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Rogers RO3035 RF PCB Board Double Sided 30mil 0.762mm
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Rogers RO3035 RF PCB Board Double Sided 30mil 0.762mm
  • name
  • name
  • name

Rogers RO3035 RF PCB Board Double Sided 30mil 0.762mm

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-043.V1.0
Base Material:
RO3035
Layer Count:
2 Layers
PCB Thickness:
0.8mm
PCB Size:
140 X 52mm=20PCS
Copper Weight:
0.5oz
Surface Finish:
Immersion Gold
Highlight:

RO3035 RF PCB Board

,

30mil RF PCB Board

,

RO3035 Double Sided PCB

Product Description

 

Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Data Sheet of Rogers 3035 (RO3035)

RO3035 Typical Value
Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -45 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.11
0.11		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   MΩ COND A IPC 2.5.17.1
Tensile Modulus 1025
1006		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat     j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
17
24		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 10.2   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

 

Rogers RO3035 RF PCB Board Double Sided 30mil 0.762mm 0

 

PCB Specifications

PCB SIZE 140 x 52mm=20PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3035 0.762mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.5 mm / 5.0 mm
Number of Different Holes: 11
Number of Drill Holes: 125
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3035 0.762mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1mm
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Rogers RO3035 RF PCB Board Double Sided 30mil 0.762mm
  • name
  • name
  • name
Rogers RO3035 RF PCB Board Double Sided 30mil 0.762mm
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-043.V1.0
Base Material:
RO3035
Layer Count:
2 Layers
PCB Thickness:
0.8mm
PCB Size:
140 X 52mm=20PCS
Copper Weight:
0.5oz
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RO3035 RF PCB Board

,

30mil RF PCB Board

,

RO3035 Double Sided PCB

Product Description

 

Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Data Sheet of Rogers 3035 (RO3035)

RO3035 Typical Value
Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -45 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.11
0.11		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   MΩ COND A IPC 2.5.17.1
Tensile Modulus 1025
1006		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat     j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
17
24		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 10.2   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

 

Rogers RO3035 RF PCB Board Double Sided 30mil 0.762mm 0

 

PCB Specifications

PCB SIZE 140 x 52mm=20PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3035 0.762mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.5 mm / 5.0 mm
Number of Different Holes: 11
Number of Drill Holes: 125
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3035 0.762mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1mm
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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