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Product Details:
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| Material: | RO4350B | PCB Size: | 53.18mm X 76.04 Mm=1PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Silver |
| Layer Count: | 2-layer | PCB Thickness: | 30 Mil |
| Highlight: | 30mil Immersion silver Circuits PCB,RO4350B PCB,Immersion Silver two layer pcb |
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Introducing our newly shipped PCB featuring the RO4350B material, a cutting-edge solution for high-performance circuit designs. With its exceptional electrical properties and cost-effective manufacturing process, this PCB is an ideal choice for a wide range of applications.
RO4350B laminates are composed of proprietary woven glass reinforced hydrocarbon/ceramics, offering electrical performance similar to PTFE/woven glass materials and the manufacturability advantages of epoxy/glass. These laminates ensure tight control over the dielectric constant (Dk) while maintaining low loss, all while utilizing the same processing methods as standard epoxy/glass laminates. Compared to conventional microwave laminates, RO4350B laminates are available at a fraction of the cost and do not require special through-hole treatments or handling procedures like PTFE-based materials. Additionally, they are UL 94 V-0 rated, making them suitable for active devices and high-power RF designs.
One of the key benefits of RO4350B material is its thermal coefficient of expansion (CTE), which closely matches that of copper. This characteristic provides excellent dimensional stability, making it an excellent choice for mixed dielectric multi-layer board (MLB) constructions. The low Z-axis CTE of RO4350B laminates ensures reliable plated through-hole quality, even in severe thermal shock applications. Furthermore, the material has a high glass transition temperature (Tg) of over 280°C (536°F), ensuring its expansion characteristics remain stable throughout the entire circuit processing temperature range.
Key Features:
- Dielectric Constant (Dk): 3.48 +/- 0.05 at 10GHz/23°C
- Dissipation Factor: 0.0037 at 10GHz/23°C
- Thermal Conductivity: 0.69 W/m/°K
- X-axis CTE: 10 ppm/°C, Y-axis CTE: 12 ppm/°C, Z-axis CTE: 32 ppm/°C
- High Tg value: >280°C
- Low water absorption: 0.06%
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
This PCB is optimized for performance and reliability, making it an excellent choice for various applications. The stackup consists of three layers: Copper Layer 1, Rogers RO4350B Core, and Copper Layer 2.Copper Layer 1 has a thickness of 35 μm, providing a solid and robust conductor for efficient signal transmission.At the core of our PCB lies the Rogers RO4350B material with a thickness of 0.762 mm (30 mil). Completing the stackup is Copper Layer 2, which has a thickness of 20 μm. This layer functions as the bottom conductor, offering additional routing options and providing a solid ground plane for improved signal integrity and electromagnetic compatibility.
PCB Construction Details:
- Board Dimensions: 53.18mm x 76.04mm (1PCS), +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.35mm
- No Blind vias
- Finished Board Thickness: 0.8mm
- Finished Copper Weight: 1oz (1.4 mils) outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion silver
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical Test performed prior to shipment
PCB Statistics:
- Components: 12
- Total Pads: 65
- Thru Hole Pads: 33
- Top SMT Pads: 32
- Bottom SMT Pads: 0
- Vias: 31
- Nets: 3
Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: This PCB is available for worldwide shipping, ensuring easy access to this high-quality solution.
Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites
With its exceptional electrical properties, cost-effectiveness, and compatibility with various applications, our RO4350B PCB is a reliable choice for high-performance circuit designs. Experience the benefits of this advanced material and elevate your electronic projects to new heights.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
