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24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance 24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance 24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

Large Image :  24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-483.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 24 Layers
PCB Thickness: 3.7mm ±0.10% PCB Size: 400 X 212mm=1PCS
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

24 Layer FR4 PCB Board

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100 Ohm Impedance FR4 PCB Board

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FR4 High Temperature PCB

 
Multilayer PCB 24 Layer Printed Circuit Board Built On High Temperature FR-4 With 50 Ohm / 100 Ohm Impedance for Industrial controls
 
1.1 General description
This is a type of high multilayer PCB built on FR-4 substrate with Tg 170°C for the application of Industrial controls with 24 layer copper track. It's 3.7 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. This is also an impedance controlled PCB with single-end impedance of 50 ohm and differential impedance of 100 ohm. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 panels are packed for shipment.
 
1.2 Features and benifits
Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
Long storage time ( It can be stored for more than 1 year in vacuum bag)
The signal lines form a constant low impedance to the ground
Micro-section and thermal stress test
16000 square meter workshop
Small quantity order is accepted
ISO9001, ISO14001, IATF16949, UL Certified
 
1.3 Applications
Transmitter
GSM Modem
3G WiFi Router
Phase Shifter
Embedded Controller
Hard drives

24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance 0
 
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance 1
 
1.4 Parameter and data sheet
PCB SIZE 400 x 212mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 24 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP TOP LAYER 0.018mm+plating Layer 1
Prepreg 0.1016mm
PLANE 1 --- 0.035mm Layer 2
CORE FR4 0.1016mm
GROUND 1 --- 0.035mm Layer 3
Prepreg 0.127mm
SIGNAL 1 --- 0.018mm
CORE FR4 0.1524mm
PLANE 2 --- 0.035mm
Prepreg 0.1016mm
GROUND 2 --- 0.035mm
CORE FR4 0.127mm
SIGNAL 2 --- 0.018mm
Prepreg 0.1524mm
PLANE 3 --- 0.035mm
CORE FR4 0.1016mm
PLANE,GROUND 7 --- 0.035mm
Prepreg 0.127mm
SIGNAL 3 --- 0.018mm
CORE FR-4 0.1524mm
GROUND 3 --- 0.035mm
Prepreg 0.127mm
SIGNAL 4 --- 0.018mm
CORE FR4 0.1524mm
PLANE 4 --- 0.035mm
Prepreg 0.1016mm
GROUND 4 --- 0.035mm
CORE FR4 0.1016mm
SIGNAL 5 --- 0.018mm
Prepreg 0.1524mm
SIGNAL 6 --- 0.018mm
CORE FR4 0.1016mm
PLANE 5 --- 0.035mm
Prepreg 0.1016mm
GROUND 5 --- 0.035mm
CORE FR4 0.1524mm
SIGNAL 7 --- 0.018mm
Prepreg 0.127mm
PLANE 6 --- 0.035mm
CORE FR4 0.1524mm
SIGNAL 8 --- 0.018mm
Prepreg 0.127mm
POWER, RROUND 8 --- 0.035mm Layer 22
CORE FR4 0.1016mm
GROUND 6 --- 0.035mm Layer 23
Prepreg 0.1016mm
BOTTOM LAYER --- 0.018mm + plating Layer 24
TECHNOLOGY  
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.36 /3.2mm
Number of Different Holes: 9
Number of Drill Holes: 9117
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: Yes, all of signal layers of 8 copper layers, 50 OHM Impedance Controlled for single ended on 5 mil track & 100 OHM for Differential routes on 5mil / 8 mil
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: FR-4 Tg170℃, er<5.4.IT-180, ITEQ Supplied
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 3.7mm ±0.10%
PLATING AND COATING  
Surface Finish Immersion gold (29.1% ) 0.05µm over 3µm nickel
Solder Mask Apply To: TOP and Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Via hole filling at BGA required.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
 
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance 2
 
1.5 Printed Circuit Board Capability 2020
Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--420µm (0.5oz - 12oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

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Tel: +8613481420915

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