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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask
Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

Large Image :  Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-455.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 2 Layers
PCB Thickness: 1.6+/-10% MM PCB Size: 65 X 71mm=1UP
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Electrolytic Gold
High Light:

Double Sided FR4 PCB Board

,

Hard Gold FR4 PCB Board

,

Double Sided Hard Gold PCB

 

Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

 

1.1 General description

This is a type of double sided circuit board built on FR-4 substrate with Tg 170°C for the application of keypad. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and hard gold on pads. The base material is from Shengyi supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

 

1.2 Features and benefits

1. Industrial standard material with high Tg (170℃ by DSC) and excellent thermal reliability;

2. Lead free assemblies with a maximum reflow temperature of 260℃;

3. SMT process is resistant to reflow soldering, resistant to rework;

4. Quick and on-time delivery;

5. ISO9001, ISO14001, UL certified manufacturing factory;

6. Competitive price;

7. No quality complaint is meant to save money;

8. Quick CADCAM checking and free PCB quotation.

 

Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask 0

 

1.3 PCB Specifications

Item Description Requirement Actual
Basic information Board type Double sided PCB Double sided PCB
Layer count 2 layers 2 layers
Board size 65 x 71mm=1UP 65 x 71mm=1UP
Laminate Laminate Type FR4 TG170: CTI:175V-249V FR4 TG170: CTI:175V-249V
Supplier / /
Tg TG 170 TG 170
Finished thickness 1.6+/-10% mm 1.57 mm
Plating Thickness PTH Cu thickness >20 um 22.13um
Inner layer Cu Thickness 1/1 OZ 1/1 OZ
Surface Cu thickness 35 um 45.1 um
Solder Mask Material type LP-4G G-05 LP-4G G-05
Supplier Nan Ya Nan Ya
Color Green Green
Single / both sides Both Sides Both Sides
S/M thickness >=10.0 um 26.93 um
3M tape test NO Peel Off no peel off
Legend Material type S-380W S-380w
Supplier Tai yo Tai yo
Color White White
Location Both Sides Both Sides
3M tape test No peel off no peel off
Circuit Trace Width (mm) 0.203+/-20%mm 0.195mm
Spacing (mm) 0.203+/- 20%mm 0.199 mm
Electroplated Gold Nickel 100u" 112u"
Gold 10u" 11.11u"
Reliabilty Tests Thermal shock test 288±5, 10sec ,3 cycles NO Discolor , NO Delamination
solder abllity test 245±5 100% wetting
Function Electrioal Test 100% pass
Standard IPC-A 600H class 2, IPC_6012C CLASS 2 100% Pass
Appearance Visual inspection 100% Pass
warp and twist <= 0.75% 0.26%
V-Groove V-Cut thickness 0.4±0.1 mm 0.41mm
Angle 30+/- 5 30º
Drill table (mm) T1 PTH 0.508+/-0.075mm
T2 PTH 0.710+/-0.075mm
T3 NPTH 5.000+/-0.05mm

 

1.4 Applications

DC To DC Converter

USB Wlan Adapter

Rf Transceiver

Controlled Access

Fiber optic receptors

 

1.5 Our PCB Capability (2022)

Parameter Value
 Layer Counts  1-32
 Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)