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TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated
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TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated
  • name
  • name
  • name
  • name

TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-502.V1.0
Base Material:
High-Tg And High Thermal Reliability Epoxy Resin
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
Highlight:

Lead Free Multilayer Printed Circuit Board

,

E Glass Coated Printed Circuit Board

,

Hybrid PCB Printed Circuit Board

Product Description

 

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

 

TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated 0

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

 

Our PCB Capability (TU-768)

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg High-Tg and High Thermal Reliability Epoxy Resin
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated 1

 

Typical Properties of TU-768

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 190°C    
Tg (DSC) 180°C   > 170°C
Tg (TMA) 170°C E-2/105  
Td (TGA) 350°C   > 340°C
CTE x-axis 11~15 ppm/°C   N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min   > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 4.3    
Loss Tangent (RC 50%) @10GHz 0.018    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 4.4 / 4.3   < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3   N/A
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.019 /0.018   < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023   N/A
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %

 

Tags: 

FR4 PCB Board,  

6 Layer FR4 PCB Board,  

Mobile Broadband Gold Finger PCB

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Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated
  • name
  • name
  • name
  • name
TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-502.V1.0
Base Material:
High-Tg And High Thermal Reliability Epoxy Resin
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Lead Free Multilayer Printed Circuit Board

,

E Glass Coated Printed Circuit Board

,

Hybrid PCB Printed Circuit Board

Product Description

 

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

 

TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated 0

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

 

Our PCB Capability (TU-768)

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg High-Tg and High Thermal Reliability Epoxy Resin
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

TU-768 Lead Free PCB Multilayer Printed Circuit Board glass coated 1

 

Typical Properties of TU-768

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 190°C    
Tg (DSC) 180°C   > 170°C
Tg (TMA) 170°C E-2/105  
Td (TGA) 350°C   > 340°C
CTE x-axis 11~15 ppm/°C   N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min   > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 4.3    
Loss Tangent (RC 50%) @10GHz 0.018    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 4.4 / 4.3   < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3   N/A
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.019 /0.018   < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023   N/A
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %

 

Tags: 

FR4 PCB Board,

6 Layer FR4 PCB Board,

Mobile Broadband Gold Finger PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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