This 4-layer hybrid PCB is specifically engineered for high-performance electronic applications, integrating Rogers RO4350B and TG170 FR-4 materials. It leverages the superior electrical performance of RO4350B (close to PTFE/woven glass) and the reliable manufacturability of TG170 FR-4, making it ideal for multi-layer board constructions requiring stable signal transmission and excellent dimensional stability.
PCB Specification
| Parameter |
Details |
| Layer Count |
4-Layer (rigid structure) |
| Base Material |
Rogers RO4350B (proprietary woven glass reinforced hydrocarbon/ceramic laminate) + TG170 FR-4 |
| Board Dimensions |
80.22mm × 90mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space |
4 mils (trace) / 6 mils (space) |
| Minimum Hole Size |
0.3mm |
| Vias |
No blind vias / buried vias; total vias: 125; via plating thickness: 20 μm |
| Finished Board Thickness |
0.98mm |
| Finished Copper Weight |
0.5oz (0.7 mils) for inner layers; 1oz for outer layers |
| Surface Finish |
Immersion gold |
| Silkscreen |
White on top layer; White on bottom layer |
| Solder Mask |
Green on top layer; Green on bottom layer |
| Quality Assurance |
100% electrical testing before shipment |
PCB Stack-up
| Layer Name |
Material |
Thickness |
| Top Layer (Copper_layer_1) |
Copper |
35 μm |
| Substrate Layer 1 |
Rogers RO4350B Core |
0.508mm (20 mil) |
| Inner Layer 1 (Copper_layer_2) |
Copper |
18 μm |
| Bonding Layer |
FR-4 Prepreg |
0.2mm |
| Inner Layer 2 (Copper_layer_3) |
Copper |
18 μm |
| Substrate Layer 2 |
Tg170 FR-4 Core |
0.102mm (4 mil) |
| Bottom Layer (Copper_layer_4) |
Copper |
35 μm |
Rogers RO4350B Material Introduction
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/glass. RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.
This PCB combines RO4350B with TG170 FR-4 to further optimize the balance between performance and cost for 4-layer rigid board applications.
Key Material Features
| Feature |
Specification/Description |
| Dielectric Constant (Dk) |
3.48 ± 0.05 at 10GHz/23°C (RO4350B) |
| Dissipation Factor |
0.0037 at 10GHz/23°C (RO4350B) |
| Thermal Conductivity |
0.69 W/m/°K (RO4350B) |
| Coefficient of Thermal Expansion (CTE) |
X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 32 ppm/°C (RO4350B) |
| Glass Transition Temperature (Tg) |
>280 °C (RO4350B); 170 °C (TG170 FR-4) |
| Water Absorption |
0.06% (low water absorption, RO4350B) |
| Flammability Rating |
UL 94 V-0 rated (RO4350B) |
| Layer Structure |
4-layer rigid construction with RO4350B core, TG170 FR-4 core and FR-4 prepreg |
| Surface Finish |
Immersion gold, ensuring excellent solderability and corrosion resistance |
| Solder Mask & Silkscreen |
Green solder mask on both layers; white silkscreen on both layers, facilitating component assembly and identification |
Core Benefits
Ideal for Multi-layer Board (MLB) Constructions: The combined use of RO4350B and TG170 FR-4 is well-suited for 4-layer board designs, meeting complex circuit requirements.
Cost-Effective Fabrication: Processes like FR-4 at lower fabrication cost compared to conventional microwave laminates, reducing production expenses.
Excellent Dimensional Stability: RO4350B's CTE is similar to copper, ensuring superior dimensional stability even in harsh thermal environments.
Reliable Through-Hole Quality: Low Z-axis CTE of RO4350B provides reliable plated through-hole quality, suitable for severe thermal shock applications.
Competitive Pricing: Balances high performance with cost-effectiveness, offering competitive advantages in mass production.
Stable Thermal Performance: High Tg of RO4350B ensures stable expansion characteristics over the entire circuit processing temperature range.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2 quality standards.
Availability: Worldwide supply is supported.
Typical Applications
-Telecom Infrastructure: Cellular Base Station Antennas and Power Amplifiers
-RF Identification: RF Identification Tags
-Automotive Electronics: Automotive Radar and Sensors
-Satellite Communication: LNB's (Low Noise Blocks) for Direct Broadcast Satellites
Summary
The 4-layer rigid PCB integrating Rogers RO4350B and TG170 FR-4 materials is a high-performance and cost-effective solution tailored for multi-layer board applications. Its global availability and competitive pricing make it a trusted choice for telecom, automotive, RFID, and satellite communication projects worldwide.
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