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RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon

RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-185.V1.0
Base Material:
Ceramic-filled, Glass-reinforced Hydrocarbon
Layer Count:
Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP Etc..
Highlight:

UL Printed RF PCB Board

,

60mil Antenna RF PCB Board

,

Glass Reinforced Hydrocarbon RF PCB

Product Description

 

RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

RO4533 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

 

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

 

Features and Benefits

1. Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

 

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

 

RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon 0

 

Our PCB Capability (RO4533)

PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4533
Dielectric constant: 3.3
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

RO4533 Typical Values

Property RO4533 Direction Units Condition Test Method
Dielectric Constant, er Process 3.3 ± 0.08 Z - 10 GHz/23 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.002 Z - 2.5 GHz/23 IPC-TM-650, 2.5.5.5
0.0025 10 GHz/23
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.2 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 13 X ppm/ -55 to 288 IPC-TM-650, 2.4.41
11 Y
37 Z
Thermal Conductivity 0.6 - W/(m.K) 80 ASTM C518
Moisture Absorption 0.02 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - TMA A IPC-TM-650, 2.4.24.3
Density 1.8 - gm/cm3 - ASTM D792
Copper Peel Strength 6.9 (1.2) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -

 

RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon 1

 

products
PRODUCTS DETAILS
RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-185.V1.0
Base Material:
Ceramic-filled, Glass-reinforced Hydrocarbon
Layer Count:
Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:
20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

UL Printed RF PCB Board

,

60mil Antenna RF PCB Board

,

Glass Reinforced Hydrocarbon RF PCB

Product Description

 

RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

RO4533 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

 

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

 

Features and Benefits

1. Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

 

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

 

RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon 0

 

Our PCB Capability (RO4533)

PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4533
Dielectric constant: 3.3
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

RO4533 Typical Values

Property RO4533 Direction Units Condition Test Method
Dielectric Constant, er Process 3.3 ± 0.08 Z - 10 GHz/23 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.002 Z - 2.5 GHz/23 IPC-TM-650, 2.5.5.5
0.0025 10 GHz/23
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.2 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 13 X ppm/ -55 to 288 IPC-TM-650, 2.4.41
11 Y
37 Z
Thermal Conductivity 0.6 - W/(m.K) 80 ASTM C518
Moisture Absorption 0.02 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - TMA A IPC-TM-650, 2.4.24.3
Density 1.8 - gm/cm3 - ASTM D792
Copper Peel Strength 6.9 (1.2) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -

 

RO4533 UL Printed 60mil Antenna RF PCB Board Glass Reinforced Hydrocarbon 1

 

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