MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
In today’s fast-paced electronics landscape, the demand for high-performance printed circuit boards (PCBs) is at an all-time high. Our double-sided PCB, constructed from F4BM220 material, stands out as a premium choice for a variety of applications, offering remarkable thermal and electrical properties.
Material Selection: F4BM220
At the core of this double-sided PCB is F4BM220, a high-performance laminate known for its superior electrical characteristics. This material is engineered through a meticulous process that combines fiberglass cloth with polytetrafluoroethylene (PTFE) resin, resulting in a product that surpasses traditional FR-4 materials.
Key Features of F4BM220:
- Dielectric Constant (Dk): 2.2±0.04 at 10GHz, ensuring minimal signal loss, which is crucial for high-frequency applications.
- Dissipation Factor: 0.001 at 10GHz, contributing to higher efficiency and better signal integrity.
- Thermal Performance: With a CTE of 25 ppm/°C in the X-axis and 34 ppm/°C in the Y-axis, F4BM220 maintains dimensional stability across varying temperatures.
- Moisture Absorption: Less than 0.08%, which enhances reliability in humid conditions.
- Flammability Rating: UL-94 V0, ensuring compliance with safety standards.
Parameter | Specification |
Base Material | F4BM220 |
Layer Count | Double Sided |
Board Dimensions | 90mm x 90mm ± 0.15mm |
Minimum Trace/Space | 10/10 mils |
Minimum Hole Size | 0.7mm |
Blind Vias | No |
Finished Board Thickness | 6.1mm |
Finished Cu Weight | 1oz (1.4 mils) outer layers |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Gold |
Top Silkscreen | No |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Stackup Configuration
The stackup of our PCB is designed to optimize performance:
- Copper Layer 1: 35 μm
- F4BM220 Core: 6.0 mm
- Copper Layer 2: 35 μm
This configuration ensures robust electrical connections and thermal management, essential for modern electronic devices.
Quality Assurance
Every PCB undergoes a 100% electrical test prior to shipment, ensuring that it meets the rigorous standards of IPC-Class-2. This commitment to quality guarantees that each board performs reliably in demanding applications.
Typical Applications
The versatility of this double-sided PCB makes it ideal for various high-frequency applications, including:
- Microwave and RF Systems: Perfect for applications that require precision and reliability.
- Phase Shifters: Essential for controlling signal phase in advanced communication systems.
- Power Dividers and Couplers: Used in RF signal distribution, ensuring consistent performance.
- Feed Networks: Crucial for distributing signals in antenna and radar systems.
- Satellite Communications: Designed to withstand the rigors of space environments.
- Base Station Antennas: Supporting the backbone of modern telecommunications.
Conclusion
Investing in this advanced PCB solution ensures that your products not only meet but exceed the demands of today’s technology landscape. Whether you are involved in telecommunications, aerospace, or consumer electronics, this PCB is engineered to provide the performance you need.
For inquiries or to place an order, please contact us—let’s elevate your electronic solutions together!
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
In today’s fast-paced electronics landscape, the demand for high-performance printed circuit boards (PCBs) is at an all-time high. Our double-sided PCB, constructed from F4BM220 material, stands out as a premium choice for a variety of applications, offering remarkable thermal and electrical properties.
Material Selection: F4BM220
At the core of this double-sided PCB is F4BM220, a high-performance laminate known for its superior electrical characteristics. This material is engineered through a meticulous process that combines fiberglass cloth with polytetrafluoroethylene (PTFE) resin, resulting in a product that surpasses traditional FR-4 materials.
Key Features of F4BM220:
- Dielectric Constant (Dk): 2.2±0.04 at 10GHz, ensuring minimal signal loss, which is crucial for high-frequency applications.
- Dissipation Factor: 0.001 at 10GHz, contributing to higher efficiency and better signal integrity.
- Thermal Performance: With a CTE of 25 ppm/°C in the X-axis and 34 ppm/°C in the Y-axis, F4BM220 maintains dimensional stability across varying temperatures.
- Moisture Absorption: Less than 0.08%, which enhances reliability in humid conditions.
- Flammability Rating: UL-94 V0, ensuring compliance with safety standards.
Parameter | Specification |
Base Material | F4BM220 |
Layer Count | Double Sided |
Board Dimensions | 90mm x 90mm ± 0.15mm |
Minimum Trace/Space | 10/10 mils |
Minimum Hole Size | 0.7mm |
Blind Vias | No |
Finished Board Thickness | 6.1mm |
Finished Cu Weight | 1oz (1.4 mils) outer layers |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Gold |
Top Silkscreen | No |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Stackup Configuration
The stackup of our PCB is designed to optimize performance:
- Copper Layer 1: 35 μm
- F4BM220 Core: 6.0 mm
- Copper Layer 2: 35 μm
This configuration ensures robust electrical connections and thermal management, essential for modern electronic devices.
Quality Assurance
Every PCB undergoes a 100% electrical test prior to shipment, ensuring that it meets the rigorous standards of IPC-Class-2. This commitment to quality guarantees that each board performs reliably in demanding applications.
Typical Applications
The versatility of this double-sided PCB makes it ideal for various high-frequency applications, including:
- Microwave and RF Systems: Perfect for applications that require precision and reliability.
- Phase Shifters: Essential for controlling signal phase in advanced communication systems.
- Power Dividers and Couplers: Used in RF signal distribution, ensuring consistent performance.
- Feed Networks: Crucial for distributing signals in antenna and radar systems.
- Satellite Communications: Designed to withstand the rigors of space environments.
- Base Station Antennas: Supporting the backbone of modern telecommunications.
Conclusion
Investing in this advanced PCB solution ensures that your products not only meet but exceed the demands of today’s technology landscape. Whether you are involved in telecommunications, aerospace, or consumer electronics, this PCB is engineered to provide the performance you need.
For inquiries or to place an order, please contact us—let’s elevate your electronic solutions together!