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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB
Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Large Image :  Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-508.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: High Temperature Resin Layer Count: Double Layer, Multilayer, Hybrid PCB
PCB Thickness: 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish: Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
High Light:

Resin Backplane Pcb Circuit Board

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0.6mm Thickness Pcb Circuit Board

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IATF16949 Pcb Circuit Board

 

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

 

Applications

Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers

 

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB 0

 

Performance and Processing Advantages

Excellent electrical properties

Dielectric constant less than 4.0

Dissipation factor less than 0.005

Stable and flat Dk/Df performance over frequency and temperature

Compatible with modified FR-4 processes

Excellent moisture resistance and Lead Free reflow process compatible

Improved z-axis thermal expansion

Anti-CAF capability

Excellent through-hole and soldering reliability

Halogen Free

 

Our PCB Capabilities (TU-883)

PCB Material: High Temperature Resin
Designation: TU-883
Dielectric constant: 3.60 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Typical Properties of TU-883

  Typical Values Test Condition SPEC
Thermal      
Tg (DMA) 220 °C    
Tg (TMA) 170 °C E-2/105+des N/A
Td (TGA) 420 °C    
CTE z-axis α1 35 ppm/°C Pre-Tg < 60 ppm/°C
CTE z-axis α2 240 ppm/°C Post-Tg < 300 ppm/°C
CTE z-axis 2.50% 50 to 260°C < 3.0%
Thermal Stress, Solder Float, 288°C > 60 sec A > 10 sec
T-260 > 60 min   > 30 min
T-288 > 60 min E-2/105+des > 15 min
T-300 > 60 min    
Flammability 94V-0 E-24/125+des 94V-0
Electrical      
Permittivity (RC63%)      
1GHz (SPC method) 3.60    
5GHz (SPC method) 3.58 C-24/23/50 N/A
10GHz (SPC method) 3.57    
Loss Tangent (RC63%)      
1GHz (SPC method) 0.0030    
5GHz (SPC method) 0.0037 C-24/23/50 N/A
10GHz (SPC method) 0.0046    
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm - > 30 KV/mm
Dielectric Breakdown Voltage > 50 KV - > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 28 GPa A N/A
Fill Direction 26 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz. Cu foil 4~6 lb/in A > 4 lb/in
Water Absorption 0.08% E-1/105+des+D-24/23 < 0.8 %

 

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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