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RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold
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RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-6.V1.0
Based Material:
AD1000
Layer Count:
2L
Thickness:
50mil
Surface:
Immersion Gold
Highlight:

AD1000 RF PCB Board

,

1.27mm RF Circuit Boards

,

Immersion Gold PCB Circuit Boards

Product Description

50mil AD1000 Immersion Gold RF PCB 1.27mm 2 Layer Circuit Boards

 

This style of PTFE/woven fiberglass/ceramic filled laminate AD1000 material is used to create immersion gold RF PCBs. The circuit board has finished 1oz copper in two layers. No silkscreen and solder mask. The layer is completely exposed in air. It is 50 vacuum-packed boards and the board thickness is 0.8mm.

 

AD1000 is widely use in Aircraft Collision Avoidance Systems (TCAS), Ground Based Radar Surveillance Systems, Low Noise Amplifiers (LNAs), Miniaturized Circuitry & Patch Antennas, Power Amplifiers (PAs), Radar Modules and Manifolds and X-Band and Below.

 

Typical property of AD1000

Property Units Value Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 10.2 IPC TM-650 2.5.5.5
Dissipation Factor
@ 1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 0.0023 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric -    
TCεr @ 10 GHz (-40-150°C) ppm/℃ -380 IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90 MΩ-cm 1.40x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 5.36x107 IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90 MΩ 1.80x109 IPC TM-650 2.5.17.1
E24/125 MΩ 3.16x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 622 (24.5) IPC TM-650 2.5.6.2
Dielectric Breakdown kV >45 IPC TM-650 2.5.6
Arc Resistance sec >180 IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial ℃ >500 IPC TM-650 2.4.24.6
5% ℃ >500 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/℃ 8, 10 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/℃ 20 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) %   IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress lb/in (N/mm) >12 (2.1) IPC TM-650 2.4.8
At Elevated Temperatures (150º) lb/in (N/mm) 13.6 (2.4) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm)   IPC TM-650 2.4.8
Young’s Modulus kpsi (GPa) 200 (1.38) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.9/7.5 (68/52) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.1/4.3 (35/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (GPa) >425 (>2.93) ASTM D-3410
Poisson’s Ratio - 0.16 ASTM D-3039
4. Physical Properties
Water Absorption % 0.03 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 3.20 ASTM D792 Method A
Thermal Conductivity W/mK 0.81 ASTM E1461
Flammability class Meets V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr %   NASA SP-R-0022A
Total Mass Loss % 0.01 NASA SP-R-0022A
Collected Volatiles % 0.00 NASA SP-R-0022A
Water Vapor Recovered % 0.00 NASA SP-R-0022A

 

RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold 0

 

RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold 1

 

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold
RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-6.V1.0
Based Material:
AD1000
Layer Count:
2L
Thickness:
50mil
Surface:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

AD1000 RF PCB Board

,

1.27mm RF Circuit Boards

,

Immersion Gold PCB Circuit Boards

Product Description

50mil AD1000 Immersion Gold RF PCB 1.27mm 2 Layer Circuit Boards

 

This style of PTFE/woven fiberglass/ceramic filled laminate AD1000 material is used to create immersion gold RF PCBs. The circuit board has finished 1oz copper in two layers. No silkscreen and solder mask. The layer is completely exposed in air. It is 50 vacuum-packed boards and the board thickness is 0.8mm.

 

AD1000 is widely use in Aircraft Collision Avoidance Systems (TCAS), Ground Based Radar Surveillance Systems, Low Noise Amplifiers (LNAs), Miniaturized Circuitry & Patch Antennas, Power Amplifiers (PAs), Radar Modules and Manifolds and X-Band and Below.

 

Typical property of AD1000

Property Units Value Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 10.2 IPC TM-650 2.5.5.5
Dissipation Factor
@ 1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 0.0023 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric -    
TCεr @ 10 GHz (-40-150°C) ppm/℃ -380 IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90 MΩ-cm 1.40x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 5.36x107 IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90 MΩ 1.80x109 IPC TM-650 2.5.17.1
E24/125 MΩ 3.16x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 622 (24.5) IPC TM-650 2.5.6.2
Dielectric Breakdown kV >45 IPC TM-650 2.5.6
Arc Resistance sec >180 IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial ℃ >500 IPC TM-650 2.4.24.6
5% ℃ >500 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/℃ 8, 10 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/℃ 20 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) %   IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress lb/in (N/mm) >12 (2.1) IPC TM-650 2.4.8
At Elevated Temperatures (150º) lb/in (N/mm) 13.6 (2.4) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm)   IPC TM-650 2.4.8
Young’s Modulus kpsi (GPa) 200 (1.38) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.9/7.5 (68/52) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.1/4.3 (35/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (GPa) >425 (>2.93) ASTM D-3410
Poisson’s Ratio - 0.16 ASTM D-3039
4. Physical Properties
Water Absorption % 0.03 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 3.20 ASTM D792 Method A
Thermal Conductivity W/mK 0.81 ASTM E1461
Flammability class Meets V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr %   NASA SP-R-0022A
Total Mass Loss % 0.01 NASA SP-R-0022A
Collected Volatiles % 0.00 NASA SP-R-0022A
Water Vapor Recovered % 0.00 NASA SP-R-0022A

 

RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold 0

 

RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold 1

 

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

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6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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