MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
This high-performance PCB is engineered to meet the stringent requirements of a variety of high-frequency applications, ensuring reliability and precision.
Understanding RF-60A Material
The RF-60A is part of Taconic's esteemed ORCER family, known for its exceptional organic-ceramic laminate construction. This material is crafted with woven glass reinforcement, which enhances dimensional stability and flexural strength, making it ideal for demanding electronic applications. The innovative formulation of RF-60A results in low moisture absorption and uniform electrical properties, setting a benchmark for reliability in challenging environments.
Key Properties of RF-60A
The robust characteristics of RF-60A make it a preferred material for high-frequency applications:
- Dielectric Constant (Dk): 6.15 at 10 GHz. This low Dk allows for minimal signal loss and improved performance in RF applications.
- Dissipation Factor: 0.0038 at 10 GHz/23°C. This low dissipation factor ensures efficient signal transmission with reduced heat generation.
- Moisture Absorption: 0.02%. The low moisture absorption rate contributes to enhanced reliability in humid environments.
- Thermal Conductivity: 0.4 W/MK. This property aids in effective heat dissipation, crucial for high-power applications.
- CTE (Coefficient of Thermal Expansion):
- X-axis: 9 ppm/°C
- Y-axis: 8 ppm/°C
- Z-axis: 69 ppm/°C
- Outgassing Properties: 0.02% TML, 0.01% WVR. These characteristics make RF-60A suitable for space-constrained applications.
These properties ensure that the RF-60A PCB maintains performance integrity even under extreme conditions, which is essential for applications in aerospace, telecommunications, and medical devices.
RF-60A Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.6 | 6.15 | 6.15 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 | 0.0038 | 0.0038 | ||
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Dielectric Breakdown | IPC-650 2.5.6 | kV | 53 | kV | 53 |
Dielectric Strength | ASTM D 149 | V/mil | 880 | kV/mm | 35 |
Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 9.0 x 108 | Mohm/cm | 9.0 x 108 |
Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 2.28 x 108 | Mohm | 2.28 x 108 |
Arc Resistance | IPC-650 2.5.1 | Seconds | 193 | Seconds | 193 |
Flexural Strength (MD) | ASTM D 790 | psi | 18,300 | N/mm2 | 126.2 |
Flexural Strength (CD) | ASTM D 790 | psi | 14,600 | N/mm2 | 100.7 |
Tensile Strength (MD) | ASTM D 3039 | psi | 19,500 | N/mm2 | 134.4 |
Tensile Strength (CD) | ASTM D 3039 | psi | 16,300 | N/mm2 | 112.4 |
Young’s Modulus | ASTM D 3039 | kpsi | 1,590 | N/mm2 | 11,000 |
Poisson’s Ratio | ASTM D 3039 | 0.068 | N/mm2 | 0.068 | |
Compressive Modulus | ASTM D 695 (23°C) | kpsi | 338 | 2,330 | |
Peel Strength (1 oz. ED) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 8 | N/mm | 1.4 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.68 | mm/M | 0.68 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 1.05 | mm/M | 1.05 |
Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.79 | g/cm3 | 2.79 |
Thermal Conductivity | ASTM F 433 | W/M*K | 0.4 | W/M*K | 0.4 |
CTE (X axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 9 | ppm/°C | 9 |
CTE (Y axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 8 | ppm/°C | 8 |
CTE (Z axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 69 | ppm/°C | 69 |
Outgassing (% TML) | ASTM E 595* | % | 0.02 | % | 0.02 |
Outgassing (% CVCM) | ASTM E 595* | % | 0.00 | % | 0.00 |
Outgassing (% WVR) | ASTM E 595* | % | 0.01 | % | 0.01 |
Flammability Rating | UL 94 | V-0 | V-0 |
Detailed PCB Specifications
This PCB features a sophisticated 2-layer rigid construction that optimizes performance for high-frequency applications. Below are the precise specifications that define its capabilities:
Technical Specifications
- Base Material: RF-60A
- Layer Count: 2 layers, providing a balance of complexity and efficiency.
- Board Dimensions: 65mm x 14mm (±0.15mm), allowing for compact designs without sacrificing functionality.
- Minimum Trace/Space: 4/6 mils, facilitating intricate circuit designs.
- Minimum Hole Size: 0.3mm, accommodating various electronic components.
- Finished Board Thickness: 0.7mm, ensuring durability and reliability.
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers, providing robust electrical connections.
- Via Plating Thickness: 20 μm, enhancing the durability of connections between layers.
- Surface Finish: Immersion Gold, ensuring excellent solderability and corrosion resistance.
- Top Silkscreen: Black, providing clear identification for components.
- Top Solder Mask: Blue, contributing to aesthetic and functional design.
- Electrical Testing: 100% tested prior to shipment, ensuring quality assurance.
- Global Availability: Yes, making it accessible for manufacturers worldwide.
PCB Stackup Structure
The stackup of the RF-60A PCB consists of:
- Copper Layer 1: 35 μm, ensuring effective signal transmission.
- RF-60A Dielectric: 0.635 mm (25 mils), providing essential insulation and stability.
- Copper Layer 2: 35 μm, allowing for complex circuit configurations.
This carefully designed configuration ensures optimal performance and reliability, particularly in high-frequency applications.
Applications in Industry
The RF-60A PCB is well-suited for various high-frequency applications, including:
Power Amplifiers: Used in communication systems where signal strength is critical.
Filters and Couplers: Essential for signal processing and routing in RF circuits.
Miniaturized Antennas: Ideal for compact designs in modern communication devices.
Passive Components: Such as capacitors and resistors, where stability and reliability are paramount.
Compliance and Sustainability
The RF-60A PCB adheres to IPC-Class-2 standards, ensuring that it meets high-quality manufacturing benchmarks. Additionally, it is RoHS and WEEE compliant, reflecting a commitment to environmental sustainability and responsible manufacturing practices. This compliance not only ensures safety for end-users but also aligns with global efforts to minimize electronic waste.
Conclusion
With its advanced RF-60A material, high precision, and robust design, the 2-layer rigid PCB is positioned as the perfect solution for your next electronic project. Superior quality and reliability are offered, tailored for high-frequency applications!
For further inquiries or to place an order, please reach out to our dedicated sales team.
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
This high-performance PCB is engineered to meet the stringent requirements of a variety of high-frequency applications, ensuring reliability and precision.
Understanding RF-60A Material
The RF-60A is part of Taconic's esteemed ORCER family, known for its exceptional organic-ceramic laminate construction. This material is crafted with woven glass reinforcement, which enhances dimensional stability and flexural strength, making it ideal for demanding electronic applications. The innovative formulation of RF-60A results in low moisture absorption and uniform electrical properties, setting a benchmark for reliability in challenging environments.
Key Properties of RF-60A
The robust characteristics of RF-60A make it a preferred material for high-frequency applications:
- Dielectric Constant (Dk): 6.15 at 10 GHz. This low Dk allows for minimal signal loss and improved performance in RF applications.
- Dissipation Factor: 0.0038 at 10 GHz/23°C. This low dissipation factor ensures efficient signal transmission with reduced heat generation.
- Moisture Absorption: 0.02%. The low moisture absorption rate contributes to enhanced reliability in humid environments.
- Thermal Conductivity: 0.4 W/MK. This property aids in effective heat dissipation, crucial for high-power applications.
- CTE (Coefficient of Thermal Expansion):
- X-axis: 9 ppm/°C
- Y-axis: 8 ppm/°C
- Z-axis: 69 ppm/°C
- Outgassing Properties: 0.02% TML, 0.01% WVR. These characteristics make RF-60A suitable for space-constrained applications.
These properties ensure that the RF-60A PCB maintains performance integrity even under extreme conditions, which is essential for applications in aerospace, telecommunications, and medical devices.
RF-60A Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.6 | 6.15 | 6.15 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 | 0.0038 | 0.0038 | ||
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Dielectric Breakdown | IPC-650 2.5.6 | kV | 53 | kV | 53 |
Dielectric Strength | ASTM D 149 | V/mil | 880 | kV/mm | 35 |
Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 9.0 x 108 | Mohm/cm | 9.0 x 108 |
Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 2.28 x 108 | Mohm | 2.28 x 108 |
Arc Resistance | IPC-650 2.5.1 | Seconds | 193 | Seconds | 193 |
Flexural Strength (MD) | ASTM D 790 | psi | 18,300 | N/mm2 | 126.2 |
Flexural Strength (CD) | ASTM D 790 | psi | 14,600 | N/mm2 | 100.7 |
Tensile Strength (MD) | ASTM D 3039 | psi | 19,500 | N/mm2 | 134.4 |
Tensile Strength (CD) | ASTM D 3039 | psi | 16,300 | N/mm2 | 112.4 |
Young’s Modulus | ASTM D 3039 | kpsi | 1,590 | N/mm2 | 11,000 |
Poisson’s Ratio | ASTM D 3039 | 0.068 | N/mm2 | 0.068 | |
Compressive Modulus | ASTM D 695 (23°C) | kpsi | 338 | 2,330 | |
Peel Strength (1 oz. ED) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 8 | N/mm | 1.4 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.68 | mm/M | 0.68 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 1.05 | mm/M | 1.05 |
Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.79 | g/cm3 | 2.79 |
Thermal Conductivity | ASTM F 433 | W/M*K | 0.4 | W/M*K | 0.4 |
CTE (X axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 9 | ppm/°C | 9 |
CTE (Y axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 8 | ppm/°C | 8 |
CTE (Z axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 69 | ppm/°C | 69 |
Outgassing (% TML) | ASTM E 595* | % | 0.02 | % | 0.02 |
Outgassing (% CVCM) | ASTM E 595* | % | 0.00 | % | 0.00 |
Outgassing (% WVR) | ASTM E 595* | % | 0.01 | % | 0.01 |
Flammability Rating | UL 94 | V-0 | V-0 |
Detailed PCB Specifications
This PCB features a sophisticated 2-layer rigid construction that optimizes performance for high-frequency applications. Below are the precise specifications that define its capabilities:
Technical Specifications
- Base Material: RF-60A
- Layer Count: 2 layers, providing a balance of complexity and efficiency.
- Board Dimensions: 65mm x 14mm (±0.15mm), allowing for compact designs without sacrificing functionality.
- Minimum Trace/Space: 4/6 mils, facilitating intricate circuit designs.
- Minimum Hole Size: 0.3mm, accommodating various electronic components.
- Finished Board Thickness: 0.7mm, ensuring durability and reliability.
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers, providing robust electrical connections.
- Via Plating Thickness: 20 μm, enhancing the durability of connections between layers.
- Surface Finish: Immersion Gold, ensuring excellent solderability and corrosion resistance.
- Top Silkscreen: Black, providing clear identification for components.
- Top Solder Mask: Blue, contributing to aesthetic and functional design.
- Electrical Testing: 100% tested prior to shipment, ensuring quality assurance.
- Global Availability: Yes, making it accessible for manufacturers worldwide.
PCB Stackup Structure
The stackup of the RF-60A PCB consists of:
- Copper Layer 1: 35 μm, ensuring effective signal transmission.
- RF-60A Dielectric: 0.635 mm (25 mils), providing essential insulation and stability.
- Copper Layer 2: 35 μm, allowing for complex circuit configurations.
This carefully designed configuration ensures optimal performance and reliability, particularly in high-frequency applications.
Applications in Industry
The RF-60A PCB is well-suited for various high-frequency applications, including:
Power Amplifiers: Used in communication systems where signal strength is critical.
Filters and Couplers: Essential for signal processing and routing in RF circuits.
Miniaturized Antennas: Ideal for compact designs in modern communication devices.
Passive Components: Such as capacitors and resistors, where stability and reliability are paramount.
Compliance and Sustainability
The RF-60A PCB adheres to IPC-Class-2 standards, ensuring that it meets high-quality manufacturing benchmarks. Additionally, it is RoHS and WEEE compliant, reflecting a commitment to environmental sustainability and responsible manufacturing practices. This compliance not only ensures safety for end-users but also aligns with global efforts to minimize electronic waste.
Conclusion
With its advanced RF-60A material, high precision, and robust design, the 2-layer rigid PCB is positioned as the perfect solution for your next electronic project. Superior quality and reliability are offered, tailored for high-frequency applications!
For further inquiries or to place an order, please reach out to our dedicated sales team.