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Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance
  • name
  • name
  • name
  • name

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-500.V1.0
Base Material:
High Performance Modified Epoxy FR-4 Resin
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
Surface Finish:
HDI, Via In Pad, Impedance Control, Blind Via/Buried Via, Edge Plating, BGA, Countsunk Holes Etc.
Highlight:

Low Dk FR4 PCB Board

,

Multilayer FR4 PCB Board

,

High Performance FR4 PCB Board

Product Description

 

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

 

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance 0

 

Key Features

1. Excellent electrical properties

2. Dielectric constant less than 3.5

3. Dissipation factor less than 0.010

4. Excellent, stable and flat Dk/Df performance

5. Compatible with most FR-4 processes

6. Lead free process compatible

7. Improved z-axis thermal expansion

8. Anti-CAF capability

9. Superior dimensional stability, thickness uniformity and flatness

10. Excellent through-hole and soldering reliability

 

Our PCB Capabilities (TU-872 SLK Sp)

PCB Material: High performance modified epoxy FR-4 resin
Designation: TU-872 SLK Sp
Dielectric constant: < 3.5
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Main Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

 

Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡ workshop;

30000㎡ output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98%

Customer complaint rate: <1%

 

Typical Properties (TU-872 SLK Sp)

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 220°C    
Tg (DSC) 200°C   > 170°C
Tg (TMA) 190°C E-2/105  
Td (TGA) 340°C   > 340°C
CTE x-axis 12~15 ppm/°C   N/A
CTE y-axis 12~15 ppm/°C E-2/105 N/A
CTE z-axis 2.30%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 60 min   > 30 min
T288 20 min E-2/105 > 15 min
T300 5 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 3.5    
Loss Tangent (RC 50%) @10GHz 0.008    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 3.6/3.4   < 5.2
5GHz (SPC method) 3.5 E-2/105 -
10GHz (SPC method) 3.5   -
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.006/0.004    
5GHz (SPC method) 0.007 E-2/105 < 0.035
10GHz (SPC method) 0.008    
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 kV/mm
Dielectric Breakdown > 50 kV A N/A
Mechanical      
Young’s Modulus      
Warp Direction 26 GPa A N/A
Fill Direction 24 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 4~7 lb/in A > 4 lb/in
Water Absorption 0.13% E-1/105+D-24/23 < 0.5 %

 

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance 1

 

Tags: 

FR4 PCB Board,  

6 Layer FR4 PCB Board,  

Mobile Broadband Gold Finger PCB

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance
  • name
  • name
  • name
  • name
Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-500.V1.0
Base Material:
High Performance Modified Epoxy FR-4 Resin
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
Surface Finish:
HDI, Via In Pad, Impedance Control, Blind Via/Buried Via, Edge Plating, BGA, Countsunk Holes Etc.
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Low Dk FR4 PCB Board

,

Multilayer FR4 PCB Board

,

High Performance FR4 PCB Board

Product Description

 

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

 

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance 0

 

Key Features

1. Excellent electrical properties

2. Dielectric constant less than 3.5

3. Dissipation factor less than 0.010

4. Excellent, stable and flat Dk/Df performance

5. Compatible with most FR-4 processes

6. Lead free process compatible

7. Improved z-axis thermal expansion

8. Anti-CAF capability

9. Superior dimensional stability, thickness uniformity and flatness

10. Excellent through-hole and soldering reliability

 

Our PCB Capabilities (TU-872 SLK Sp)

PCB Material: High performance modified epoxy FR-4 resin
Designation: TU-872 SLK Sp
Dielectric constant: < 3.5
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Main Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

 

Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡ workshop;

30000㎡ output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98%

Customer complaint rate: <1%

 

Typical Properties (TU-872 SLK Sp)

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 220°C    
Tg (DSC) 200°C   > 170°C
Tg (TMA) 190°C E-2/105  
Td (TGA) 340°C   > 340°C
CTE x-axis 12~15 ppm/°C   N/A
CTE y-axis 12~15 ppm/°C E-2/105 N/A
CTE z-axis 2.30%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 60 min   > 30 min
T288 20 min E-2/105 > 15 min
T300 5 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 3.5    
Loss Tangent (RC 50%) @10GHz 0.008    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 3.6/3.4   < 5.2
5GHz (SPC method) 3.5 E-2/105 -
10GHz (SPC method) 3.5   -
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.006/0.004    
5GHz (SPC method) 0.007 E-2/105 < 0.035
10GHz (SPC method) 0.008    
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 kV/mm
Dielectric Breakdown > 50 kV A N/A
Mechanical      
Young’s Modulus      
Warp Direction 26 GPa A N/A
Fill Direction 24 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 4~7 lb/in A > 4 lb/in
Water Absorption 0.13% E-1/105+D-24/23 < 0.5 %

 

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance 1

 

Tags: 

FR4 PCB Board,

6 Layer FR4 PCB Board,

Mobile Broadband Gold Finger PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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