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TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled
TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

Large Image :  TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-509.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TU-883 Layer Count: 20 Layers
PCB Thickness: 3.0mm Solder Mask: Green
Silkscreen: White Surface Finish: Immersion Gold
High Light:

Multilayer Impedance Controlled Pcb

,

3.0mm Impedance Controlled Pcb

,

20 Layers Impedance Controlled Pcb

 

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.

 

Applications

Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers

 

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled 0

 

Detailed Specifications

Item Description Actual Result
1. Laminate Material Type TU-883 ACC
Tg 170℃ ACC
Supplier TUC ACC
Thickness 2.8-3.1mm ACC
2.Plating thickness Hole Wall 26.51µm ACC
Outer copper 41.09µm ACC
Inner Copper 15µm / 31µm ACC
3.Solder mask Material Type TAIYO/ PSR-2000GT600D ACC
Color Green ACC
Rigidity (Pencil Test) 5H ACC
S/M Thickness 20.11µm ACC
Location Both Sides ACC
4. Component Mark Material Type IJR-4000 MW300 ACC
Color White ACC
Location C/S, S/S ACC
5. Peelable Solder Mask Material Type /  
Thickness /  
Location /  
6. Identification UL Mark YES ACC
Date Code 2921 ACC
Mark Location Solder Side ACC
7. Surface Finish Method Immersion Gold ACC
Nickel Thickness 4.06µm ACC
Gold Thickness 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU ACC
REACH Directive 1907 /2006 ACC
9.Annular Ring Min. Line Width (mil) 4.8mil ACC
Min. Spacing (mil) 5.2mil ACC
10.V-groove Angle /  
Residual thickness /  
11. Beveling Angle /  
Height /  
12. Function Electrical Test 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.21% ACC
14. Reliability Test Tape Test No Peeling ACC
Solvent Test No Peeling ACC
Solderability Test 265 ±5℃ ACC
Thermal Stress Test 288 ±5℃ ACC
Ionic Contamination Test 0.56µg/c㎡ ACC

 

Stackup & Impedance Controlled

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled 1

 

HDI vias

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled 2

 

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled 3

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)