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F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet
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F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet
  • name

F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
F4BM255
Laminate Thickness:
0.8 - 12mm
Laminate Size:
460X610mm; 500X600mm; 850X1200mm; 914X1220mm; 1000X1200mm 300X250mm; 350X380mm; 500X500mm; 840X840mm; 1000X1500mm
Copper Weight:
0.5oz(0.018mm); 1oz(0.035mm); 1.5oz(0.05mm); 2oz(0.07mm)
Highlight:

F4BM255 high frequency PCB laminate

,

copper clad sheet for PCBs

,

high frequency copper clad laminate

Product Description

F4BM255 is manufactured using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film through a scientifically formulated process and strict pressing techniques. Its electrical performance is enhanced compared to F4B, primarily reflected in a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and improved stability, making it a viable alternative to similar international products.

 

F4BM and F4BME share the same dielectric layer but differ in the copper foil used: F4BM is paired with ED copper foil, suitable for applications without PIM requirements.

 

F4BM and F4BME achieve precise dielectric constant control by adjusting the ratio between PTFE and fiberglass cloth, ensuring low loss while enhancing material dimensional stability. A higher dielectric constant corresponds to a higher fiberglass ratio, resulting in better dimensional stability, lower coefficient of thermal expansion (CTE), improved thermal drift performance, and relatively increased dielectric loss.

 

F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Product Features

  • DK selectable from 2.17 to 3.0, with customizable DK options available
  • Low loss
  • F4BME paired with RTF copper foil for excellent PIM performance
  • Diverse size options for cost efficiency
  • Radiation resistance, low outgassing
  • Commercial availability, high-volume production, cost-effective

 

 

Typical Applications

  • Microwave, RF, radar systems
  • Phase shifters, passive components
  • Power dividers, couplers, combiners
  • Feed networks, phased array antennas
  • Satellite communications, base station antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BM255
Dielectric Constant (Typical) 10GHz / 2.55
Dielectric Constant Tolerance / / ±0.05
Loss Tangent (Typical) 10GHz / 0.0013
20GHz / 0.0018
Dielectric Constant Temperature Coefficient -55ºC～150ºC PPM/℃ -110
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition MΩ ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >25
Breakdown Voltage (XY direction) 5KW,500V/s KV >34
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 16, 21
Z direction -55 º~288ºC ppm/ºC 173
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.25
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260
Thermal Conductivity Z direction W/(M.K) 0.33
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition / /

PTFE, Fiberglass Cloth

F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.
Tags: 

0.1mm Copper Clad Laminate,  

BME217 Copper Clad Laminate,  

12mm Copper Clad Laminate

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Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet
  • name
F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
F4BM255
Laminate Thickness:
0.8 - 12mm
Laminate Size:
460X610mm; 500X600mm; 850X1200mm; 914X1220mm; 1000X1200mm 300X250mm; 350X380mm; 500X500mm; 840X840mm; 1000X1500mm
Copper Weight:
0.5oz(0.018mm); 1oz(0.035mm); 1.5oz(0.05mm); 2oz(0.07mm)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

F4BM255 high frequency PCB laminate

,

copper clad sheet for PCBs

,

high frequency copper clad laminate

Product Description

F4BM255 is manufactured using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film through a scientifically formulated process and strict pressing techniques. Its electrical performance is enhanced compared to F4B, primarily reflected in a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and improved stability, making it a viable alternative to similar international products.

 

F4BM and F4BME share the same dielectric layer but differ in the copper foil used: F4BM is paired with ED copper foil, suitable for applications without PIM requirements.

 

F4BM and F4BME achieve precise dielectric constant control by adjusting the ratio between PTFE and fiberglass cloth, ensuring low loss while enhancing material dimensional stability. A higher dielectric constant corresponds to a higher fiberglass ratio, resulting in better dimensional stability, lower coefficient of thermal expansion (CTE), improved thermal drift performance, and relatively increased dielectric loss.

 

F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Product Features

  • DK selectable from 2.17 to 3.0, with customizable DK options available
  • Low loss
  • F4BME paired with RTF copper foil for excellent PIM performance
  • Diverse size options for cost efficiency
  • Radiation resistance, low outgassing
  • Commercial availability, high-volume production, cost-effective

 

 

Typical Applications

  • Microwave, RF, radar systems
  • Phase shifters, passive components
  • Power dividers, couplers, combiners
  • Feed networks, phased array antennas
  • Satellite communications, base station antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BM255
Dielectric Constant (Typical) 10GHz / 2.55
Dielectric Constant Tolerance / / ±0.05
Loss Tangent (Typical) 10GHz / 0.0013
20GHz / 0.0018
Dielectric Constant Temperature Coefficient -55ºC～150ºC PPM/℃ -110
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition MΩ ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >25
Breakdown Voltage (XY direction) 5KW,500V/s KV >34
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 16, 21
Z direction -55 º~288ºC ppm/ºC 173
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.25
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260
Thermal Conductivity Z direction W/(M.K) 0.33
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition / /

PTFE, Fiberglass Cloth

F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.
Tags: 

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

12mm Copper Clad Laminate

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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