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12 layer 2.0mm Immersion Gold PCB For Signal Transmission

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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12 layer 2.0mm Immersion Gold PCB For Signal Transmission

12 layer 2.0mm Immersion Gold PCB For Signal Transmission
12 layer 2.0mm Immersion Gold PCB For Signal Transmission 12 layer 2.0mm Immersion Gold PCB For Signal Transmission 12 layer 2.0mm Immersion Gold PCB For Signal Transmission 12 layer 2.0mm Immersion Gold PCB For Signal Transmission 12 layer 2.0mm Immersion Gold PCB For Signal Transmission 12 layer 2.0mm Immersion Gold PCB For Signal Transmission 12 layer 2.0mm Immersion Gold PCB For Signal Transmission 12 layer 2.0mm Immersion Gold PCB For Signal Transmission

Large Image :  12 layer 2.0mm Immersion Gold PCB For Signal Transmission

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-468.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 12 Layers
PCB Thickness: 2.0mm ±10% PCB Size: 257 X 171.5mm=1PCS=1design
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

12 Layer Immersion Gold PCB

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2.0mm Immersion Gold PCB

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2.0mm 12 Layer PCB

 
Immersion Gold PCB Nickel/Gold Plating Circuit Board with BGA and Via In Pad for Signal Transmission
 
1.1 General description
This is a type of multilayer PCB built on FR-4 substrate with Tg 135°C for the application of Signal transmission with 12 layer copper track. It's 2.0 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.
 
1.2 Features and benifits
Lead free assemblies with a maximum reflow temperature of 260℃.
Long storage time ( It can be stored for more than 1 year in vacuum bag)
Improved the speed of signal transmission
PCB manufacturing on required specifications.
Quick and on-time delivery
UL recognized and RoHS Directive-compliant
Prototype PCB capability
 
12 layer 2.0mm Immersion Gold PCB For Signal Transmission 0
 
1.3 Applications
Solar Battery Charger
Vehicle Tracker
GPS Receiver
SMS Modem
Multicoupler Antenna
Phone systems
 
1.4 Parameter and data sheet
PCB SIZE 257 x 171.5mm=1PCS=1design
BOARD TYPE Multilayer PCB
Number of Layers 12 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- TOP 17um(1oz)+plate 25um
130 um prepreg 1080 x 2
copper ------- L02 35um(1oz)
150um core FR-4
copper ------- L03 35um(1oz)
130 um prepreg 1080 x 2
copper ------- L04 35um(1oz)
150um core FR-4
copper ------- L05 35um(1oz)
130 um prepreg 1080 x 2
copper ------- L06 35um(1oz)
150um core FR-4
copper ------- L07 35um(1oz)
130 um prepreg 1080 x 2
copper ------- L08 35um(1oz)
150um core FR-4
copper ------- L09 35um(1oz)
130 um prepreg 1080 x 2
copper ------- L10 35um(1oz)
150um core FR-4
copper ------- L11 35um(1oz)
130 um prepreg 1080 x 2
copper ------- BOT 17um(0.5oz)+plate 25um
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.25 mm / 3.0 mm
Number of Different Holes: 26
Number of Drill Holes: 4013
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL  
Glass Epoxy: FR-4, ITEQ IT-140, Tg>135℃, er<5.4
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 2.0mm ±10%
PLATING AND COATING  
Surface Finish Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented. Vin in pad under BGA package
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
 
12 layer 2.0mm Immersion Gold PCB For Signal Transmission 1
 
1.5 Advantages of PCB Boards with Electroless Nickel and Immersion Gold
(1) Flat Surface
The most important feature is that the surface of all pads is perfectly flat, corresponding to the underlying copper surface, with all pad and track edges covered by nickel/gold.
 
(2) Low Defect Rate
An important reason for choosing immersion gold surface protection is a highly reduced failure rate during assembly and soldering compared with solder-coated and hot-air leveled boards. It is especially true of fine line boards with a component pitch of 0.5 mm (20 mils) or less.
 
(3) Solderability
Solderability is high but the soldering time is a little longer (about 5 seconds.) compared with wave soldering (3seconds.)
 
(4) Dimensional Stability
Since the boards are not subjected to temperatures above 90° C (194° F) during manufacture, the dimensional stability is high. This is of great importance when screen-printing solder paste on fine-line SMT boards because a better fit between the stencil and the pattern is achieved than in the case of solder coated and hot-air leveled boards.
 
12 layer 2.0mm Immersion Gold PCB For Signal Transmission 2
 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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