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Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board

Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RO4350B Core
Layer Count:
2-layer
PCB Size:
45mm X 66 Mm=1PCS, +/- 0.15mm
PCB Thickness:
0.25mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Highlight:

Double Layer Immersion Silver Circuit Board

,

Rogers RO4350B Immersion Silver Circuit Board

,

6.6mil Immersion Silver Circuit Board

Product Description

Introducing the Rogers RO4350B PCB, a state-of-the-art solution designed for high-frequency applications. Made from proprietary woven glass reinforced hydrocarbon/ceramics, RO4350B offers electrical performance comparable to PTFE/woven glass while maintaining the manufacturability advantages of epoxy/glass composites. This material is engineered to provide tight control over dielectric constant (Dk) and low loss, all at a fraction of the cost of conventional microwave laminates.

 

RO4350B laminates do not require special through-hole treatments or handling procedures, making them easier to work with than PTFE-based materials. Rated UL 94 V-0, they are ideal for active devices and high-power RF designs, ensuring reliability and performance.

 

Key Features
1. Dielectric Constant: 3.48 ± 0.05 at 10 GHz/23°C, ensuring reliable signal integrity for RF applications.

 

2. Dissipation Factor: Low at 0.0037 at 10 GHz/23°C, minimizing signal loss.

 

3. Thermal Conductivity: 0.69 W/m/°K, facilitating effective heat management.
 

4. Thermal Coefficient of Expansion (CTE): X axis at 10 ppm/°C, Y axis at 12 ppm/°C, and Z axis at 32 ppm/°C, providing excellent dimensional stability.

 

5. High Tg Value: Greater than 280 °C, ensuring stability during thermal processing.

 

6. Water Absorption: Low at 0.06%, enhancing reliability in various environments.

 

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.69   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits
1. Multi-Layer Board Compatibility: Ideal for MLB constructions, ensuring excellent dimensional stability.


2. Cost-Efficient Processing: Processes like FR-4, resulting in lower fabrication costs.


3. Reliable Thermal Performance: Low Z-axis CTE provides consistent plated through-hole quality, even under thermal stress.

 

PCB Specifications
This PCB is designed as a 2-layer rigid board with dimensions measuring 45 mm x 66 mm, with a tolerance of ±0.15 mm. It features two copper layers, each with a thickness of 35 μm, sandwiching a core of Rogers RO4350B material that is 0.168 mm (6.6 mil) thick. The finished board thickness is 0.25 mm, and the outer layers have a copper weight of 1 oz (1.4 mils).

 

The via plating is set at a thickness of 20 μm, and the surface finish is achieved through immersion silver. Notably, the board does not include silkscreen or solder mask on either side. Prior to shipment, each PCB undergoes a rigorous 100% electrical testing process to ensure reliability and performance.

 

Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board 0

 

Artwork and Standards
The Rogers RO4350B PCB comes with Gerber RS-274-X artwork and meets IPC-Class-2 quality standards, ensuring reliability and performance in demanding applications.

 

Availability
Our Rogers RO4350B PCBs are available for worldwide shipping, making it easy for engineers and designers to access this advanced technology for their projects.

 

Typical Applications
The Rogers RO4350B PCB is ideal for a wide range of applications, including:


-Cellular base station antennas and power amplifiers

-RF identification tags

-Automotive radar systems and sensors

-LNBs for direct broadcast satellites

 

Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board 1

products
PRODUCTS DETAILS
Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RO4350B Core
Layer Count:
2-layer
PCB Size:
45mm X 66 Mm=1PCS, +/- 0.15mm
PCB Thickness:
0.25mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Double Layer Immersion Silver Circuit Board

,

Rogers RO4350B Immersion Silver Circuit Board

,

6.6mil Immersion Silver Circuit Board

Product Description

Introducing the Rogers RO4350B PCB, a state-of-the-art solution designed for high-frequency applications. Made from proprietary woven glass reinforced hydrocarbon/ceramics, RO4350B offers electrical performance comparable to PTFE/woven glass while maintaining the manufacturability advantages of epoxy/glass composites. This material is engineered to provide tight control over dielectric constant (Dk) and low loss, all at a fraction of the cost of conventional microwave laminates.

 

RO4350B laminates do not require special through-hole treatments or handling procedures, making them easier to work with than PTFE-based materials. Rated UL 94 V-0, they are ideal for active devices and high-power RF designs, ensuring reliability and performance.

 

Key Features
1. Dielectric Constant: 3.48 ± 0.05 at 10 GHz/23°C, ensuring reliable signal integrity for RF applications.

 

2. Dissipation Factor: Low at 0.0037 at 10 GHz/23°C, minimizing signal loss.

 

3. Thermal Conductivity: 0.69 W/m/°K, facilitating effective heat management.
 

4. Thermal Coefficient of Expansion (CTE): X axis at 10 ppm/°C, Y axis at 12 ppm/°C, and Z axis at 32 ppm/°C, providing excellent dimensional stability.

 

5. High Tg Value: Greater than 280 °C, ensuring stability during thermal processing.

 

6. Water Absorption: Low at 0.06%, enhancing reliability in various environments.

 

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.69   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits
1. Multi-Layer Board Compatibility: Ideal for MLB constructions, ensuring excellent dimensional stability.


2. Cost-Efficient Processing: Processes like FR-4, resulting in lower fabrication costs.


3. Reliable Thermal Performance: Low Z-axis CTE provides consistent plated through-hole quality, even under thermal stress.

 

PCB Specifications
This PCB is designed as a 2-layer rigid board with dimensions measuring 45 mm x 66 mm, with a tolerance of ±0.15 mm. It features two copper layers, each with a thickness of 35 μm, sandwiching a core of Rogers RO4350B material that is 0.168 mm (6.6 mil) thick. The finished board thickness is 0.25 mm, and the outer layers have a copper weight of 1 oz (1.4 mils).

 

The via plating is set at a thickness of 20 μm, and the surface finish is achieved through immersion silver. Notably, the board does not include silkscreen or solder mask on either side. Prior to shipment, each PCB undergoes a rigorous 100% electrical testing process to ensure reliability and performance.

 

Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board 0

 

Artwork and Standards
The Rogers RO4350B PCB comes with Gerber RS-274-X artwork and meets IPC-Class-2 quality standards, ensuring reliability and performance in demanding applications.

 

Availability
Our Rogers RO4350B PCBs are available for worldwide shipping, making it easy for engineers and designers to access this advanced technology for their projects.

 

Typical Applications
The Rogers RO4350B PCB is ideal for a wide range of applications, including:


-Cellular base station antennas and power amplifiers

-RF identification tags

-Automotive radar systems and sensors

-LNBs for direct broadcast satellites

 

Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board 1

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