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2-layer RO4350B PCB 30mil Immersion silver Circuits

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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2-layer RO4350B PCB 30mil Immersion silver Circuits

2-layer RO4350B PCB 30mil Immersion silver Circuits
2-layer RO4350B PCB 30mil Immersion silver Circuits 2-layer RO4350B PCB 30mil Immersion silver Circuits 2-layer RO4350B PCB 30mil Immersion silver Circuits

Large Image :  2-layer RO4350B PCB 30mil Immersion silver Circuits

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RO4350B PCB Size: 53.18mm X 76.04 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Silver
Layer Count: 2-layer PCB Thickness: 30 Mil

Introducing our newly shipped PCB featuring the RO4350B material, a cutting-edge solution for high-performance circuit designs. With its exceptional electrical properties and cost-effective manufacturing process, this PCB is an ideal choice for a wide range of applications.

 

RO4350B laminates are composed of proprietary woven glass reinforced hydrocarbon/ceramics, offering electrical performance similar to PTFE/woven glass materials and the manufacturability advantages of epoxy/glass. These laminates ensure tight control over the dielectric constant (Dk) while maintaining low loss, all while utilizing the same processing methods as standard epoxy/glass laminates. Compared to conventional microwave laminates, RO4350B laminates are available at a fraction of the cost and do not require special through-hole treatments or handling procedures like PTFE-based materials. Additionally, they are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs.

 

One of the key benefits of RO4350B material is its thermal coefficient of expansion (CTE), which closely matches that of copper. This characteristic provides excellent dimensional stability, making it an excellent choice for mixed dielectric multi-layer board (MLB) constructions. The low Z-axis CTE of RO4350B laminates ensures reliable plated through-hole quality, even in severe thermal shock applications. Furthermore, the material has a high glass transition temperature (Tg) of over 280°C (536°F), ensuring its expansion characteristics remain stable throughout the entire circuit processing temperature range.

 

Key Features:
- Dielectric Constant (Dk): 3.48 +/- 0.05 at 10GHz/23°C
- Dissipation Factor: 0.0037 at 10GHz/23°C
- Thermal Conductivity: 0.69 W/m/°K
- X-axis CTE: 10 ppm/°C, Y-axis CTE: 12 ppm/°C, Z-axis CTE: 32 ppm/°C
- High Tg value: >280°C
- Low water absorption: 0.06%

 

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.69   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0       UL 94
Lead-free Process Compatible Yes        

 

This PCB is optimized for performance and reliability, making it an excellent choice for various applications. The stackup consists of three layers: Copper Layer 1, Rogers RO4350B Core, and Copper Layer 2.Copper Layer 1 has a thickness of 35 μm, providing a solid and robust conductor for efficient signal transmission.At the core of our PCB lies the Rogers RO4350B material with a thickness of 0.762 mm (30 mil). Completing the stackup is Copper Layer 2, which has a thickness of 20 μm. This layer functions as the bottom conductor, offering additional routing options and providing a solid ground plane for improved signal integrity and electromagnetic compatibility.

 

PCB Construction Details:
- Board Dimensions: 53.18mm x 76.04mm (1PCS), +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.35mm
- No Blind vias
- Finished Board Thickness: 0.8mm
- Finished Copper Weight: 1oz (1.4 mils) outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion silver
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical Test performed prior to shipment

 

PCB Statistics:
- Components: 12
- Total Pads: 65
- Thru Hole Pads: 33
- Top SMT Pads: 32
- Bottom SMT Pads: 0
- Vias: 31
- Nets: 3

 

2-layer RO4350B PCB 30mil Immersion silver Circuits 0

 

Artwork Supplied: Gerber RS-274-X

 

Quality Standard: IPC-Class-2

 

Availability: This PCB is available for worldwide shipping, ensuring easy access to this high-quality solution.

 

Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites

 

With its exceptional electrical properties, cost-effectiveness, and compatibility with various applications, our RO4350B PCB is a reliable choice for high-performance circuit designs. Experience the benefits of this advanced material and elevate your electronic projects to new heights.

 

2-layer RO4350B PCB 30mil Immersion silver Circuits 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)