logo
Products
PRODUCTS DETAILS
Home > Products >
AD255C PCB Material High Frequency Laminates Copper Clad Sheet
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
Contact Us
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Contact Now
AD255C PCB Material High Frequency Laminates Copper Clad Sheet
  • name

AD255C PCB Material High Frequency Laminates Copper Clad Sheet

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
AD255C
Laminate Thickness:
0.020” (0.508 Mm) +/- 0.002” 0.030” (0.762 Mm) +/- 0.002” 0.040” (1.016 Mm) +/- 0.002” 0.060” (1.524 Mm) +/- 0.002” 0.125” (3.175 Mm) +/- 0.006”
Laminate Size:
12”X 18”(305 X 457 Mm) 24”X 18”(610 X 457 Mm)
Copper Weight:
Electrodeposited Copper Foil ½ Oz. (18µm) 1oz. (35µm) Reverse Treated Electrodeposited Copper Foil ½ Oz. (18µm) 1oz. (35µm)
Highlight:

AD255C PCB high frequency laminate

,

copper clad sheet PCB material

,

high frequency copper clad laminates

Product Description

AD255C is a glass-reinforced, PTFE-based composite engineered to deliver a stable dielectric constant, low signal loss, and excellent passive intermodulation (PIM) performance. The woven glass construction enhances circuit processability and supports high-yield PCB fabrication.

 

AD255C meets the diverse requirements of modern antenna designs. This versatility, combined with precise dielectric control, ensures consistent impedance performance across production runs.

 

The material is offered with standard electrodeposited (ED) copper or reverse-treated ED copper foil, allowing designers to optimize for reduced circuit loss and improved PIM performance.

 

As a PTFE-based composite, AD255C exhibits exceptionally low loss—typically below 0.002 at 10 GHz—along with minimal moisture absorption (<0.1%) and high copper peel strength (>10 pli). These characteristics make AD Series laminates a reliable, high-performance solution for antenna applications.

 

AD255C PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

  1. Low loss tangent (<0.002 at 10 GHz) – Delivers excellent circuit performance across all common wireless frequency bands
  2. Controlled dielectric constant (±0.05) – Ensures repeatable and reliable circuit performance
  3. Very low PIM (-159 dBc at 30 mil, 1900 MHz) – Enhances antenna performance and minimizes yield loss due to PIM issues
  4. Excellent dimensional stability – Supports consistent circuit performance and improved manufacturing yields

 

Typical Applications

  1. Cellular infrastructure base station antennas
  2. Automotive telematics antenna systems
  3. Commercial satellite radio antennas

 

Properties AD255C Units Test Conditions Test Frequency / Details Test Method
Electrical Properties          
Dielectric Constant (process) 2.55 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant (design) 2.60 - C-24/23/50 10 GHz, Microstrip Differential Phase Length -
Dissipation Factor 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -110 ppm/°C 0 to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 7.4 × 10⁸ MΩ·cm C96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 3.6 × 10⁷ MΩ C96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 911 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
PIM -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz S1/S1 50 ohm Rogers Internal
Thermal Properties          
Decomposition Temperature (Td) >500 °C 2 hrs @ 105°C 5% Weight Loss IPC TM-650 2.3.40
CTE x 34 ppm/°C -55°C to 288°C - IPC TM-650 2.4.41
CTE y 26 ppm/°C -55°C to 288°C - IPC TM-650 2.4.41
CTE z 196 ppm/°C -55°C to 288°C - IPC TM-650 2.4.41
Thermal Conductivity 0.35 W/(m·K) - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288°C IPC TM-650 2.4.24.1
Mechanical Properties          
Copper Peel Strength 2.4 (13.6) N/mm (lbs/in) 10 s @288°C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 60.7/44.1 (8.8/6.4) MPa (ksi) 25°C ± 3°C - ASTM D790
Tensile Strength (MD, CMD) 55.8/45.5 (8.1/6.6) MPa (ksi) 23°C @ 50% RH - ASTM D3039/D3039-14
Flex Modulus 6412/5640 (930/818) MPa (ksi) 25°C ± 3°C - IPC-TM-650 2.4.4
Dimensional Stability (MD, CMD) 0.03/0.07 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties          
Flammability V-0 - - - UL 94
Moisture Absorption 0.03 % E1/105 + D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm³ C24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g·K 2 hours at 105°C - ASTM E2716
Tags: 

0.1mm Copper Clad Laminate,  

BME217 Copper Clad Laminate,  

12mm Copper Clad Laminate

Recommended Products
TLX-7 Substrate High Frequency Laminates Copper Clad Sheet

TLX-7 Substrate High Frequency Laminates Copper Clad Sheet

Contact Now
Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet

Rogers RO4725JXR Substrate High Frequency Laminates Copper Clad Sheet

Contact Now
F4BME255 Substrate High Frequency Laminates Copper Clad Sheet

F4BME255 Substrate High Frequency Laminates Copper Clad Sheet

Contact Now
F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet

F4BM255 PCB Material High Frequency Laminates Copper Clad Sheet

Contact Now
F4BTMS255 PCB Material High Frequency Laminates Copper Clad Sheet

F4BTMS255 PCB Material High Frequency Laminates Copper Clad Sheet

Contact Now
TLX-8 PCB Material High Frequency Laminates Copper Clad Sheet

TLX-8 PCB Material High Frequency Laminates Copper Clad Sheet

Contact Now
AD250C PCB Material High Frequency Laminates Copper Clad Sheet

AD250C PCB Material High Frequency Laminates Copper Clad Sheet

Contact Now
Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
AD255C PCB Material High Frequency Laminates Copper Clad Sheet
  • name
AD255C PCB Material High Frequency Laminates Copper Clad Sheet
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
AD255C
Laminate Thickness:
0.020” (0.508 Mm) +/- 0.002” 0.030” (0.762 Mm) +/- 0.002” 0.040” (1.016 Mm) +/- 0.002” 0.060” (1.524 Mm) +/- 0.002” 0.125” (3.175 Mm) +/- 0.006”
Laminate Size:
12”X 18”(305 X 457 Mm) 24”X 18”(610 X 457 Mm)
Copper Weight:
Electrodeposited Copper Foil ½ Oz. (18µm) 1oz. (35µm) Reverse Treated Electrodeposited Copper Foil ½ Oz. (18µm) 1oz. (35µm)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

AD255C PCB high frequency laminate

,

copper clad sheet PCB material

,

high frequency copper clad laminates

Product Description

AD255C is a glass-reinforced, PTFE-based composite engineered to deliver a stable dielectric constant, low signal loss, and excellent passive intermodulation (PIM) performance. The woven glass construction enhances circuit processability and supports high-yield PCB fabrication.

 

AD255C meets the diverse requirements of modern antenna designs. This versatility, combined with precise dielectric control, ensures consistent impedance performance across production runs.

 

The material is offered with standard electrodeposited (ED) copper or reverse-treated ED copper foil, allowing designers to optimize for reduced circuit loss and improved PIM performance.

 

As a PTFE-based composite, AD255C exhibits exceptionally low loss—typically below 0.002 at 10 GHz—along with minimal moisture absorption (<0.1%) and high copper peel strength (>10 pli). These characteristics make AD Series laminates a reliable, high-performance solution for antenna applications.

 

AD255C PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Features and Benefits

  1. Low loss tangent (<0.002 at 10 GHz) – Delivers excellent circuit performance across all common wireless frequency bands
  2. Controlled dielectric constant (±0.05) – Ensures repeatable and reliable circuit performance
  3. Very low PIM (-159 dBc at 30 mil, 1900 MHz) – Enhances antenna performance and minimizes yield loss due to PIM issues
  4. Excellent dimensional stability – Supports consistent circuit performance and improved manufacturing yields

 

Typical Applications

  1. Cellular infrastructure base station antennas
  2. Automotive telematics antenna systems
  3. Commercial satellite radio antennas

 

Properties AD255C Units Test Conditions Test Frequency / Details Test Method
Electrical Properties          
Dielectric Constant (process) 2.55 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant (design) 2.60 - C-24/23/50 10 GHz, Microstrip Differential Phase Length -
Dissipation Factor 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -110 ppm/°C 0 to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 7.4 × 10⁸ MΩ·cm C96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 3.6 × 10⁷ MΩ C96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 911 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
PIM -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz S1/S1 50 ohm Rogers Internal
Thermal Properties          
Decomposition Temperature (Td) >500 °C 2 hrs @ 105°C 5% Weight Loss IPC TM-650 2.3.40
CTE x 34 ppm/°C -55°C to 288°C - IPC TM-650 2.4.41
CTE y 26 ppm/°C -55°C to 288°C - IPC TM-650 2.4.41
CTE z 196 ppm/°C -55°C to 288°C - IPC TM-650 2.4.41
Thermal Conductivity 0.35 W/(m·K) - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288°C IPC TM-650 2.4.24.1
Mechanical Properties          
Copper Peel Strength 2.4 (13.6) N/mm (lbs/in) 10 s @288°C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 60.7/44.1 (8.8/6.4) MPa (ksi) 25°C ± 3°C - ASTM D790
Tensile Strength (MD, CMD) 55.8/45.5 (8.1/6.6) MPa (ksi) 23°C @ 50% RH - ASTM D3039/D3039-14
Flex Modulus 6412/5640 (930/818) MPa (ksi) 25°C ± 3°C - IPC-TM-650 2.4.4
Dimensional Stability (MD, CMD) 0.03/0.07 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties          
Flammability V-0 - - - UL 94
Moisture Absorption 0.03 % E1/105 + D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm³ C24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g·K 2 hours at 105°C - ASTM E2716
Tags: 

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

12mm Copper Clad Laminate

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2026 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.