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High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold
High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

Large Image :  High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-477.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 Layer Count: 6 Layers
PCB Thickness: 1.6mm ±0.16 PCB Size: 54.99 X 87.50mm=1UP
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

Immersion Gold Automotive Printed Circuit Board

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FR4 Tg170 Automotive Printed Circuit Board

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FR4 Tg170 High Density PCB

 
Via in Pad PCB High Density Multilayer PCB Via Filled Circuit Board with Immersion Gold for GPS Tracking Devices
 
 
1.1 General description
This is a type of 6 layer printed circuit board built on FR-4 Tg170 substrate for the application of GPS Tracking Devices. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supplying 1 up single board. Vias with 0.3mm are resin filled and plated flatly (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
 
1.2 Features and benifits
RoHS compliant and suitable for high thermal reliability needs
Excellent surface planarity for CSP mounted components to reduce failure rate during assembly and soldering.
Reliability test, insulation resistance test and ionic contamination test
16000 square meter workshop
12 hours quotation
No quality complaint is meant to save money
 
High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold 0
 
1.3 Applications
Inverters
Router ADSL
Industrial Computer
Weather analysis
 
1.4 Parameter and data sheet
Number of Layers 6
Board Type Multi-layer PCB
Board size 54.99 x 87.50mm=1UP
Board Thickness 1.6mm +/-0.16
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material 170℃
 
PTH Cu thickness ≥20 um (See hole wall details)
Inner Iayer Cu thicknes 35 um (1oz)
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier TAiYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 13um
 
Type of Silkscreen Ink TAIYO, IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Mininum Trace (mil) 7 mil
Minimum Gap(mil) 4.9 mil
 
Surface Finish Immersion Gold
RoHS Required Yes
Warpage 0.25%
Drill table (mm)  
T1 1.000
T2 3.175
   
Thermal Shock Test Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm) T1: 0.600
T2: 0.700
T3:0.800
T4: 1.000
T5: 1.100
T6: 1.250
T7: 1.850
T8: 4.000
T9: 4.325
 
High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold 1
 
1.5 Design For Manufacture (1)
Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume (S<10 m²) Prototype(S<1m²)
1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.isolation of layers 0.1mm 0.1mm 0.06mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil(35um),≥6 Layer 14mil(35um) 4 Layer 8mil(35um),≥6 layer 12mil(35um) 4 Layer 6mil(35um),≥6 Layer 10mil(35um)
9 Inner layer isolation ring width(Min) 10mil (35um) 8mil (35um) 6mil (35um)
10 Min.via pad diameter 20mil (35um) 16mil (35um) 16mil (35um)
11 Min. distance from board edge to conductor(no copper exposured)(inner layer) 14 mil(35um) 12 mil(35um)) 8 mil(35um)
12 Maximum copper weight(Inner layer and outer layer) 3 OZ( 105 um ) 4 OZ ( 140 um ) 6 OZ( 210 um )
13 Core with different copper foil on both sides / 18/35,35/70 um 18/35,35/70 um

 

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Tel: +8613481420915

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