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Product Details:
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| Base Material: | FR-4 | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Thickness: | 1.6+/-10% MM | PCB Size: | 65 X 71mm=1UP |
| Solder Mask: | Green | Silkscreen: | White |
| Copper Weight: | 1oz | Surface Finish: | Electrolytic Gold |
| Highlight: | Double Sided FR4 PCB Board,Hard Gold FR4 PCB Board,Double Sided Hard Gold PCB |
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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask
(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)
1.1 General description
This is a type of double sided circuit board built on FR-4 substrate with Tg 170°C for the application of keypad. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and hard gold on pads. The base material is from Shengyi supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
1.2 Features and benefits
1. Industrial standard material with high Tg (170℃ by DSC) and excellent thermal reliability;
2. Lead free assemblies with a maximum reflow temperature of 260℃;
3. SMT process is resistant to reflow soldering, resistant to rework;
4. Quick and on-time delivery;
5. ISO9001, ISO14001, UL certified manufacturing factory;
6. Competitive price;
7. No quality complaint is meant to save money;
8. Quick CADCAM checking and free PCB quotation.
1.3 PCB Specifications
| Item | Description | Requirement | Actual |
| Basic information | Board type | Double sided PCB | Double sided PCB |
| Layer count | 2 layers | 2 layers | |
| Board size | 65 x 71mm=1UP | 65 x 71mm=1UP | |
| Laminate | Laminate Type | FR4 TG≧170: CTI:175V-249V | FR4 TG≧170: CTI:175V-249V |
| Supplier | / | / | |
| Tg | TG ≧170℃ | TG ≧170℃ | |
| Finished thickness | 1.6+/-10% mm | 1.57 mm | |
| Plating Thickness | PTH Cu thickness | >20 um | 22.13um |
| Inner layer Cu Thickness | 1/1 OZ | 1/1 OZ | |
| Surface Cu thickness | 35 um | 45.1 um | |
| Solder Mask | Material type | LP-4G G-05 | LP-4G G-05 |
| Supplier | Nan Ya | Nan Ya | |
| Color | Green | Green | |
| Single / both sides | Both Sides | Both Sides | |
| S/M thickness | >=10.0 um | 26.93 um | |
| 3M tape test | NO Peel Off | no peel off | |
| Legend | Material type | S-380W | S-380w |
| Supplier | Tai yo | Tai yo | |
| Color | White | White | |
| Location | Both Sides | Both Sides | |
| 3M tape test | No peel off | no peel off | |
| Circuit | Trace Width (mm) | 0.203+/-20%mm | 0.195mm |
| Spacing (mm) | 0.203+/- 20%mm | 0.199 mm | |
| Electroplated Gold | Nickel | 100u" | 112u" |
| Gold | 10u" | 11.11u" | |
| Reliabilty Tests | Thermal shock test | 288±5℃, 10sec ,3 cycles | NO Discolor , NO Delamination |
| solder abllity test | 245±5℃ | 100% wetting | |
| Function | Electrioal Test | 100% | pass |
| Standard | IPC-A 600H class 2, IPC_6012C CLASS 2 | 100% | Pass |
| Appearance | Visual inspection | 100% | Pass |
| warp and twist | <= 0.75% | 0.26% | |
| V-Groove | V-Cut thickness | 0.4±0.1 mm | 0.41mm |
| Angle | 30+/- 5 | 30º | |
| Drill table (mm) | T1 | PTH | 0.508+/-0.075mm |
| T2 | PTH | 0.710+/-0.075mm | |
| T3 | NPTH | 5.000+/-0.05mm |
1.4 Applications
DC To DC Converter
USB Wlan Adapter
Rf Transceiver
Controlled Access
Fiber optic receptors
1.5 Our PCB Capability (2022)
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
