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High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold
High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

Large Image :  High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-504.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: High Tg, High Performance And Low CTE Epoxy Resin PCB Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
Layer Count: Double Layer, Multilayer, Hybrid PCB PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish: Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
High Light:

High Tg PCB Printed Circuit Board

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Immersion Gold PCB Printed Circuit Board

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0.6mm PCB Printed Circuit Board

 

High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

S1000-2M is a type of High Tg printed circuit board material manufactured by Shengyi with characteristics of high performance and low CTE, suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.

 

Features

Lead-free compatible FR-4 laminate

Tg170℃ (DSC), UV Blocking/AOI compatible

High heat resistance

Lower Z-axis CTE

Excellent through-hole reliability

Excellent Anti-CAF performance

Low water absorption

Excellent mechanical processability

 

High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold 0

 

Applications

Computer

Communication

Automotive electronics

Suitable for high layer count PCB

 

Our PCB Capability (S1000-2M)

PCB Material: High Tg, High Performance and Low CTE Epoxy Resin
Designation: S1000-2M
Dielectric constant: 4.6 at 10GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

General Properties of S1000-2M

Test Items Test Method Test Condition Unit Typical Value
Tg IPC-TM-650 2.4.24.4 DMA 185
IPC-TM-650 2.4.25D DSC 180
Td IPC-TM-650 2.4.24.6 TGA (5% W.L) 355
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
T300 IPC-TM-650 2.4.24.1 TMA min 15
Thermal Stress IPC-TM-650 2.4.13.1 288, solder dip s >100
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 41
IPC-TM-650 2.4.24 After Tg ppm/℃ 208
IPC-TM-650 2.4.24 50-260℃ % 2.4
Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.6
Loss Tangent (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.018
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 8.7×108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 2.2×107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 133
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.3 [7.43]
Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 567/442
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.08
Flammability UL94 C-48/23/50 Rating V-0
CTI IEC60112 A Rating PLC 3

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)