Payment & Shipping Terms:
|Base Material:||RO4003C||PCB Size:||78 X 53 Mm=1PCS|
|Copper Weight:||1oz||Surface Finish:||Immersion Silver|
|Layer Count:||2 Layer||PCB Thickness:||20 Mil|
RO4003C PCB Material,
RF PCB Board 20mil,
Immersion Silver Surface PCB Material
Today, we are very honored to introduce to you Our newly shipped PCB. It has been designed to meet high-performance electronic needs, with top-quality materials like Rogers RO4003C and lead-free processing. It can operate between temperatures of -40℃ to +85℃, making it suitable for a wide range of applications.
The PCB's stack-up consists of a base copper layer of 17um, a 20mil dielectric layer, and another base copper layer of 17um. The minimum trace/space is 6/6 mils, and the minimum hole size is 12 mils. There are no blind or buried vias, and the finished board thickness is 0.6 mm. The finished Cu weight is 1 oz (1.4 mils) across all layers, with a via plating thickness of 1 mil. Immersion silver is used as the surface finish, with no top or bottom silkscreen or solder mask.
To ensure the PCB's quality, a 100% electrical test is utilized. It is recommended to fill the minimum via with copper paste for better thermal dissipation. Solder paste stencils are provided for the top side of the PCB.
The PCB is equipped with 31 components, 92 total pads, 51 thru-hole pads, 15 top SMT pads, and 26 bottom SMT pads. It also has 59 vias and 75 nets, making it suitable for complex electronic designs.
The board dimensions are 78 x 53 mm=1 pcs, +/- 0.15mm, and technical support is available for any questions or concerns. Ivy at email@example.com can be contacted for technical assistance. High-quality performance can be expected from the PCB for electronic needs.
Unlock the full potential of your PCBs with RO4003C
-Properties of RO4003C and how they affect PCB performance
RO4003C is a high-performance PCB material that has gained popularity among designers and manufacturers for its exceptional properties. In this article, we will explore the features of RO4003C, its benefits, and how it compares to other high-frequency PCB materials.
Understanding RO4003C and Its Uses in PCB Design
RO4003C is a ceramic-filled hydrocarbon laminate that boasts a dielectric constant of 3.38±0.05 and a dissipation factor of 0.0027, making it an ideal choice for high-frequency applications that require low loss and high-frequency performance. Additionally, RO4003C is an environmentally friendly option as it is lead-free process compatible.
How RO4003C's Properties Affect PCB Performance
The properties of RO4003C play a vital role in determining its performance as a PCB material. Its low loss and high-frequency performance make it an excellent choice for RF and microwave applications. Furthermore, its thermal coefficient of ε, which is +40 ppm/℃, makes it highly suitable for use in harsh environments.
Choosing the Right PCB Material: Comparing RO4003C to Other Options
Although other high-frequency PCB materials such as Rogers RT/duroid, Arlon AD300D, and Taconic TLC exist, RO4003C stands out for its low loss, high-frequency performance, and thermal management properties.
Design Considerations for RO4003C PCBs
Designers need to consider several factors when creating RO4003C PCBs, including impedance control, signal integrity, and thermal management. Impedance control is crucial to ensure consistent performance, while signal integrity is vital for reliable data transmission. Thermal management is also necessary to prevent overheating and ensure long-term reliability.
Manufacturing RO4003C PCBs: Overcoming Challenges and Best Practices
Manufacturing RO4003C PCBs can be difficult due to its unique properties. For instance, the material is brittle, making it prone to cracking during drilling and routing. Manufacturers can overcome these challenges by using specialized equipment and techniques, such as laser drilling and plasma cleaning. It is also advisable to fill the minimum via with copper paste for better thermal dissipation.
RO4003C for High-Speed Digital Designs: Ensuring Impedance Control and Signal Integrity
RO4003C is an excellent choice for high-speed digital designs that require impedance control and signal integrity. Its low loss and high-frequency performance ensure that signals can be transmitted over long distances without attenuation or distortion. Designers can use specialized software tools to calculate the required trace widths and spacing to achieve optimal impedance control.
RO4003C for RF/Microwave Designs: Ensuring Low Loss and High Frequency Performance
RO4003C is an ideal choice for RF and microwave designs that require low loss and high-frequency performance. Its dielectric constant and dissipation factor make it perfect for applications that require precise control over impedance and phase. Furthermore, its low thermal coefficient of ε ensures that its performance remains stable over a wide temperature range.
RO4003C for Harsh Environments: Ensuring Thermal Management and Reliability
RO4003C is also an excellent choice for applications that operate in harsh environments, where temperature, humidity, and vibration can be significant challenges. Its thermal management properties ensure that it can dissipate heat effectively, while its dimensional stability and high electrical strength ensure long-term reliability.
RO4003C in Aerospace and Defense Applications: Meeting Stringent Requirements
RO4003C is widely used in aerospace and defense applications, where stringent requirements for performance and reliability must be met. Its low loss and high-frequency performance make it ideal for communication and radar systems, while its high electrical strength and thermal management properties ensure that it can withstand extreme conditions.
The Future of RO4003C PCBs: Trends and Innovations in Materials and Design
As the demand for high-frequency and high-speed PCBs continues to grow, the future of RO4003C PCBs looks promising. Researchers are exploring new ways to improve the material's properties, such as reducing its dielectric constant and increasing its thermal conductivity. Additionally, new design techniques, such as 3D printing and flexible PCBs, are opening up new opportunities for RO4003C in various applications.
In conclusion, RO4003C is a high-performance PCB material that offers a wide range of benefits for various electronic applications. By understanding the properties of RO4003C and the design considerations involved in using it, designers and manufacturers can achieve optimal performance and reliability in their PCB designs.
Contact Person: Ms. Ivy Deng