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FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost

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Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost

FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost
FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost

Large Image :  FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-072.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO4350B + FR4; RO4003C + FR4; F4B + FR4; Layer Count: 4 Layers, 6 Layers, Multilayer
PCB Thickness: 1.0-5.0mm PCB Size: ≤400mm X 500mm
Solder Mask: Green, Red, Blue, Black, Yellow Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Tin, OSP
High Light:

FR4 PCB Board

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FR4 PCB Board

 

Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost

 

Today we're going to talk about hybrid PCB. We mainly refer to high frequency material mixed with epoxy glass.

Let’s see the stack-up to get idea about hybrid structure.

FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost 0

 

Layer 1 to layer 2 is the core of RO4350B high frequency material and layer 3 to layer 4 is the core of FR-4 epoxy glass. The 2 cores are bonded by a sheet of adhesive (prepreg).

 

Types of hybrid PCB

The hybrid PCB can be a mixture of FR-4 and high frequency material as abovementioned, another type is a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.

 

FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost 1

 

Why do we use hybrid PCB?

There're 3 main reasons that convince us to use this type of high frequency multilayer PCB, i.e. cost, reliability improved and electrical properties enhanced.

 

The cost of high frequency material is much higher than FR-4, sometimes, when using hybrid of FR-4 and high frequency material can solve the cost problem.

 

It causes reliability problems when the CTE value of the PCB material used is relatively high, while some high frequency materials have high CTE characteristics. When a low CTE FR-4 material is combined with a high CTE material to make a multilayer board, the composite CTE is acceptable, thus enhancing reliability.

 

Most of the time, some lines of the mixed PCB board require very high electrical performance, some do not require high, in this case, the parts with low electrical performance requirements will be used FR4, while the parts with high electrical performance requirements will use more expensive high frequency materials. Some using different DK of material to make mixed PCB, it is also to improve electrical properties, such as in some applications of combiners and filters, using different values of DK material.

 

FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost 2

                                                                                                           Micro-section of a hybrid PCB

 

Why choose FR-4?

Mixture of FR-4 and high frequency materials is becoming more and more common because FR-4 and the vast majority of high frequency materials have little compatibility problems.

 

FR-4 Hybrid PCB Stack-up Optimizes Signal Integrity and the PCB Cost 3

 

Lamination

To get a reliable lamination, we first choose PP sheet of high frequency material and use the correct pressing cycle. The adhesive layer of the same material is more favorable for the simpler pressing cycle.

 

Our PCB Capability
PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
  RO4003C + FR4;
  F4B + FR4;
  RT/duroid5880 + FR4;
  RT/duroid5880 + RO4350B
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP
   

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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