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Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance
Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

Large Image :  Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-500.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: High Performance Modified Epoxy FR-4 Resin Layer Count: Double Layer, Multilayer, Hybrid PCB
PCB Thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm) PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
Surface Finish: HDI, Via In Pad, Impedance Control, Blind Via/Buried Via, Edge Plating, BGA, Countsunk Holes Etc.
High Light:

Low Dk FR4 PCB Board

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Multilayer FR4 PCB Board

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High Performance FR4 PCB Board

 

Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

 

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance 0

 

Key Features

1. Excellent electrical properties

2. Dielectric constant less than 3.5

3. Dissipation factor less than 0.010

4. Excellent, stable and flat Dk/Df performance

5. Compatible with most FR-4 processes

6. Lead free process compatible

7. Improved z-axis thermal expansion

8. Anti-CAF capability

9. Superior dimensional stability, thickness uniformity and flatness

10. Excellent through-hole and soldering reliability

 

Our PCB Capabilities (TU-872 SLK Sp)

PCB Material: High performance modified epoxy FR-4 resin
Designation: TU-872 SLK Sp
Dielectric constant: < 3.5
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Main Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

 

Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡ workshop;

30000㎡ output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98%

Customer complaint rate: <1%

 

Typical Properties (TU-872 SLK Sp)

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 220°C    
Tg (DSC) 200°C   > 170°C
Tg (TMA) 190°C E-2/105  
Td (TGA) 340°C   > 340°C
CTE x-axis 12~15 ppm/°C   N/A
CTE y-axis 12~15 ppm/°C E-2/105 N/A
CTE z-axis 2.30%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 60 min   > 30 min
T288 20 min E-2/105 > 15 min
T300 5 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 3.5    
Loss Tangent (RC 50%) @10GHz 0.008    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 3.6/3.4   < 5.2
5GHz (SPC method) 3.5 E-2/105 -
10GHz (SPC method) 3.5   -
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.006/0.004    
5GHz (SPC method) 0.007 E-2/105 < 0.035
10GHz (SPC method) 0.008    
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 kV/mm
Dielectric Breakdown > 50 kV A N/A
Mechanical      
Young’s Modulus      
Warp Direction 26 GPa A N/A
Fill Direction 24 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 4~7 lb/in A > 4 lb/in
Water Absorption 0.13% E-1/105+D-24/23 < 0.5 %

 

Low Dk Printed Circuit Multilayer FR4 PCB Board High Performance 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)