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12 layer 2.0mm Immersion Gold PCB For Signal Transmission

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Ms. Ivy Deng

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12 layer 2.0mm Immersion Gold PCB For Signal Transmission

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-468.V1.0

Base Material:

Layer Count:

12 Layers

PCB Thickness:

2.0mm ±10%

PCB Size:

257 X 171.5mm=1PCS=1design

Solder Mask:

Green

Silkscreen:

White

Copper Weight:

Surface Finish:

Immersion Gold

Highlight:

12 Layer Immersion Gold PCB

2.0mm Immersion Gold PCB

2.0mm 12 Layer PCB

Product Description

Immersion Gold PCB Nickel/Gold Plating Circuit Board with BGA and Via In Pad for Signal Transmission

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 135°C for the application of Signal transmission with 12 layer copper track. It's 2.0 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.

1.2 Features and benifits

Lead free assemblies with a maximum reflow temperature of 260℃.

Long storage time ( It can be stored for more than 1 year in vacuum bag)

Improved the speed of signal transmission

PCB manufacturing on required specifications.

Quick and on-time delivery

UL recognized and RoHS Directive-compliant

Prototype PCB capability

1.3 Applications

Solar Battery Charger

Vehicle Tracker

GPS Receiver

SMS Modem

Multicoupler Antenna

Phone systems

1.4 Parameter and data sheet

PCB SIZE	257 x 171.5mm=1PCS=1design
BOARD TYPE	Multilayer PCB
Number of Layers	12 Layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- TOP 17um(1oz)+plate 25um
	130 um prepreg 1080 x 2
	copper ------- L02 35um(1oz)
	150um core FR-4
	copper ------- L03 35um(1oz)
	130 um prepreg 1080 x 2
	copper ------- L04 35um(1oz)
	150um core FR-4
	copper ------- L05 35um(1oz)
	130 um prepreg 1080 x 2
	copper ------- L06 35um(1oz)
	150um core FR-4
	copper ------- L07 35um(1oz)
	130 um prepreg 1080 x 2
	copper ------- L08 35um(1oz)
	150um core FR-4
	copper ------- L09 35um(1oz)
	130 um prepreg 1080 x 2
	copper ------- L10 35um(1oz)
	150um core FR-4
	copper ------- L11 35um(1oz)
	130 um prepreg 1080 x 2
	copper ------- BOT 17um(0.5oz)+plate 25um
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.25 mm / 3.0 mm
Number of Different Holes:	26
Number of Drill Holes:	4013
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	NO
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-140, Tg>135℃, er<5.4
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	2.0mm ±10%
PLATING AND COATING
Surface Finish	Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented. Vin in pad under BGA package
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.5 Advantages of PCB Boards with Electroless Nickel and Immersion Gold

(1) Flat Surface

The most important feature is that the surface of all pads is perfectly flat, corresponding to the underlying copper surface, with all pad and track edges covered by nickel/gold.

(2) Low Defect Rate

An important reason for choosing immersion gold surface protection is a highly reduced failure rate during assembly and soldering compared with solder-coated and hot-air leveled boards. It is especially true of fine line boards with a component pitch of 0.5 mm (20 mils) or less.

(3) Solderability

Solderability is high but the soldering time is a little longer (about 5 seconds.) compared with wave soldering (3seconds.)

(4) Dimensional Stability

Since the boards are not subjected to temperatures above 90° C (194° F) during manufacture, the dimensional stability is high. This is of great importance when screen-printing solder paste on fine-line SMT boards because a better fit between the stencil and the pattern is achieved than in the case of solder coated and hot-air leveled boards.

Tags:

2.0mm Immersion Gold PCB,

2.0mm 12 Layer PCB,

HASL Tin Plating PCB

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