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Immersion Gold Double Sided High Temperature PCB For Automotive
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Immersion Gold Double Sided High Temperature PCB For Automotive
  • name
  • name
  • name
  • name
  • name

Immersion Gold Double Sided High Temperature PCB For Automotive

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-507.V1.0
Base Material:
FR-4 IT-180ATC
PCB Thickness:
1.63-1.68mm
Copper Weight:
1oz
Surface Finish:
Immersion Gold
Highlight:

Double Sided High Temperature PCB

,

Immersion Gold High Temperature PCB

,

Automotive High Temperature PCB

Product Description

 

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.

 

Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications

 

Immersion Gold Double Sided High Temperature PCB For Automotive 0

 

PCB Parameters

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 IT-180ATC FR-4 IT-180ATC ACC
Tg 170℃ 170℃ ACC
Supplier ITEQ ITEQ ACC
Thickness 1.6±10% mm 1.63-1.68mm ACC
2.Plating thickness Hole Wall ≥25µm 26.51µm ACC
Outer copper 35µm 41.09µm ACC
Inner Copper      
3.Solder mask Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC
Color Green Green ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC
S/M Thickness ≥10 µm 20.11µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S C/S ACC
5. Peelable Solder Mask Material Type      
Thickness      
Location      
6. Identification UL Mark YES YES ACC
Date Code WWYY 2121 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness      
Nickel Thickness 3-6µm 4.06µm ACC
Gold Thickness 0.05µm 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 5mil 4.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove Angle 30º 30º ACC
Residual thickness 0.4±0.1mm 0.43mm ACC
11. Beveling Angle      
Height      
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦ 1.56 µg/c㎡ 0.56µg/c㎡ ACC

 

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code PTH Required Actual value Result
1 Y 0.400 0.400 0.425 0.425 0.400 ACC
2 Y 0.450 0.450 0.500 0.475 0.450 ACC
3 Y 0.600 0.600 0.650 0.625 0.600 ACC
4 Y 0.725 0.750 0.775 0.775 0.750 ACC
5 Y 0.850 0.850 0.825 0.850 0.825 ACC

 

Immersion Gold Double Sided High Temperature PCB For Automotive 1

 

Tags: 

FR4 PCB Board,  

6 Layer FR4 PCB Board,  

Mobile Broadband Gold Finger PCB

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Immersion Gold Double Sided High Temperature PCB For Automotive
  • name
  • name
  • name
  • name
  • name
Immersion Gold Double Sided High Temperature PCB For Automotive
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-507.V1.0
Base Material:
FR-4 IT-180ATC
PCB Thickness:
1.63-1.68mm
Copper Weight:
1oz
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Double Sided High Temperature PCB

,

Immersion Gold High Temperature PCB

,

Automotive High Temperature PCB

Product Description

 

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.

 

Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications

 

Immersion Gold Double Sided High Temperature PCB For Automotive 0

 

PCB Parameters

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 IT-180ATC FR-4 IT-180ATC ACC
Tg 170℃ 170℃ ACC
Supplier ITEQ ITEQ ACC
Thickness 1.6±10% mm 1.63-1.68mm ACC
2.Plating thickness Hole Wall ≥25µm 26.51µm ACC
Outer copper 35µm 41.09µm ACC
Inner Copper      
3.Solder mask Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC
Color Green Green ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC
S/M Thickness ≥10 µm 20.11µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S C/S ACC
5. Peelable Solder Mask Material Type      
Thickness      
Location      
6. Identification UL Mark YES YES ACC
Date Code WWYY 2121 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness      
Nickel Thickness 3-6µm 4.06µm ACC
Gold Thickness 0.05µm 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 5mil 4.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove Angle 30º 30º ACC
Residual thickness 0.4±0.1mm 0.43mm ACC
11. Beveling Angle      
Height      
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦ 1.56 µg/c㎡ 0.56µg/c㎡ ACC

 

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code PTH Required Actual value Result
1 Y 0.400 0.400 0.425 0.425 0.400 ACC
2 Y 0.450 0.450 0.500 0.475 0.450 ACC
3 Y 0.600 0.600 0.650 0.625 0.600 ACC
4 Y 0.725 0.750 0.775 0.775 0.750 ACC
5 Y 0.850 0.850 0.825 0.850 0.825 ACC

 

Immersion Gold Double Sided High Temperature PCB For Automotive 1

 

Tags: 

FR4 PCB Board,

6 Layer FR4 PCB Board,

Mobile Broadband Gold Finger PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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