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Product Details:
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| Base Material: | Glass-reinforced, PTFE Based Composites | Layer Count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
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| PCB Thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) | PCB Size: | ≤400mm X 500mm |
| Solder Mask: | Green, Black, Blue, Yellow, Red Etc. | Copper Weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface Finish: | Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Pure Gold Plated Etc.. | ||
| High Light: | PCB Board With High Frequency Antenna,Immersion Silver Multilayer RF PCB,AD255C RF PCB Board |
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AD255C High Frequency Antenna PCB 20mil 30mil 40mil 60mil Thickness With Immersion Gold, Immersion Silver
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General description
Rogers' AD255C substrates are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today's wireless antenna markets. They are glass-reinforced, PTFE based composites that provide controlled dielectric constant, low loss performance, and very good passive intermodulation (PIM) performance. AD255C has dielectric constant of 2.55, dissipation factor of 0.0013 at 10 GHz with ED copper and reverse treat copper. They are available from 20 mils to 125 mils.
PCB Capability (AD255C)
| PCB Material: | Glass-reinforced, PTFE based Composites |
| Designation: | AD255C |
| Dielectric constant: | 2.55 (10 GHz) |
| Dissipation Factor | 0.0013 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Typical Applications
Automotive telematics antenna systems
Cellular infrastructure base station antenna
Commercial satellite radio antenna
Typical Value of AD255C
| Electrical Properties | AD255C | Units | Test Conditions | Test Method | |
| PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
| Dielectric Constant (process) | 2.55 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
| Dielectric Constant (design) | 2.60 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
| Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant | -110 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 7.4 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 3.6 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) | 911 | V/mil | - | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
| Thermal Properties | |||||
| Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 34 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 26 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.35 | W/mK | - | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | |||||
| Copper Peel Strength after Thermal Stress | 2.4 (13.6) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
| Tensile Strength (MD/CMD) | 8.1/6.6 (55.8/45.5) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
| Flex Modulus (MD/CMD) | 930/818 (6,412/5,640) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
| Dimensional Stability (MD/CMD) | 0.03/0.07 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
| Physical Properties | |||||
| Flammability | V-0 | - | - | - | UL-94 |
| Moisture Absorption | 0.03 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
| Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
| Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
About Us
We are an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 19 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.
Our advantages
1. Powerful PCB capabilities support your research and development, sales and marketing;
2. PCB Products and Manufacturing are certified by authorized organizations;
3. 16000㎡ workshop with 30000㎡ output capability and 8000 types of PCB's per month;
4. Quick CADCAM checking and free PCB quotation;
5. No minimum order quantity. 1 piece is available;
6. A Team with passion, discipline, responsibility and honesty;
7. More than 19+ years of high frequency PCB experience;
8. Prototype PCB capability to Volume Production capability;
9. Delivery on time: >98%, Customer complaint rate: <1%
10. IPC Class 2 / IPC Class 3;
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
