|
Product Details:
Payment & Shipping Terms:
|
| Base Material: | FR-4 | Layer Count: | 4 Layers |
|---|---|---|---|
| PCB Thickness: | 0.5mm ±0.1 | PCB Size: | 111 X 45mm=1PCS |
| Solder Mask: | Green | Silkscreen: | White |
| Copper Weight: | 1oz | Surface Finish: | Immersion Silver |
| High Light: | 4 Layer FR4 PCB Board,0.4mm FR4 PCB Board,FR4 Immersion Silver PCB |
||
| PCB SIZE | 111 x 45mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 4 Layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| PP 2116 x 1 | |
| copper ------- 18um(0.5oz) | |
| FR-4 0.1mm | |
| copper ------- 18um(0.5oz) | |
| PP 2116 x 1 | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6.99mil/8.47mil |
| Minimum / Maximum Holes: | 0.399mm/3.556mm |
| Number of Different Holes: | 7 |
| Number of Drill Holes: | 1521 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-158, Tg>150 °C |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 0.5mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Silver, Ag>0.15µm |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| Property | Thickness<0.50 mm | Thickness≧0.50 mm | Units | Test Method | ||
| [0.0197 in] | [0.0197 in] | |||||
| Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
| (English) | (or as noted) | |||||
| Peel Strength, minimum | N/mm | 2.4.8 | ||||
| A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
| B. Standard profile copper foil | 0.96 (5.5) | 0.70 (4.0) | 0.96 (5.5) | 0.70 (4.0) | 2.4.8.3 | |
| 1. After Thermal Stress | ||||||
| 2. At 125°C [257 F] | ||||||
| 3. After Process Solutions | 1.75 (10 ) | 0.80 (4.57) | 1.93 (11.0) | 1.05 (6.00) | ||
| 1.66 (9.5) | 0.70 (4.00) | 1.66 (9.5) | 0.70 (4.00) | |||
| 1.49 (8.5) | 0.55 (3.14) | 1.49 (8.5) | 0.80 (4.57) | |||
| Volume Resistivity, minimum | MW-cm | 2.5.17.1 | ||||
| A. C-96/35/90 | 5x1010 | 106 | -- | -- | ||
| B. After moisture resistance | -- | -- | 5x1010 | 104 | ||
| C. At elevated temperature E-24/125 | 5x1010 | 103 | 5x1010 | 103 | ||
| Surface Resistivity, minimum | MW | 2.5.17.1 | ||||
| A. C-96/35/90 | 3.5x1010 | 104 | -- | -- | ||
| B. After moisture resistance | -- | -- | 3.5x1010 | 104 | ||
| C. At elevated temperature E-24/125 | 6x1010 | 103 | 6x1010 | 103 | ||
| Moisture Absorption, maximum | 0.3 | -- | 0.1 | 0.8 | % | 2.6.2.1 |
| Dielectric Breakdown, minimum | -- | -- | 60 | 40 | kV | 2.5.6 |
| Permittivity (Dk, 50% resin content) | 4.6 | 5.4 | 4.6 | 5.4 | -- | 2.5.5.9 |
| (Laminate & Laminated Prepreg) | ||||||
| A. 1MHz | ||||||
| Loss Tangent (Df, 50% resin content) | 0.016 | 0.035 | 0.016 | 0.035 | -- | 2.5.5.9 |
| (Laminate & Laminated Prepreg) | ||||||
| A. 1MHz | ||||||
| Flexural Strength, minimum | N/mm2 | 2.4.4 | ||||
| A. Length direction | -- | -- | 500-530 | 415 | (lb/in2) | |
| -- | -- | (72,500-76,850) | -60,190 | |||
| B. Cross direction | -- | -- | 430-460 | 345 | ||
| -- | -- | (62,350-66,700) | -50,140 | |||
| Arc Resistance, minimum | 120 | 60 | 120 | 60 | s | 2.5.1 |
| Thermal Stress 10 s at 288°C [550.4F],minimum | Rating | 2.4.13.1 | ||||
| A. Unetched | Pass | Pass Visual | Pass | Pass Visual | ||
| B. Etched | Pass | Pass Visual | Pass | Pass Visual | ||
| Electric Strength, minimum | 45 | 30 | -- | -- | kV/mm | 2.5.6.2 |
| (Laminate & Laminated Prepreg) | ||||||
| Flammability, | V-0 | V-0 | V-0 | V-0 | Rating | UL94 |
| (Laminate & Laminated Prepreg) | ||||||
| Glass Transition Temperature(DSC) | 140 | 135 minimum | 140 | 135 minimum | ˚C | 2.4.25 |
| Decomposition Temperature | -- | -- | 305 | -- | ˚C | 2.4.24.6 |
| (5% wt loss) | ||||||
| Z-Axis CTE | 2.4.24 | |||||
| A. Alpha 1 | -- | -- | 55 | -- | ppm/˚C | |
| B. Alpha 2 | -- | -- | 290 | -- | ppm/˚C | |
| C. 50 to 260 Degrees C | -- | -- | 4.2 | -- | % | |
| Thermal Resistance | 2.4.24.1 | |||||
| A. T260 | -- | -- | 15 | -- | Minutes | |
| B. T288 | -- | -- | 2 | -- | Minutes | |
| CAF Resistance | -- | -- | Pass | AABUS | Pass/Fail | 2.6.25 |
Contact Person: i.deng
Tel: +8613481420915
