTFE Composite

Detailed Product Description
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DK 3.5 PCB Material


Ceramic PTFE Composite RF PCB Board


30mil Double Sided RF PCB Board

Prepare to experience unparalleled performance and unwavering reliability with our latest shipment of cutting-edge PCBs. Meticulously engineered and crafted to perfection, our 2-layer rigid PCB is specifically offered to meet even the most demanding electronic requirements.


Key Features and Specifications:

1. PCB Material:
- Utilizes RO3035 ceramic PTFE composites with a DK value of 3.5
- Manufactured using a lead-free process for enhanced environmental sustainability
- Designed to operate flawlessly within a wide temperature range of -40℃ to +85℃


2. Stackup:
- Consists of a robust 2-layer rigid PCB configuration
- Boasts finished copper layers with a thickness of 35um
- The RO3035 dielectric layer measures 30 mil (0.762mm) for optimal insulation
- Additional layer of finished copper, also measuring 35um, ensures exceptional conductivity


3. Construction Details:
- Precisely engineered board with dimensions of 195mm x 98mm (1PCS), featuring a remarkable tolerance of +/- 0.15mm
- Minimum Trace/Space of 8/11 mils, allowing for intricate and precise circuit designs
- Minimum Hole Size of 0.3mm for accommodating various component requirements
- No blind or buried vias, ensuring a straightforward and efficient assembly process
- Boasts a finished board thickness of 0.8mm, striking the perfect balance between durability and flexibility
- Features a uniform finished Cu weight of 1 oz (1.4 mils) across all layers, ensuring consistent performance
- Via plating thickness of 1 mil, guaranteeing reliable electrical connections
- Surface finish with Immersion Gold, providing excellent corrosion resistance and facilitating solderability
- Top Silkscreen in crisp white for clear component labeling and easy identification
- No Bottom Silkscreen, maintaining a sleek and professional appearance
- Top and Bottom Solder Masks not present, allowing for customized soldering configurations
- Solder pads without silkscreen, promoting versatility and adaptability
- Rigorous 100% Electrical test employed to ensure optimal functionality


4. PCB Statistics:
- Boasts an impressive component count of 71, catering to complex circuit designs
- A total of 117 pads, providing ample connectivity options
- Includes 78 Thru Hole Pads for compatibility with diverse components
- Features 39 Top SMT Pads to accommodate surface-mounted devices
- Bottom SMT Pads are intentionally excluded to streamline the design
- Equipped with 78 Vias for seamless electrical connections
- Boasts 15 Nets for efficient signal routing and integrity


5. Artwork Supplied: Gerber RS-274-X, ensuring compatibility with industry-standard design tools


6. Accepted Standard: IPC-Class-2, adhering to rigorous quality and performance criteria


7. Service Area: Our exceptional services are available worldwide, catering to customers from all corners of the globe


For any technical inquiries or further information, please do not hesitate to contact Ivy at We take pride in our dedicated and knowledgeable team, always ready to assist you with any queries or concerns.


Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z   10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -45 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.11
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC
Surface Resistivity 107   COND A IPC
Tensile Modulus 1025
MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650
Specific Heat     j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 10.2   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

30mil Double Sided RO3035 RF PCB Board Ceramic PTFE Composite 0


RO3035: Unleashing the Power of the Revolutionary Ceramic PTFE Composite PCB


In the ever-evolving realm of electronics, there is an insatiable demand for high-performance printed circuit boards (PCBs). Enter RO3035, an extraordinary ceramic PTFE composite PCB that boasts unparalleled performance and unwavering reliability. This article delves deep into the remarkable features and capabilities of RO3035, providing valuable insights into its dielectric constant, dissipation factor, thermal coefficient of ε, dimensional stability, electrical properties, tensile modulus, thermal conductivity, and more. Join us on this exhilarating journey as we explore the immense potential of RO3035 and its profound impact on various industries.


Understanding the Dielectric Constant of RO3035: A Crucial Parameter for High-Frequency Applications
The dielectric constant of RO3035 plays a pivotal role in high-frequency signal propagation. With its precise value of 3.50±0.05, RO3035 ensures minimal signal loss and maximum efficiency. Designers and engineers can leverage this characteristic to achieve optimal performance in applications such as wireless communication, radar systems, and high-speed data transfer.


Dissipation Factor and Thermal Coefficient of ε: Ensuring Signal Integrity and Stability
To maintain signal integrity, RO3035 boasts an impressively low dissipation factor of 0.0015. This characteristic minimizes energy loss and preserves the integrity of high-frequency signals. Additionally, the thermal coefficient of ε (-45 ppm/℃) guarantees remarkable stability across temperature variations, rendering RO3035 suitable for environments exposed to extreme temperature ranges.


Dimensional Stability and Moisture Absorption: Crucial Considerations for Unwavering Performance
RO3035 exhibits exceptional dimensional stability, with a coefficient of thermal expansion of 17 ppm/℃ in the X-axis and Y-axis directions, and 24 ppm/℃ in the Z-axis direction. This ensures that the PCB maintains its structural integrity even under varying temperature conditions. Furthermore, with a moisture absorption rate of 0.04%, RO3035 remains impervious to humidity, ensuring consistent performance over extended periods.


Unveiling the Impressive Electrical Properties of RO3035: Volume and Surface Resistivity
RO3035 excels in electrical insulation and conductivity, boasting a volume resistivity of 10^7 MΩ.cm and surface resistivity of 10^7 MΩ. These exceptional properties enable reliable signal transmission while minimizing the risk of leakage or short circuits. Whether in high-voltage applications or low-power circuits, RO3035 delivers outstanding electrical performance.


Tensile Modulus and Copper Peel Strength: Enhancing Durability and Mechanical Performance
Mechanical durability is a crucial aspect of PCB design, and RO3035 surpasses expectations with its remarkable tensile modulus of 1025 MPa in the X-axis and 1006 MPa in the Y-axis. This ensures the PCB's ability to withstand mechanical stress, such as during assembly or in harsh operating conditions. Additionally, RO3035 exhibits a copper peel strength of 10.2 Ib/in., ensuring secure soldering and preventing delamination.


Thermal Conductivity and Coefficient of Thermal Expansion: Managing Heat Dissipation
Heat dissipation poses significant challenges in electronic systems, and RO3035 addresses this with its commendable thermal conductivity of 0.5 W/M/K. This property allows for efficient heat transfer, reducing the risk of overheating and maintaining optimal performance. The coefficient of thermal expansion (CTE) of RO3035, at 17 ppm/℃ in the X-axis and Y-axis directions and 24 ppm/℃ in the Z-axis direction, ensures structural stability even under temperature fluctuations.


In conclusion, RO3035 stands as a testament to the remarkable advancements in PCB technology. Its unique ceramic PTFE composite composition offers a harmonious blend of electrical and mechanical properties, making it an ideal choice for high-frequency applications that demand unwavering performance and reliability. As industries continue to evolve, RO3035 is positioned at the forefront, driving innovation and transforming the landscape of electronic systems. With its impressive features and immense potential, RO3035 is ready to unleash a new era of possibilities in the world of PCBs.


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30mil Double Sided RO3035 RF PCB Board Ceramic PTFE Composite 2

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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