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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-508.V1.0

Base Material:

High Temperature Resin

Layer Count:

Double Layer, Multilayer, Hybrid PCB

PCB Thickness:

0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm

PCB Size:

≤400mm X 500mm

Solder Mask:

Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.

Copper Weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)

Surface Finish:

Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..

Highlight:

Resin Backplane Pcb Circuit Board

0.6mm Thickness Pcb Circuit Board

IATF16949 Pcb Circuit Board

Product Description

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

Typical Properties of TU-883

	Typical Values	Test Condition	SPEC
Thermal
Tg (DMA)	220 °C
Tg (TMA)	170 °C	E-2/105+des	N/A
Td (TGA)	420 °C
CTE z-axis α1	35 ppm/°C	Pre-Tg	< 60 ppm/°C
CTE z-axis α2	240 ppm/°C	Post-Tg	< 300 ppm/°C
CTE z-axis	2.50%	50 to 260°C	< 3.0%
Thermal Stress, Solder Float, 288°C	> 60 sec	A	> 10 sec
T-260	> 60 min		> 30 min
T-288	> 60 min	E-2/105+des	> 15 min
T-300	> 60 min
Flammability	94V-0	E-24/125+des	94V-0
Electrical
Permittivity (RC63%)
1GHz (SPC method)	3.60
5GHz (SPC method)	3.58	C-24/23/50	N/A
10GHz (SPC method)	3.57
Loss Tangent (RC63%)
1GHz (SPC method)	0.0030
5GHz (SPC method)	0.0037	C-24/23/50	N/A
10GHz (SPC method)	0.0046
Volume Resistivity	> 10¹⁰ MΩ•cm	C-96/35/90	> 106 MΩ•cm
Surface Resistivity	> 10⁸ MΩ	C-96/35/90	> 104 MΩ
Electric Strength	> 40 KV/mm	-	> 30 KV/mm
Dielectric Breakdown Voltage	> 50 KV	-	> 40 KV
Mechanical
Young’s Modulus
Warp Direction	28 GPa	A	N/A
Fill Direction	26 GPa
Flexural Strength
Lengthwise	> 60,000 psi	A	> 60,000 psi
Crosswise	> 50,000 psi	A	> 50,000 psi
Peel Strength, 1.0 oz. Cu foil	4~6 lb/in	A	> 4 lb/in
Water Absorption	0.08%	E-1/105+des+D-24/23	< 0.8 %

Performance and Processing Advantages

Excellent electrical properties

Dielectric constant less than 4.0

Dissipation factor less than 0.005

Stable and flat Dk/Df performance over frequency and temperature

Compatible with modified FR-4 processes

Excellent moisture resistance and Lead Free reflow process compatible

Improved z-axis thermal expansion

Anti-CAF capability

Excellent through-hole and soldering reliability

Halogen Free

Our PCB Capabilities (TU-883)

PCB Material:	High Temperature Resin
Designation:	TU-883
Dielectric constant:	3.60 at 1GHz
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness:	0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:	HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB 0

Applications

Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB 1

Tags:

FR4 PCB Board,

6 Layer FR4 PCB Board,

Mobile Broadband Gold Finger PCB

Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold

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