logo
products
PRODUCTS DETAILS
Home > Products >
4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Contact Us
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Contact Now
4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material
  • name

4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers RT/duroid 5880 Core + TG170 FR-4 Prepreg
Layer Count:
4-layer
PCB Thickness:
0.833mm
PCB Size:
126mm × 63mm
Silkscreen:
No
Solder Mask:
Green Solder Mask
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Silver
Highlight:

10mil Hybrid PCB

,

RT duroid 5880 Hybrid PCB

,

4-layer Hybrid PCB

Product Description

This 4-layer rigid PCB uses Rogers RT/duroid 5880 (glass microfiber reinforced PTFE composite) as the core substrate, laminated with TG170 FR-4 prepreg. Specifically designed for high-precision stripline and microstrip circuits, RT/duroid 5880 features uniform dielectric constant (panel-to-panel and wide frequency range) and low dissipation factor (applicable to Ku-band and above). With excellent dielectric properties and lead-free compatibility, it meets rigorous high-frequency transmission requirements, suitable for precision RF, microwave and millimeter wave applications.

 

PCB Specifications

Parameter Details
Layer Count 4-Layer (rigid structure)
Base Material Rogers RT/duroid 5880 core + TG170 FR-4 prepreg
Board Dimensions 126mm × 63mm per piece (1PCS), tolerance ±0.15mm (typical)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.2mm (via hole); Pad size: 0.5mm
Vias Through holes only; No blind or buried vias
Finished Board Thickness 0.833mm
Finished Copper Weight Outer layers: 1oz (35μm); Inner layers: 0.5oz (18μm)
Surface Finish Immersion Silver
Silkscreen No silkscreen
Solder Mask Green solder mask
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Top Core Substrate Rogers RT duroid 5880 Core 0.254mm (10 mil)
Inner Copper Layer 1 (Copper_layer_2) Copper 18 μm
Prepreg Layer 1 TG170 FR-4 Prepreg 0.12mm
Prepreg Layer 2 TG170 FR-4 Prepreg 0.12mm
Inner Copper Layer 2 (Copper_layer_3) Copper 18 μm
Bottom Core Substrate Rogers RT duroid 5880 Core 0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_4) Copper 35 μm

 

Rogers RT/duroid 5880 Material Introduction

Rogers RT/duroid 5880 is a high-performance PTFE-based composite laminate, renowned for its excellent dielectric properties and stable electrical performance across a wide frequency range (8 GHz to 40 GHz). It exhibits ultra-low dielectric loss, low moisture absorption, and superior thermal stability, making it an ideal choice for high-frequency RF and microwave applications. The material is fully compatible with lead-free processes and meets UL 94 V-0 flammability requirements, ensuring reliable fabrication and long-term operational stability.

 

The combination of PTFE matrix and reinforcing fibers endows RT/duroid 5880 with excellent mechanical properties, including high tensile and compressive strength, as well as good copper peel strength. Its low thermal expansion coefficient and stable temperature coefficient of dielectric constant ensure consistent performance under extreme temperature conditions (-50℃ to 150℃), making it suitable for harsh environment applications such as aerospace and high-reliability communication systems.

 

4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material 0

 

Key Material Features

Property Specification
Material Composition PTFE-based composite laminate
Dielectric Constant (εProcess) 2.20 (2.20±0.02 spec.)
Dielectric Constant (εDesign) 2.2 (8 GHz to 40 GHz)
Dissipation Factor (tanδ) 0.0004 (1 MHz) / 0.0009 (10 GHz)
Thermal Coefficient of ε -125 ppm/℃ (-50℃ to 150℃)
Volume Resistivity 2×10⁷ Mohm·cm
Surface Resistivity 3×10⁷ Mohm
Specific Heat 0.96 j/g/k (0.23 cal/g/℃)
Tensile Modulus X: 1070 MPa (156 kpsi) @23℃; 450 MPa (65 kpsi) @100℃; Y: 860 MPa (125 kpsi) @23℃; 380 MPa (55 kpsi) @100℃
Ultimate Stress X: 29 MPa (4.2 kpsi) @23℃; 20 MPa (2.9 kpsi) @100℃; Y: 27 MPa (3.9 kpsi) @23℃; 18 MPa (2.6 kpsi) @100℃
Ultimate Strain X: 6% @23℃; 7.2% @100℃; Y: 4.9% @23℃; 5.8% @100℃
Compressive Modulus X/Y: 710 MPa (103 kpsi) @23℃; 500 MPa (73 kpsi) @100℃; Z: 940 MPa (136 kpsi) @23℃; 670 MPa (97 kpsi) @100℃
Moisture Absorption 0.02%
Thermal Conductivity 0.2 W/m/k (80℃)
Coefficient of Thermal Expansion (CTE) X: 31 ppm/℃; Y: 48 ppm/℃; Z: 237 ppm/℃ (0-100℃)
Decomposition Temperature (Td) 500℃
Density 2.2 gm/cm³
Copper Peel Strength 31.2 Pli (5.5 N/mm)
Flammability V-0 (UL 94)
Lead-free Process Compatibility Yes

 

Core Benefits

Ultra-low dielectric loss: tanδ down to 0.0004, minimal high-frequency signal attenuation

 

Stable dielectric constant: ε=2.2±0.02, enabling precise impedance control

 

Excellent thermal stability: Td=500℃, stable performance over wide temperature range

 

Low moisture absorption: 0.02%, reducing humidity-induced performance degradation

 

Lead-free compatible: Meets modern manufacturing requirements, eco-friendly

 

Superior mechanical properties: High tensile/compressive strength and copper peel strength

 

Flame retardant: UL 94 V-0 rating, high application safety

 

Wide frequency adaptability: Stable performance at 8-40 GHz for diverse RF/microwave systems

 

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.

 

Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

Commercial airline broadband antennas

Microstrip circuits

Stripline circuits

Millimeter wave applications

Military radar systems

Missile guidance systems

Point to point digital radio antennas

Other related high-frequency applications

 

4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material 1

Tags: 

2oz Multi Layer PCB,  

4 Layers Multilayer Circuit Board,  

0.8mm Multilayer Circuit Board

Recommended Products
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

Contact Now
6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

Contact Now
Rogers 4003 High Frequency 0.5oz Multi Layer PCB UL 4-Layer PCB

Rogers 4003 High Frequency 0.5oz Multi Layer PCB UL 4-Layer PCB

Contact Now
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Contact Now
4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4

4 Layer Hybrid PCB Board Built On Rogers 10mil RO4350B and FR-4

Contact Now
30mil RT duroid 6035HTC PCB Double-layer with Immersion Gold

30mil RT duroid 6035HTC PCB Double-layer with Immersion Gold

Contact Now
High-Performance 6-Layer PCB with RO4003C and FR-4 Hybrid Construction

High-Performance 6-Layer PCB with RO4003C and FR-4 Hybrid Construction

Contact Now
products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material
  • name
4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers RT/duroid 5880 Core + TG170 FR-4 Prepreg
Layer Count:
4-layer
PCB Thickness:
0.833mm
PCB Size:
126mm × 63mm
Silkscreen:
No
Solder Mask:
Green Solder Mask
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Silver
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

10mil Hybrid PCB

,

RT duroid 5880 Hybrid PCB

,

4-layer Hybrid PCB

Product Description

This 4-layer rigid PCB uses Rogers RT/duroid 5880 (glass microfiber reinforced PTFE composite) as the core substrate, laminated with TG170 FR-4 prepreg. Specifically designed for high-precision stripline and microstrip circuits, RT/duroid 5880 features uniform dielectric constant (panel-to-panel and wide frequency range) and low dissipation factor (applicable to Ku-band and above). With excellent dielectric properties and lead-free compatibility, it meets rigorous high-frequency transmission requirements, suitable for precision RF, microwave and millimeter wave applications.

 

PCB Specifications

Parameter Details
Layer Count 4-Layer (rigid structure)
Base Material Rogers RT/duroid 5880 core + TG170 FR-4 prepreg
Board Dimensions 126mm × 63mm per piece (1PCS), tolerance ±0.15mm (typical)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.2mm (via hole); Pad size: 0.5mm
Vias Through holes only; No blind or buried vias
Finished Board Thickness 0.833mm
Finished Copper Weight Outer layers: 1oz (35μm); Inner layers: 0.5oz (18μm)
Surface Finish Immersion Silver
Silkscreen No silkscreen
Solder Mask Green solder mask
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Top Core Substrate Rogers RT duroid 5880 Core 0.254mm (10 mil)
Inner Copper Layer 1 (Copper_layer_2) Copper 18 μm
Prepreg Layer 1 TG170 FR-4 Prepreg 0.12mm
Prepreg Layer 2 TG170 FR-4 Prepreg 0.12mm
Inner Copper Layer 2 (Copper_layer_3) Copper 18 μm
Bottom Core Substrate Rogers RT duroid 5880 Core 0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_4) Copper 35 μm

 

Rogers RT/duroid 5880 Material Introduction

Rogers RT/duroid 5880 is a high-performance PTFE-based composite laminate, renowned for its excellent dielectric properties and stable electrical performance across a wide frequency range (8 GHz to 40 GHz). It exhibits ultra-low dielectric loss, low moisture absorption, and superior thermal stability, making it an ideal choice for high-frequency RF and microwave applications. The material is fully compatible with lead-free processes and meets UL 94 V-0 flammability requirements, ensuring reliable fabrication and long-term operational stability.

 

The combination of PTFE matrix and reinforcing fibers endows RT/duroid 5880 with excellent mechanical properties, including high tensile and compressive strength, as well as good copper peel strength. Its low thermal expansion coefficient and stable temperature coefficient of dielectric constant ensure consistent performance under extreme temperature conditions (-50℃ to 150℃), making it suitable for harsh environment applications such as aerospace and high-reliability communication systems.

 

4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material 0

 

Key Material Features

Property Specification
Material Composition PTFE-based composite laminate
Dielectric Constant (εProcess) 2.20 (2.20±0.02 spec.)
Dielectric Constant (εDesign) 2.2 (8 GHz to 40 GHz)
Dissipation Factor (tanδ) 0.0004 (1 MHz) / 0.0009 (10 GHz)
Thermal Coefficient of ε -125 ppm/℃ (-50℃ to 150℃)
Volume Resistivity 2×10⁷ Mohm·cm
Surface Resistivity 3×10⁷ Mohm
Specific Heat 0.96 j/g/k (0.23 cal/g/℃)
Tensile Modulus X: 1070 MPa (156 kpsi) @23℃; 450 MPa (65 kpsi) @100℃; Y: 860 MPa (125 kpsi) @23℃; 380 MPa (55 kpsi) @100℃
Ultimate Stress X: 29 MPa (4.2 kpsi) @23℃; 20 MPa (2.9 kpsi) @100℃; Y: 27 MPa (3.9 kpsi) @23℃; 18 MPa (2.6 kpsi) @100℃
Ultimate Strain X: 6% @23℃; 7.2% @100℃; Y: 4.9% @23℃; 5.8% @100℃
Compressive Modulus X/Y: 710 MPa (103 kpsi) @23℃; 500 MPa (73 kpsi) @100℃; Z: 940 MPa (136 kpsi) @23℃; 670 MPa (97 kpsi) @100℃
Moisture Absorption 0.02%
Thermal Conductivity 0.2 W/m/k (80℃)
Coefficient of Thermal Expansion (CTE) X: 31 ppm/℃; Y: 48 ppm/℃; Z: 237 ppm/℃ (0-100℃)
Decomposition Temperature (Td) 500℃
Density 2.2 gm/cm³
Copper Peel Strength 31.2 Pli (5.5 N/mm)
Flammability V-0 (UL 94)
Lead-free Process Compatibility Yes

 

Core Benefits

Ultra-low dielectric loss: tanδ down to 0.0004, minimal high-frequency signal attenuation

 

Stable dielectric constant: ε=2.2±0.02, enabling precise impedance control

 

Excellent thermal stability: Td=500℃, stable performance over wide temperature range

 

Low moisture absorption: 0.02%, reducing humidity-induced performance degradation

 

Lead-free compatible: Meets modern manufacturing requirements, eco-friendly

 

Superior mechanical properties: High tensile/compressive strength and copper peel strength

 

Flame retardant: UL 94 V-0 rating, high application safety

 

Wide frequency adaptability: Stable performance at 8-40 GHz for diverse RF/microwave systems

 

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.

 

Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

Commercial airline broadband antennas

Microstrip circuits

Stripline circuits

Millimeter wave applications

Military radar systems

Missile guidance systems

Point to point digital radio antennas

Other related high-frequency applications

 

4-layer Hybrid PCB on 10mil RT duroid 5880 and High TG -FR4 Material 1

Tags: 

2oz Multi Layer PCB,

4 Layers Multilayer Circuit Board,

0.8mm Multilayer Circuit Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.