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TLX-8 PCB Material High Frequency Laminates Copper Clad Sheet

TLX-8 PCB Material High Frequency Laminates Copper Clad Sheet

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
TLX-8
Laminate Thickness:
0.064 - 6.35mm
Laminate Size:
12 X 18 305 X 457 24 X 36 610 X 914 16 X 18 406 X 457 18 X 48 457 X 1,220 18 X 24 457 X 610 36 X 48 914 X 1,220 16 X 36 406 X 914
Copper Weight:
0.5 Oz. (18µm) 1oz. (35µm)
Highlight:

TLX-8 PCB high frequency laminates

,

copper clad sheet with warranty

,

high frequency copper clad laminates

Product Description

TLX-8 delivers consistent and dependable performance across a broad spectrum of RF applications. Its versatility stems from a customizable 2.45–2.65 dielectric constant range, along with multiple thickness and copper cladding options, making it especially well-suited for low-layer-count microwave designs.

 

As a PTFE fiberglass laminate, TLX-8 is ideal for use in radar systems, mobile communications, microwave test equipment, transmission devices, and various RF components. It serves as a reliable workhorse in the RF microwave substrate industry, with fiberglass reinforcement providing critical mechanical stability in demanding environments, including:

 

- Creep resistance for PWBs mounted in housings subject to intense vibration during space launch
- Endurance in high-temperature engine modules
- Radiation tolerance in space applications (see NASA’s low outgassing materials database)
- Resistance to extreme marine conditions for naval antenna systems
- Stable performance across wide temperature fluctuations in airborne altimeter applications

 

The material’s broad dielectric constant range enables the efficient manufacture of couplers, splitters, combiners, amplifiers, antennas, and other critical components.

 

TLX-8 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Benefits
- Excellent PIM performance in PCBs (measured below -160 dBc)
- Superior mechanical and thermal properties
- Low and stable dielectric constant
- Excellent dimensional stability
- Minimal moisture absorption
- Tightly controlled DK for consistent performance
- Low dissipation factor (DF)
- UL 94 V-0 flammability rating
- Optimized for low-layer-count microwave designs

 

Applications
- Antennas
- Mixers, splitters, filters, and combiners
- Passive RF components

 

Dielectric Thickness
Inches mm
0.0025 - 0.250 0.064 - 6.35
Available Sheet Sizes
Inches mm Inches mm
12 x 18 305 x 457 24 x 36 610 x 914
16 x 18 406 x 457 18 x 48 457 x 1,220
18 x 24 457 x 610 36 x 48 914 x 1,220
16 x 36 406 x 914    

 

Properties Conditions Typical Value Unit Test Method
Electrical Properties        
Dielectric Constant @ 10 GHz 2.55 ± 0.04 - IPC-650 2.5.5.3
Dissipation Factor @ 10 GHz 0.0018 - IPC-650 2.5.5.5.1
Outgassing % TML4 H 257 °F @ ≤5×10⁻⁵ Torr 0.03 % ASTM E 595
  % CVCM 0.00 %  
  % WVR 0.01 %  
Surface Resistivity Elevated Temp. 6.605×10⁸ Mohm IPC-650 2.5.17.1 Sec.5.2.1
  Humidity Cond. 3.550×10⁶ Mohm IPC-650 2.5.17.1 Sec.5.2.1
Volume Resistivity Elevated Temp. 1.110×10¹⁰ Mohm·cm IPC-650 2.5.17.1 Sec.5.2.1
  Humidity Cond. 1.046×10¹⁰ Mohm·cm IPC-650 2.5.17.1 Sec.5.2.1
Dielectric Breakdown   >45 kV IPC-650 2.5.6
Dimensional Stability        
Dimensional Stability MD After Bake 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec.5.4
  CD After Bake 0.08 mm/M (mils/in)  
  MD Thermal Stress 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec.5.5
  CD Thermal Stress 0.10 mm/M (mils/in)  
Thermal Properties        
Thermal Conductivity   0.19 W/(m·K) ASTM F433 / ASTM 1530-06
CTE (25–260 °C) X 21 ppm/°C IPC-650 2.4.41 / ASTM D 3386
  Y 23 ppm/°C  
  Z 215 ppm/°C  
Td 2% Weight Loss 535 °C IPC-650 2.4.24.6 (TGA)
  5% Weight Loss 553 °C  
Mechanical Properties        
Peel Strength 1 oz. ED (Thermal Stress) 2.63 (15) N/mm (lbs/in) IPC-650 2.4.8 Sec.5.2.2
  1 oz. RTF 2.98 (17) N/mm² (kpsi)  
  ½ oz. ED (Elevated Temp.) 2.45 (14) N/mm² (kpsi) IPC-650 2.4.8.3
  ½ oz. ED (Thermal Stress) 1.93 (11) N/mm² (kpsi) IPC-650 2.4.8 Sec.5.2.2
  1 oz. rolled 2.28 (13) N/mm² (kpsi)  
Young’s Modulus MD 6,757 (980) N/mm² (psi) ASTM D 902
  CD 8,274 (1,200) N/mm² (psi)  
  MD 11,238 (1,630) N/mm² (psi) ASTM D 3039
Chemical / Physical Properties        
Moisture Absorption   0.02 % IPC-650 2.6.2.1
Flammability Rating   V-0 - UL-94
Products
PRODUCTS DETAILS
TLX-8 PCB Material High Frequency Laminates Copper Clad Sheet
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
TLX-8
Laminate Thickness:
0.064 - 6.35mm
Laminate Size:
12 X 18 305 X 457 24 X 36 610 X 914 16 X 18 406 X 457 18 X 48 457 X 1,220 18 X 24 457 X 610 36 X 48 914 X 1,220 16 X 36 406 X 914
Copper Weight:
0.5 Oz. (18µm) 1oz. (35µm)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

TLX-8 PCB high frequency laminates

,

copper clad sheet with warranty

,

high frequency copper clad laminates

Product Description

TLX-8 delivers consistent and dependable performance across a broad spectrum of RF applications. Its versatility stems from a customizable 2.45–2.65 dielectric constant range, along with multiple thickness and copper cladding options, making it especially well-suited for low-layer-count microwave designs.

 

As a PTFE fiberglass laminate, TLX-8 is ideal for use in radar systems, mobile communications, microwave test equipment, transmission devices, and various RF components. It serves as a reliable workhorse in the RF microwave substrate industry, with fiberglass reinforcement providing critical mechanical stability in demanding environments, including:

 

- Creep resistance for PWBs mounted in housings subject to intense vibration during space launch
- Endurance in high-temperature engine modules
- Radiation tolerance in space applications (see NASA’s low outgassing materials database)
- Resistance to extreme marine conditions for naval antenna systems
- Stable performance across wide temperature fluctuations in airborne altimeter applications

 

The material’s broad dielectric constant range enables the efficient manufacture of couplers, splitters, combiners, amplifiers, antennas, and other critical components.

 

TLX-8 PCB Material High Frequency Laminates Copper Clad Sheet 0

 

Benefits
- Excellent PIM performance in PCBs (measured below -160 dBc)
- Superior mechanical and thermal properties
- Low and stable dielectric constant
- Excellent dimensional stability
- Minimal moisture absorption
- Tightly controlled DK for consistent performance
- Low dissipation factor (DF)
- UL 94 V-0 flammability rating
- Optimized for low-layer-count microwave designs

 

Applications
- Antennas
- Mixers, splitters, filters, and combiners
- Passive RF components

 

Dielectric Thickness
Inches mm
0.0025 - 0.250 0.064 - 6.35
Available Sheet Sizes
Inches mm Inches mm
12 x 18 305 x 457 24 x 36 610 x 914
16 x 18 406 x 457 18 x 48 457 x 1,220
18 x 24 457 x 610 36 x 48 914 x 1,220
16 x 36 406 x 914    

 

Properties Conditions Typical Value Unit Test Method
Electrical Properties        
Dielectric Constant @ 10 GHz 2.55 ± 0.04 - IPC-650 2.5.5.3
Dissipation Factor @ 10 GHz 0.0018 - IPC-650 2.5.5.5.1
Outgassing % TML4 H 257 °F @ ≤5×10⁻⁵ Torr 0.03 % ASTM E 595
  % CVCM 0.00 %  
  % WVR 0.01 %  
Surface Resistivity Elevated Temp. 6.605×10⁸ Mohm IPC-650 2.5.17.1 Sec.5.2.1
  Humidity Cond. 3.550×10⁶ Mohm IPC-650 2.5.17.1 Sec.5.2.1
Volume Resistivity Elevated Temp. 1.110×10¹⁰ Mohm·cm IPC-650 2.5.17.1 Sec.5.2.1
  Humidity Cond. 1.046×10¹⁰ Mohm·cm IPC-650 2.5.17.1 Sec.5.2.1
Dielectric Breakdown   >45 kV IPC-650 2.5.6
Dimensional Stability        
Dimensional Stability MD After Bake 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec.5.4
  CD After Bake 0.08 mm/M (mils/in)  
  MD Thermal Stress 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec.5.5
  CD Thermal Stress 0.10 mm/M (mils/in)  
Thermal Properties        
Thermal Conductivity   0.19 W/(m·K) ASTM F433 / ASTM 1530-06
CTE (25–260 °C) X 21 ppm/°C IPC-650 2.4.41 / ASTM D 3386
  Y 23 ppm/°C  
  Z 215 ppm/°C  
Td 2% Weight Loss 535 °C IPC-650 2.4.24.6 (TGA)
  5% Weight Loss 553 °C  
Mechanical Properties        
Peel Strength 1 oz. ED (Thermal Stress) 2.63 (15) N/mm (lbs/in) IPC-650 2.4.8 Sec.5.2.2
  1 oz. RTF 2.98 (17) N/mm² (kpsi)  
  ½ oz. ED (Elevated Temp.) 2.45 (14) N/mm² (kpsi) IPC-650 2.4.8.3
  ½ oz. ED (Thermal Stress) 1.93 (11) N/mm² (kpsi) IPC-650 2.4.8 Sec.5.2.2
  1 oz. rolled 2.28 (13) N/mm² (kpsi)  
Young’s Modulus MD 6,757 (980) N/mm² (psi) ASTM D 902
  CD 8,274 (1,200) N/mm² (psi)  
  MD 11,238 (1,630) N/mm² (psi) ASTM D 3039
Chemical / Physical Properties        
Moisture Absorption   0.02 % IPC-650 2.6.2.1
Flammability Rating   V-0 - UL-94
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