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60mil Rogers RO4003C High TG 2 Layer Rigid PCB With 2oz Copper

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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60mil Rogers RO4003C High TG 2 Layer Rigid PCB With 2oz Copper

Detailed Product Description
High Light:

Copper 2 Layer PCB


High TG 2 Layer Rigid PCB


60mil Rigid RF PCB Board

We are glad to introduce our newly shipped PCB, a high-quality 2-layer rigid board manufactured using Rogers RO4003C Hydrocarbon Ceramic woven glass material. This PCB is designed to meet the demanding requirements of various electronic applications, ensuring reliable performance and exceptional durability.


With a process dielectric constant (DK) of 3.38 and a glass transition temperature (Tg) exceeding 280°C, our PCB provides excellent signal integrity and thermal stability, making it suitable for a wide range of operating environments. It can operate flawlessly within a temperature range of -40℃ to +85℃, ensuring consistent performance even in extreme conditions.


The construction details of the PCB are meticulously designed to meet the highest standards. The board dimensions measure 150.33mm x 155.41mm with a tolerance of +/- 0.15mm, ensuring precise and accurate fitment. The substrate thickness of 1.524mm provides structural integrity and durability.


For optimal conductivity, the PCB features copper layers with a thickness of 70μm on both sides. The finished board thickness is 1.6mm, offering robustness without compromising flexibility. The outer layers have a copper weight of 2oz (2.8 mils), providing enhanced current carrying capacity.

To ensure reliable interconnection, the PCB offers a minimum trace/space of 4/4 mils, enabling intricate and compact circuit designs. The minimum hole size of 0.35mm allows for precise component mounting and efficient routing. Additionally, the via plating thickness of 25.4μm maximizes conductivity and signal integrity.


The PCB is finished with immersion gold surface finish, providing excellent solderability, corrosion resistance, and a smooth surface for component attachment. The top and bottom solder masks are green, providing a visually appealing and protective layer for the PCB.


The PCB undergoes rigorous quality testing to meet IPC-Class-2 standards, ensuring exceptional reliability and performance. Each board is subjected to a 100% electrical test prior to shipment, guaranteeing its functionality.


With worldwide availability, we aim to cater to customers globally. For any technical inquiries or further assistance, please contact Ivy at We are dedicated to providing excellent customer support and ensuring your PCB needs are met with utmost satisfaction.


Choose our high-quality Rogers RO4003C 2-layer rigid PCB for your electronic projects and experience superior performance, reliability, and precision.


Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
Z   10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650
Surface Resistivity 4.2 x 109   COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 19,650(2,850)
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
MPa(ksi) RT ASTM D 638
Flexural Strength 276
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        


60mil Rogers RO4003C High TG 2 Layer Rigid PCB With 2oz Copper 0

High-Quality Rogers RO4003C 2-Layer Rigid PCB: Superior Performance and Reliability


The Rogers RO4003C 2-layer rigid PCB is a cutting-edge electronic solution that combines high-quality materials and advanced construction techniques to deliver superior performance and reliability. With its exceptional dielectric properties and robust design, this PCB is ideal for a wide range of applications, including high-frequency circuits, telecommunications, aerospace, and more.


Featuring a dielectric constant (εProcess) of 3.38±0.05, the RO4003C ensures reliable signal transmission and minimal loss, making it suitable for high-frequency applications. The dielectric constant (εDesign) ranges from 3.55 in the 8 to 40 GHz frequency range, as verified by the Differential Phase Length Method. This allows for precise control and optimization of signal integrity across a broad frequency spectrum.


With a low dissipation factor (tan, δ) of 0.0027 at 10 GHz/23℃ and 0.0021 at 2.5 GHz/23℃, the RO4003C minimizes energy loss and ensures efficient power delivery. This characteristic is particularly important in high-speed digital and RF applications where signal accuracy and reliability are paramount.


The PCB offers excellent thermal stability, thanks to its high thermal coefficient of ε (+40 ppm/℃) over a wide temperature range (-50℃ to 150℃). This allows the PCB to maintain its electrical properties even in challenging operating conditions. Additionally, the RO4003C exhibits a high electrical strength of 31.2 Kv/mm (780 V/mil) at a thickness of 0.51mm (0.020"), ensuring reliable insulation and protection against electrical breakdown.


Mechanically, the RO4003C PCB demonstrates impressive tensile strength and modulus, with values of 139 MPa (20.2 ksi) and 19,650 MPa (2,850 ksi) in the X-direction, and 100 MPa (14.5 ksi) and 19,450 MPa (2,821 ksi) in the Y-direction, respectively. This makes it highly resistant to mechanical stress and ensures long-term structural integrity.


The dimensional stability of the RO4003C PCB is exceptional, with a minimal change of less than 0.3 mm/m (mil/inch) after etching and exposure to temperatures up to 150℃. This ensures consistent performance and reliable interconnectivity even under thermal stress.


The PCB exhibits a coefficient of thermal expansion (CTE) of 11 ppm/℃ (X-direction), 14 ppm/℃ (Y-direction), and 46 ppm/℃ (Z-direction) within a temperature range of -55℃ to 288℃. This CTE profile allows for compatibility with various components and ensures minimal stress on solder joints and interconnects.


With a glass transition temperature (Tg) greater than 280℃, the RO4003C PCB offers exceptional thermal resistance, allowing it to withstand high-temperature environments without compromising performance. Moreover, it exhibits a decomposition temperature (Td) of 425℃, ensuring stability during soldering and assembly processes.


The RO4003C PCB features a thermal conductivity of 0.71 W/M/oK at 80℃, facilitating efficient heat dissipation and ensuring optimal performance under demanding thermal conditions. This is particularly crucial in applications where heat management is essential for reliable operation.


It can` meet the highest quality standards, the PCB is lead-free process compatible, making it environmentally friendly and compliant with industry regulations. It also exhibits excellent moisture resistance, with a moisture absorption rate of just 0.06% after 48 hours of immersion at 50℃.


With a density of 1.79 gm/cm3, the RO4003C PCB offers a balance between robustness and flexibility, ensuring optimal performance without compromising the overall weight and size of the electronic system.


The copper peel strength of the PCB is impressive, with a value of 1.05 N/mm (6.0 pli) after solder float using 1 oz. EDC Foil, ensuring secure and reliable copper adhesion.


The RO4003C PCB meets UL 94 flammability standards, providing peace of mind regarding safety and fire resistance.


In conclusion, the Rogers RO4003C 2-layer rigid PCB stands as a reliable and high-performance solution for various electronic applications.


60mil Rogers RO4003C High TG 2 Layer Rigid PCB With 2oz Copper 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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