Product Details:
Payment & Shipping Terms:
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Base Material: | FR-4 | Layer Count: | 12 Layers |
---|---|---|---|
PCB Thickness: | 2.0mm ±10% | PCB Size: | 257 X 171.5mm=1PCS=1design |
Solder Mask: | Green | Silkscreen: | White |
Copper Weight: | 1oz | Surface Finish: | Immersion Gold |
Highlight: | 12 Layer Immersion Gold PCB,2.0mm Immersion Gold PCB,2.0mm 12 Layer PCB |
PCB SIZE | 257 x 171.5mm=1PCS=1design |
BOARD TYPE | Multilayer PCB |
Number of Layers | 12 Layers |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- TOP 17um(1oz)+plate 25um |
130 um prepreg 1080 x 2 | |
copper ------- L02 35um(1oz) | |
150um core FR-4 | |
copper ------- L03 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- L04 35um(1oz) | |
150um core FR-4 | |
copper ------- L05 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- L06 35um(1oz) | |
150um core FR-4 | |
copper ------- L07 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- L08 35um(1oz) | |
150um core FR-4 | |
copper ------- L09 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- L10 35um(1oz) | |
150um core FR-4 | |
copper ------- L11 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- BOT 17um(0.5oz)+plate 25um | |
TECHNOLOGY | |
Minimum Trace and Space: | 4 mil / 4 mil |
Minimum / Maximum Holes: | 0.25 mm / 3.0 mm |
Number of Different Holes: | 26 |
Number of Drill Holes: | 4013 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | NO |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-140, Tg>135℃, er<5.4 |
Final foil external: | 1oz |
Final foil internal: | 1oz |
Final height of PCB: | 2.0mm ±10% |
PLATING AND COATING | |
Surface Finish | Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel) |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented. Vin in pad under BGA package |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848