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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm
Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

Large Image :  Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-506.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: High Tg, Lead Free High Reliability Epoxy Resin Layer Count: Double Layer, Multilayer, Hybrid PCB
PCB Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish: Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
High Light:

Multi Layer FR4 PCB Board

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Lead Free PCB Printed Circuit Board

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400mmX500mm Printed Circuit Board

 

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.

 

Applications

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper

 

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm 0

 

Key Features

Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability

 

Our PCB Capability (IT-180ATC)

PCB Material: High Tg, Lead Free High Reliability Epoxy Resin
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

General Properties of IT-180ATC

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8   lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content)     --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content)     --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum     N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction   410-440
Thermal Stress 10 s at 288°C      
A. Unetched 2.4.13.1 Pass Rating
B. Etched   Pass  
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE      
A. Alpha 1   45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C   2.7 %
Thermal Resistance      
A. T260 2.4.24.1 >60 Minutes
B. T288   20 Minutes

 

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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