|
Product Details:
Payment & Shipping Terms:
|
| Base Material: | RO3006 | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Thickness: | 0.3mm | PCB Size: | 152 X 152mm=1PCS |
| Copper Weight: | 0.5oz | Surface Finish: | Immersion Gold |
| Highlight: | ISO9001 RF PCB Board,10mil RF PCB Board,10mil RF Circuit Board |
||
Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO3006 circuit materials are composite materials made of ceramic-filled PTFE, specifically designed for use in commercial microwave and RF applications. These materials offer excellent electrical and mechanical stability while remaining cost-effective. Their consistent mechanical properties enable the development of multi-layer board designs without encountering issues such as warping or reliability problems. The coefficient of thermal expansion (CTE) of RO3006 materials in the X and Y axis is 17 ppm/℃, which is well-matched to that of copper. This compatibility ensures excellent dimensional stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking. In the Z-axis, the CTE is 24 ppm/℃, providing exceptional reliability for plated through-holes, even in harsh environments.
Here are some typical applications of RO3006 materials:
1) Automotive radar
2) Datalink on cable systems
3) Patch antenna for wireless communications
4) Power amplifiers and antennas
5) Remote meter readers
PCB Specifications
| PCB SIZE | 152 x 152mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RO3006 0.254mm | |
| copper ------- 18um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 14 mil / 14 mil |
| Minimum / Maximum Holes: | 0.4 mm / 4.0 mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 1 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3006 0.254mm |
| Final foil external: | 1 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1mm |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3006 (RO3006)
| RO3006 Typical Value | |||||
| Property | RO3006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.27 0.15 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1498 1293 |
X Y |
MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.86 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
17 17 24 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
