|
Product Details:
Payment & Shipping Terms:
|
Material: | Rogers 4350B | PCB Thickness: | 0.6mm |
---|---|---|---|
Layer Count: | 2 Layers | Surface Finish: | Immersion Gold |
Copper Weight: | 1oz | PCB Size: | 26x83=1PCS |
High Light: | Rogers 4350B RF PCB Board,Hydrocarbon Ceramic RF PCB Board,Rogers 4350B Splitter PCB |
High Frequency PCB Rogers 20mil 0.508mm RO4350B
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4350B hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4350B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4350B material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.
For RO4350B PCBs, we can provide you with single sided board, double sided board, multi-layer board and hybrid types. RO4350B PCBs have wide thickness. There are the standard thickness such as 10 mils, 20 mils, 30 mils, 60mils etc. and non-standard thickness such as 4 mils, 6.6 mils,13.3 mils and 16.6 mils etc. Finished copper on PCBs is 1oz and 2oz.
Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can different designs in this panel. Solder mask of green, black, red and yellow etc is available in house.
There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating.
PCB Specifications
PCB SIZE | 26 x 83mm=1PCS |
BOARD TYPE | |
Number of Layers | Double sided PCB, 2 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | no |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
RO4350B 20mil (0.508mm) | |
copper ------- 35um(1oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 5.98mil/6.18mil |
Minimum / Maximum Holes: | 0.3/3.2mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 431 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | no |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | RO4350B 20mil (0.508mm), Tg 288℃ |
Final foil external: | 1.5oz |
Final foil internal: | 0oz |
Final height of PCB: | 0.6mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (81.1%) 2µ" over 100µ" nickel |
Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH) |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID
Data sheet of Rogers 4350B (RO4350B )
RO4350B Typical Value | |||||
Property | RO4350B | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | (3)V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Contact Person: i.deng
Tel: +8613481420915