This 4-layer rigid PCB uses Rogers RT/duroid 5880 (glass microfiber reinforced PTFE composite) as the core substrate, laminated with TG170 FR-4 prepreg. Specifically designed for high-precision stripline and microstrip circuits, RT/duroid 5880 features uniform dielectric constant (panel-to-panel and wide frequency range) and low dissipation factor (applicable to Ku-band and above). With excellent dielectric properties and lead-free compatibility, it meets rigorous high-frequency transmission requirements, suitable for precision RF, microwave and millimeter wave applications.
PCB Specifications
| Parameter |
Details |
| Layer Count |
4-Layer (rigid structure) |
| Base Material |
Rogers RT/duroid 5880 core + TG170 FR-4 prepreg |
| Board Dimensions |
126mm × 63mm per piece (1PCS), tolerance ±0.15mm (typical) |
| Minimum Trace/Space |
5 mils (trace) / 5 mils (space) |
| Minimum Hole Size |
0.2mm (via hole); Pad size: 0.5mm |
| Vias |
Through holes only; No blind or buried vias |
| Finished Board Thickness |
0.833mm |
| Finished Copper Weight |
Outer layers: 1oz (35μm); Inner layers: 0.5oz (18μm) |
| Surface Finish |
Immersion Silver |
| Silkscreen |
No silkscreen |
| Solder Mask |
Green solder mask |
| Quality Assurance |
100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name |
Material |
Thickness |
| Top Copper Layer (Copper_layer_1) |
Copper |
35 μm |
| Top Core Substrate |
Rogers RT duroid 5880 Core |
0.254mm (10 mil) |
| Inner Copper Layer 1 (Copper_layer_2) |
Copper |
18 μm |
| Prepreg Layer 1 |
TG170 FR-4 Prepreg |
0.12mm |
| Prepreg Layer 2 |
TG170 FR-4 Prepreg |
0.12mm |
| Inner Copper Layer 2 (Copper_layer_3) |
Copper |
18 μm |
| Bottom Core Substrate |
Rogers RT duroid 5880 Core |
0.254mm (10 mil) |
| Bottom Copper Layer (Copper_layer_4) |
Copper |
35 μm |
Rogers RT/duroid 5880 Material Introduction
Rogers RT/duroid 5880 is a high-performance PTFE-based composite laminate, renowned for its excellent dielectric properties and stable electrical performance across a wide frequency range (8 GHz to 40 GHz). It exhibits ultra-low dielectric loss, low moisture absorption, and superior thermal stability, making it an ideal choice for high-frequency RF and microwave applications. The material is fully compatible with lead-free processes and meets UL 94 V-0 flammability requirements, ensuring reliable fabrication and long-term operational stability.
The combination of PTFE matrix and reinforcing fibers endows RT/duroid 5880 with excellent mechanical properties, including high tensile and compressive strength, as well as good copper peel strength. Its low thermal expansion coefficient and stable temperature coefficient of dielectric constant ensure consistent performance under extreme temperature conditions (-50℃ to 150℃), making it suitable for harsh environment applications such as aerospace and high-reliability communication systems.
Key Material Features
| Property |
Specification |
| Material Composition |
PTFE-based composite laminate |
| Dielectric Constant (εProcess) |
2.20 (2.20±0.02 spec.) |
| Dielectric Constant (εDesign) |
2.2 (8 GHz to 40 GHz) |
| Dissipation Factor (tanδ) |
0.0004 (1 MHz) / 0.0009 (10 GHz) |
| Thermal Coefficient of ε |
-125 ppm/℃ (-50℃ to 150℃) |
| Volume Resistivity |
2×10⁷ Mohm·cm |
| Surface Resistivity |
3×10⁷ Mohm |
| Specific Heat |
0.96 j/g/k (0.23 cal/g/℃) |
| Tensile Modulus |
X: 1070 MPa (156 kpsi) @23℃; 450 MPa (65 kpsi) @100℃; Y: 860 MPa (125 kpsi) @23℃; 380 MPa (55 kpsi) @100℃ |
| Ultimate Stress |
X: 29 MPa (4.2 kpsi) @23℃; 20 MPa (2.9 kpsi) @100℃; Y: 27 MPa (3.9 kpsi) @23℃; 18 MPa (2.6 kpsi) @100℃ |
| Ultimate Strain |
X: 6% @23℃; 7.2% @100℃; Y: 4.9% @23℃; 5.8% @100℃ |
| Compressive Modulus |
X/Y: 710 MPa (103 kpsi) @23℃; 500 MPa (73 kpsi) @100℃; Z: 940 MPa (136 kpsi) @23℃; 670 MPa (97 kpsi) @100℃ |
| Moisture Absorption |
0.02% |
| Thermal Conductivity |
0.2 W/m/k (80℃) |
| Coefficient of Thermal Expansion (CTE) |
X: 31 ppm/℃; Y: 48 ppm/℃; Z: 237 ppm/℃ (0-100℃) |
| Decomposition Temperature (Td) |
500℃ |
| Density |
2.2 gm/cm³ |
| Copper Peel Strength |
31.2 Pli (5.5 N/mm) |
| Flammability |
V-0 (UL 94) |
| Lead-free Process Compatibility |
Yes |
Core Benefits
Ultra-low dielectric loss: tanδ down to 0.0004, minimal high-frequency signal attenuation
Stable dielectric constant: ε=2.2±0.02, enabling precise impedance control
Excellent thermal stability: Td=500℃, stable performance over wide temperature range
Low moisture absorption: 0.02%, reducing humidity-induced performance degradation
Lead-free compatible: Meets modern manufacturing requirements, eco-friendly
Superior mechanical properties: High tensile/compressive strength and copper peel strength
Flame retardant: UL 94 V-0 rating, high application safety
Wide frequency adaptability: Stable performance at 8-40 GHz for diverse RF/microwave systems
Quality Standard & Availability
Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.
Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.
Typical Applications
Commercial airline broadband antennas
Microstrip circuits
Stripline circuits
Millimeter wave applications
Military radar systems
Missile guidance systems
Point to point digital radio antennas
Other related high-frequency applications
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