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Product Details:
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| Base Material: | FR-4 | Layer Count: | 12 Layers |
|---|---|---|---|
| PCB Thickness: | 2.0mm ±10% | PCB Size: | 257 X 171.5mm=1PCS=1design |
| Solder Mask: | Green | Silkscreen: | White |
| Copper Weight: | 1oz | Surface Finish: | Immersion Gold |
| High Light: | Impedance Controlled 12 Layer PCB,FR4 Material 12 Layer PCB,2.0mm Via In Pad PCB |
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Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
1.1 General description
This is a type of impedance controlled PCB built on FR-4 material with Tg 175°C for the application of Signal transmission. It's a 12-layer board with 2.0 mm thick. It contains 2+N+2 HDI vias (see the stackup & vias). White silkscreens (Taiyo) are on green solder mask (Taiyo) and immersion gold on pads. Both Signal trace impedance and differential pairs impedance are controlled on layers. See the drawing below. The base material is from ITEQ. Entire panel is supplying with single up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.
Signal Trace Impedance Control
| Trace Layer | Trace Width (mil) | Trace Impedance (Ohm) | Precision | Reference Layer |
| Top Layer | 4 | 50 | ±10% | Mid-Layer 1 |
| L03, Mid-Layer 2 | 4 | 50 | ±10% | Mid-Layer 1 |
| L10, Mid-Layer 9 | 4 | 50 | ±10% | Mid-Layer 7, Mid-Layer 10 |
| Bottom Layer | 4 | 50 | ±10% | Mid-Layer 10 |
Differential Pairs Impedance Control
| Layer | Trace Width / Space (Mil) | Trace Impedance (Ohm) | Precision | Frequency (MHz) |
| Top Layer | 3.1 / 5.5 | 100 | ±10% | Mid-Layer 1 |
| Top Layer | 4.0 / 5.1 | 90 | ±10% | Mid-Layer 1 |
| L03, Mid-Layer 2 | 3.1 / 5.9 | 100 | ±10% | Mid-Layer 1, Mid-Layer 4 |
| L06, Mid-Layer 5 | 4.0 / 7.4 | 100 | ±10% | Mid-Layer 4, Mid-Layer 6 |
| L06, Mid-Layer 5 | 4.0 / 4.7 | 90 | ±10% | Mid-Layer 4, Mid-Layer 6 |
| L07, ,Mid-Layer 6 | 4.0 / 7.4 | 100 | ±10% | Mid-Layer 5, Mid-Layer 7 |
| L07, ,Mid-Layer 6 | 4.0 / 4.7 | 90 | ±10% | Mid-Layer 5, Mid-Layer 7 |
| L10, Mid-Layer 9 | 3.1 / 5.9 | 100 | ±10% | Mid-Layer 7, Mid-Layer 10 |
| Bottom Layer | 4.0 / 5.5 | 100 | ±10% | Mid-Layer 10 |
| Bottom Layer | 4.0 / 5.1 | 90 | ±10% | Mid-Layer 10 |
1.2 Features and benefits
Lead free assemblies with a maximum reflow temperature of 260℃.
Long storage time ( It can be stored for more than 1 year in vacuum bag)
Improved the speed of signal transmission
PCB manufacturing on required specifications.
Quick and on-time delivery
UL recognized and RoHS Directive-compliant
Prototype PCB capability
1.3 Applications
Solar Battery Charger
GPS Receiver
Wi Fi Antenna
USB Wireless Router
Phone systems
1.4 Parameter and data sheet
| PCB SIZE | 257 x 171.5mm=1PCS=1design |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 12 Layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- TOP 17um(1oz)+plate 25um |
| 130 um prepreg 1080 x 2 | |
| copper ------- L02 32um(1oz) | |
| 150um core FR-4 | |
| copper ------- L03 18um(0.5oz) | |
| 130 um prepreg 1080 x 2 | |
| copper ------- L04 18um(0.5oz) | |
| 150um core FR-4 | |
| copper ------- L05 18um(0.5oz) | |
| 130 um prepreg 1080 x 2 | |
| copper ------- L06 18um(0.5oz) | |
| 813um core FR-4 | |
| copper ------- L07 18um(0.5oz) | |
| 130 um prepreg 1080 x 2 | |
| copper ------- L08 18um(0.5oz) | |
| 150um core FR-4 | |
| copper ------- L09 18um(0.5oz) | |
| 130 um prepreg 1080 x 2 | |
| copper ------- L10 18um(0.5oz) | |
| 150um core FR-4 | |
| copper ------- L11 35um(1oz) | |
| 130 um prepreg 1080 x 2 | |
| copper ------- BOT 17um(0.5oz)+plate 25um | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.25 mm / 3.0 mm |
| Number of Different Holes: | 26 |
| Number of Drill Holes: | 4013 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | Single Signal Impedance and Differential Pairs Impedance |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180, Tg>175℃, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 2.0mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel) |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. Vin in pad under BGA package |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 Impedance PCB and Impedance Match
The characteristic impedance of the conductor on the printed circuit board is an important indicator of the circuit design, especially in the PCB design of high frequency circuit. Whether the characteristic impedance of the conductor is consistent and matching with the characteristic impedance required by the device or signal must be taken into consideration. Therefore, these two concepts in reliability design of PCB design must be paid attention.
There will be a variety of signal transmission in the conductor of circuit board. To increase the rate of transmission, it must increase its frequency. Due to the factors of the circuit itself such as etching, stack thickness, track width and so on are different, it will cause changes of the impedance value, resulting in its signal distortion. Therefore, the impedance value of conductor on high-speed circuit board should be controlled within a certain range, known as the "impedance control". The factors that affect the impedance of the PCB wiring are mainly the width of the copper track, the thickness of the copper track, the dielectric constant of the dielectric, the thickness of the dielectric, the thickness of the pad, the path of the ground layer, the wires around the wiring, etc. So the impedance of the wiring on the board must be controlled in the design of the PCB to avoid signal reflection and other electromagnetic interference and signal integrity issues as far as possible, to guarantee the stability of the actual use of the PCB board. You can refer to the corresponding empirical formula for the calculation method of micro-strip line and strip line impedance on PCB board.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
