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Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4
Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4 Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4 Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4 Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4 Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

Large Image :  Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-476.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 12 Layers
PCB Thickness: 2.0mm ±10% PCB Size: 257 X 171.5mm=1PCS=1design
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

Impedance Controlled 12 Layer PCB

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FR4 Material 12 Layer PCB

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2.0mm Via In Pad PCB

 

Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

1.1 General description

This is a type of impedance controlled PCB built on FR-4 material with Tg 175°C for the application of Signal transmission. It's a 12-layer board with 2.0 mm thick. It contains 2+N+2 HDI vias (see the stackup & vias). White silkscreens (Taiyo) are on green solder mask (Taiyo) and immersion gold on pads. Both Signal trace impedance and differential pairs impedance are controlled on layers. See the drawing below. The base material is from ITEQ. Entire panel is supplying with single up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.

 

Signal Trace Impedance Control

Trace Layer Trace Width (mil) Trace Impedance (Ohm) Precision Reference Layer
Top Layer 4 50 ±10% Mid-Layer 1
L03, Mid-Layer 2 4 50 ±10% Mid-Layer 1
L10, Mid-Layer 9 4 50 ±10% Mid-Layer 7, Mid-Layer 10
Bottom Layer 4 50 ±10% Mid-Layer 10

 

Differential Pairs Impedance Control

Layer Trace Width / Space (Mil) Trace Impedance (Ohm) Precision Frequency (MHz)
Top Layer 3.1 / 5.5 100 ±10% Mid-Layer 1
Top Layer 4.0 / 5.1 90 ±10% Mid-Layer 1
L03, Mid-Layer 2 3.1 / 5.9 100 ±10% Mid-Layer 1, Mid-Layer 4
L06, Mid-Layer 5 4.0 / 7.4 100 ±10% Mid-Layer 4, Mid-Layer 6
L06, Mid-Layer 5 4.0 / 4.7 90 ±10% Mid-Layer 4, Mid-Layer 6
L07, ,Mid-Layer 6 4.0 / 7.4 100 ±10% Mid-Layer 5, Mid-Layer 7
L07, ,Mid-Layer 6 4.0 / 4.7 90 ±10% Mid-Layer 5, Mid-Layer 7
L10, Mid-Layer 9 3.1 / 5.9 100 ±10% Mid-Layer 7, Mid-Layer 10
Bottom Layer 4.0 / 5.5 100 ±10% Mid-Layer 10
Bottom Layer 4.0 / 5.1 90 ±10% Mid-Layer 10

 

1.2 Features and benefits

Lead free assemblies with a maximum reflow temperature of 260℃.

Long storage time ( It can be stored for more than 1 year in vacuum bag)

Improved the speed of signal transmission

PCB manufacturing on required specifications.

Quick and on-time delivery

UL recognized and RoHS Directive-compliant

Prototype PCB capability

 

Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4 0

 

1.3 Applications

Solar Battery Charger

GPS Receiver

Wi Fi Antenna

USB Wireless Router

Phone systems

 

1.4 Parameter and data sheet

PCB SIZE 257 x 171.5mm=1PCS=1design
BOARD TYPE Multilayer PCB
Number of Layers 12 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- TOP 17um(1oz)+plate 25um
130 um prepreg 1080 x 2
copper ------- L02 32um(1oz)
150um core FR-4
copper ------- L03 18um(0.5oz)
130 um prepreg 1080 x 2
copper ------- L04 18um(0.5oz)
150um core FR-4
copper ------- L05 18um(0.5oz)
130 um prepreg 1080 x 2
copper ------- L06 18um(0.5oz)
813um core FR-4
copper ------- L07 18um(0.5oz)
130 um prepreg 1080 x 2
copper ------- L08 18um(0.5oz)
150um core FR-4
copper ------- L09 18um(0.5oz)
130 um prepreg 1080 x 2
copper ------- L10 18um(0.5oz)
150um core FR-4
copper ------- L11 35um(1oz)
130 um prepreg 1080 x 2
copper ------- BOT 17um(0.5oz)+plate 25um
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.25 mm / 3.0 mm
Number of Different Holes: 26
Number of Drill Holes: 4013
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control Single Signal Impedance and Differential Pairs Impedance
BOARD MATERIAL  
Glass Epoxy: FR-4, ITEQ IT-180, Tg>175, er<5.4
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 2.0mm ±10%
PLATING AND COATING  
Surface Finish Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented. Vin in pad under BGA package
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4 1

 

1.5 Impedance PCB and Impedance Match

 

The characteristic impedance of the conductor on the printed circuit board is an important indicator of the circuit design, especially in the PCB design of high frequency circuit. Whether the characteristic impedance of the conductor is consistent and matching with the characteristic impedance required by the device or signal must be taken into consideration. Therefore, these two concepts in reliability design of PCB design must be paid attention.

 

There will be a variety of signal transmission in the conductor of circuit board. To increase the rate of transmission, it must increase its frequency. Due to the factors of the circuit itself such as etching, stack thickness, track width and so on are different, it will cause changes of the impedance value, resulting in its signal distortion. Therefore, the impedance value of conductor on high-speed circuit board should be controlled within a certain range, known as the "impedance control". The factors that affect the impedance of the PCB wiring are mainly the width of the copper track, the thickness of the copper track, the dielectric constant of the dielectric, the thickness of the dielectric, the thickness of the pad, the path of the ground layer, the wires around the wiring, etc. So the impedance of the wiring on the board must be controlled in the design of the PCB to avoid signal reflection and other electromagnetic interference and signal integrity issues as far as possible, to guarantee the stability of the actual use of the PCB board. You can refer to the corresponding empirical formula for the calculation method of micro-strip line and strip line impedance on PCB board.

 

Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4 2

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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