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Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold

Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold
Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold

Large Image :  Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-503.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 TU-768 PCB Thickness: 1.18-1.21mm
Copper Weight: 35um Surface Finish: Immersion Gold
High Light:

Multilayer High Tg FR4 PCB Board

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1.2mm FR4 PCB Board

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Immersion Gold PCB Board

 

High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of High-Tg 4-layer PCB Built on TU-768 material. Each layer is plated with 1oz copper. Soldering pads are coated with immersion gold and non-pads are with green solder mask. The panel consists of 16 boards with a size of 320 x 280mm. The core is 0.8mm thick, finished PCB achieves 1.2mm thick.

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold 0

 

PCB Specifications

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 TU-768 FR-4 TU-768 ACC
Tg 170 170 ACC
Supplier Taiwan Union (TU) Taiwan Union (TU) ACC
Thickness 1.2±10% mm 1.18-1.21mm ACC
2.Plating thickness Hole Wall 25µm 26.15µm ACC
Outer copper 35µm 37.85µm ACC
Inner Copper 30µm 31.15µm ACC
3.Solder mask Material Type TAIYO/ PSR-2000GT600D PSR-2000GT600D ACC
Color Green Green ACC
Rigidity (Pencil Test) 4H or above 5H ACC
S/M Thickness 10µm 19.55µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S, S/S C/S, S/S ACC
5. Peelable Solder Mask Material Type      
Thickness      
Location      
6. Identification UL Mark YES YES ACC
Date Code WWYY 0421 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness      
Nickel Thickness 3-6µm 5.27µm ACC
Gold Thickness 0.05µm 0.065µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 6mil 5.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove Angle 30±5º 30º ACC
Residual thickness 0.4±0.1mm 0.39mm ACC
11. Beveling Angle      
Height      
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.7% 0.32% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5 OK ACC
Thermal Stress Test 288 ±5 OK ACC
Ionic Contamination Test 1.56 µg/c 0.58µg/c ACC

 

Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡ workshop;

30000㎡ output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98%

Customer complaint rate: <1%

 

Our PCB Capability (2022)

 Layer Counts  1-32
 Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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