logo
products
PRODUCTS DETAILS
Home > Products >
High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Contact Us
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Contact Now
High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold
  • name
  • name
  • name
  • name
  • name

High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-504.V1.0
Base Material:
High Tg, High Performance And Low CTE Epoxy Resin
PCB Thickness:
0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
Highlight:

High Tg PCB Printed Circuit Board

,

Immersion Gold PCB Printed Circuit Board

,

0.6mm PCB Printed Circuit Board

Product Description

 

High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

S1000-2M is a type of High Tg printed circuit board material manufactured by Shengyi with characteristics of high performance and low CTE, suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.

 

Features

 

- Lead-Free Compatible FR-4 Laminate: Ensures environmental compliance and supports modern soldering processes.
 

- High Glass Transition Temperature (Tg 170°C): Provides superior thermal stability, preventing deformation under extreme heat.
 

- UV Blocking/AOI Compatible: Enhances inspection accuracy and prevents false readings during automated optical inspection.
 

- Exceptional Heat Resistance: Maintains structural and electrical integrity in high-temperature environments.
 

- Reduced Z-Axis CTE: Minimizes plated through-hole stress, improving reliability during thermal cycling.
 

- Superior Anti-CAF Performance: Resists conductive anodic filamentation, ensuring long-term electrical reliability.
 

- Low Water Absorption: Protects against moisture-induced degradation in humid operating conditions.
 

- Excellent Mechanical Processability: Allows precise drilling, routing, and fabrication without material damage.

 

 

High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold 0

 

Applications

Computer

Communication

Automotive electronics

Suitable for high layer count PCB

 

Our PCB Capability (S1000-2M)

PCB Material: High Tg, High Performance and Low CTE Epoxy Resin
Designation: S1000-2M
Dielectric constant: 4.6 at 10GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

General Properties of S1000-2M

Test Items Test Method Test Condition Unit Typical Value
Tg IPC-TM-650 2.4.24.4 DMA ℃ 185
IPC-TM-650 2.4.25D DSC ℃ 180
Td IPC-TM-650 2.4.24.6 TGA (5% W.L) ℃ 355
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
T300 IPC-TM-650 2.4.24.1 TMA min 15
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip s >100
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 41
IPC-TM-650 2.4.24 After Tg ppm/℃ 208
IPC-TM-650 2.4.24 50-260℃ % 2.4
Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.6
Loss Tangent (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.018
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 8.7×108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ 2.2×107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 133
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.3 [7.43]
Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 567/442
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.08
Flammability UL94 C-48/23/50 Rating V-0
CTI IEC60112 A Rating PLC 3

 

Tags: 

FR4 PCB Board,  

6 Layer FR4 PCB Board,  

Mobile Broadband Gold Finger PCB

Recommended Products
High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

Contact Now
Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold

Multilayer High Tg FR4 PCB Board With 1.2mm Thick Coating Immersion Gold

Contact Now
Immersion Gold Double Sided High Temperature PCB For Automotive

Immersion Gold Double Sided High Temperature PCB For Automotive

Contact Now
High Tg Printed Circuit FR4 PCB Board With Immersion Gold

High Tg Printed Circuit FR4 PCB Board With Immersion Gold

Contact Now
Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold

Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold

Contact Now
Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Contact Now
0.5mm FR4 PCB Board Thin Circuit Board For GPS Tracker

0.5mm FR4 PCB Board Thin Circuit Board For GPS Tracker

Contact Now
High Temperature 8 Layer FR4 PCB Board For Satellite Radio

High Temperature 8 Layer FR4 PCB Board For Satellite Radio

Contact Now
Hybrid PCB 10mil RO4350B And FR4 5 Layer PCB With Immersion Gold For 2.4 Ghz Antenna

Hybrid PCB 10mil RO4350B And FR4 5 Layer PCB With Immersion Gold For 2.4 Ghz Antenna

Contact Now
Thin Printed Circuit Board 0.6mm Double Sided PCB on FR-4 with HASL Lead Free

Thin Printed Circuit Board 0.6mm Double Sided PCB on FR-4 with HASL Lead Free

Contact Now
Thick Printed Circuit Board 3.0mm Double Sided PCB Built On FR-4 With Immersion Gold

Thick Printed Circuit Board 3.0mm Double Sided PCB Built On FR-4 With Immersion Gold

Contact Now
products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold
  • name
  • name
  • name
  • name
  • name
High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-504.V1.0
Base Material:
High Tg, High Performance And Low CTE Epoxy Resin
PCB Thickness:
0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

High Tg PCB Printed Circuit Board

,

Immersion Gold PCB Printed Circuit Board

,

0.6mm PCB Printed Circuit Board

Product Description

 

High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

S1000-2M is a type of High Tg printed circuit board material manufactured by Shengyi with characteristics of high performance and low CTE, suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.

 

Features

 

- Lead-Free Compatible FR-4 Laminate: Ensures environmental compliance and supports modern soldering processes.
 

- High Glass Transition Temperature (Tg 170°C): Provides superior thermal stability, preventing deformation under extreme heat.
 

- UV Blocking/AOI Compatible: Enhances inspection accuracy and prevents false readings during automated optical inspection.
 

- Exceptional Heat Resistance: Maintains structural and electrical integrity in high-temperature environments.
 

- Reduced Z-Axis CTE: Minimizes plated through-hole stress, improving reliability during thermal cycling.
 

- Superior Anti-CAF Performance: Resists conductive anodic filamentation, ensuring long-term electrical reliability.
 

- Low Water Absorption: Protects against moisture-induced degradation in humid operating conditions.
 

- Excellent Mechanical Processability: Allows precise drilling, routing, and fabrication without material damage.

 

 

High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold 0

 

Applications

Computer

Communication

Automotive electronics

Suitable for high layer count PCB

 

Our PCB Capability (S1000-2M)

PCB Material: High Tg, High Performance and Low CTE Epoxy Resin
Designation: S1000-2M
Dielectric constant: 4.6 at 10GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

General Properties of S1000-2M

Test Items Test Method Test Condition Unit Typical Value
Tg IPC-TM-650 2.4.24.4 DMA ℃ 185
IPC-TM-650 2.4.25D DSC ℃ 180
Td IPC-TM-650 2.4.24.6 TGA (5% W.L) ℃ 355
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
T300 IPC-TM-650 2.4.24.1 TMA min 15
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip s >100
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 41
IPC-TM-650 2.4.24 After Tg ppm/℃ 208
IPC-TM-650 2.4.24 50-260℃ % 2.4
Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.6
Loss Tangent (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.018
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 8.7×108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ 2.2×107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 133
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.3 [7.43]
Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 567/442
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.08
Flammability UL94 C-48/23/50 Rating V-0
CTI IEC60112 A Rating PLC 3

 

Tags: 

FR4 PCB Board,

6 Layer FR4 PCB Board,

Mobile Broadband Gold Finger PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.