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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
  • name
  • name
  • name

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-045.V1.0
Base Material:
RO3006
Layer Count:
2 Layers
PCB Thickness:
0.3mm
PCB Size:
152 X 152mm=1PCS
Copper Weight:
0.5oz
Surface Finish:
Immersion Gold
Highlight:

ISO9001 RF PCB Board

,

10mil RF PCB Board

,

10mil RF Circuit Board

Product Description

 

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3006 circuit materials are composite materials made of ceramic-filled PTFE, specifically designed for use in commercial microwave and RF applications. These materials offer excellent electrical and mechanical stability while remaining cost-effective. Their consistent mechanical properties enable the development of multi-layer board designs without encountering issues such as warping or reliability problems. The coefficient of thermal expansion (CTE) of RO3006 materials in the X and Y axis is 17 ppm/℃, which is well-matched to that of copper. This compatibility ensures excellent dimensional stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking. In the Z-axis, the CTE is 24 ppm/℃, providing exceptional reliability for plated through-holes, even in harsh environments.

 

Here are some typical applications of RO3006 materials:

1) Automotive radar
2) Datalink on cable systems
3) Patch antenna for wireless communications
4) Power amplifiers and antennas
5) Remote meter readers

 

PCB Specifications

PCB SIZE 152 x 152mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3006 0.254mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 14 mil / 14 mil
Minimum / Maximum Holes: 0.4 mm / 4.0 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3006 0.254mm
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 0.3 mm ±0.1mm
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB 0

 

Data Sheet of Rogers 3006 (RO3006)

RO3006 Typical Value
Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   MΩ COND A IPC 2.5.17.1
Tensile Modulus 1498
1293		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
17
24		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
  • name
  • name
  • name
Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-045.V1.0
Base Material:
RO3006
Layer Count:
2 Layers
PCB Thickness:
0.3mm
PCB Size:
152 X 152mm=1PCS
Copper Weight:
0.5oz
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

ISO9001 RF PCB Board

,

10mil RF PCB Board

,

10mil RF Circuit Board

Product Description

 

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3006 circuit materials are composite materials made of ceramic-filled PTFE, specifically designed for use in commercial microwave and RF applications. These materials offer excellent electrical and mechanical stability while remaining cost-effective. Their consistent mechanical properties enable the development of multi-layer board designs without encountering issues such as warping or reliability problems. The coefficient of thermal expansion (CTE) of RO3006 materials in the X and Y axis is 17 ppm/℃, which is well-matched to that of copper. This compatibility ensures excellent dimensional stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking. In the Z-axis, the CTE is 24 ppm/℃, providing exceptional reliability for plated through-holes, even in harsh environments.

 

Here are some typical applications of RO3006 materials:

1) Automotive radar
2) Datalink on cable systems
3) Patch antenna for wireless communications
4) Power amplifiers and antennas
5) Remote meter readers

 

PCB Specifications

PCB SIZE 152 x 152mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3006 0.254mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 14 mil / 14 mil
Minimum / Maximum Holes: 0.4 mm / 4.0 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3006 0.254mm
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 0.3 mm ±0.1mm
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB 0

 

Data Sheet of Rogers 3006 (RO3006)

RO3006 Typical Value
Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   MΩ COND A IPC 2.5.17.1
Tensile Modulus 1498
1293		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
17
24		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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