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High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

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Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

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High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-477.V1.0

Base Material:

Layer Count:

6 Layers

PCB Thickness:

1.6mm ±0.16

PCB Size:

54.99 X 87.50mm=1UP

Solder Mask:

Green

Silkscreen:

White

Copper Weight:

Surface Finish:

Immersion Gold

Highlight:

Immersion Gold Automotive Printed Circuit Board

FR4 Tg170 Automotive Printed Circuit Board

FR4 Tg170 High Density PCB

Product Description

Via in Pad PCB High Density Multilayer PCB Via Filled Circuit Board with Immersion Gold for GPS Tracking Devices

1.1 General description

This is a type of 6 layer printed circuit board built on FR-4 Tg170 substrate for the application of GPS Tracking Devices. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supplying 1 up single board. Vias with 0.3mm are resin filled and plated flatly (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

1.2 Features and benifits

RoHS compliant and suitable for high thermal reliability needs

Excellent surface planarity for CSP mounted components to reduce failure rate during assembly and soldering.

Reliability test, insulation resistance test and ionic contamination test

16000 square meter workshop

12 hours quotation

No quality complaint is meant to save money

1.3 Applications

Inverters

Router ADSL

Industrial Computer

Weather analysis

1.4 Parameter and data sheet

Number of Layers	6
Board Type	Multi-layer PCB
Board size	54.99 x 87.50mm=1UP
Board Thickness	1.6mm +/-0.16
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	170℃

PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	35 um (1oz)
Surface Cu thickness	35 um (1oz)

Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAiYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	13um

Type of Silkscreen Ink	TAIYO, IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1

Mininum Trace (mil)	7 mil
Minimum Gap(mil)	4.9 mil

Surface Finish	Immersion Gold
RoHS Required	Yes
Warpage	0.25%
Drill table (mm)
T1	1.000
T2	3.175

Thermal Shock Test	Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test	Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.600
	T2: 0.700
	T3:0.800
	T4: 1.000
	T5: 1.100
	T6: 1.250
	T7: 1.850
	T8: 4.000
	T9: 4.325

1.5 Design For Manufacture (1)

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
1	Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.isolation of layers	0.1mm	0.1mm	0.06mm
2		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
3			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
4			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
5			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
6			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
7		Min.distance from drill to conductor	4 Layer 10mil,6 layer 10mil,8-12 layer 12mil	4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil	4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
8		Min.width of annular ring on inner layer	4 Layer 10mil(35um),≥6 Layer 14mil(35um)	4 Layer 8mil(35um),≥6 layer 12mil(35um)	4 Layer 6mil(35um),≥6 Layer 10mil(35um)
9		Inner layer isolation ring width(Min)	10mil (35um)	8mil (35um)	6mil (35um)
10		Min.via pad diameter	20mil (35um)	16mil (35um)	16mil (35um)
11		Min. distance from board edge to conductor(no copper exposured)(inner layer)	14 mil(35um)	12 mil(35um))	8 mil(35um)
12		Maximum copper weight(Inner layer and outer layer)	3 OZ( 105 um )	4 OZ ( 140 um )	6 OZ( 210 um )
13		Core with different copper foil on both sides	/	18/35,35/70 um	18/35,35/70 um

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