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| Material: | RO4350B | PCB Thickness: | 6.5mm |
|---|---|---|---|
| PCB Size: | 65 Mm X 65 Mm (± 0.15 Mm) | Layer Count: | 2-layer |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | ENIG |
| Silkscreen: | Yellow | ||
| Highlight: | 6.5mm PCB Double-Sided Circuits,RO4350B PCB Double-Sided Circuits,ENIG PCB Double-Sided Circuits |
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Introducing our newly shipped PCB, featuring Rogers RO4350B material and RO4450F bondply. This advanced solution is designed for high-performance RF applications, combining the strengths of both materials to deliver exceptional reliability and efficiency. The RO4350B laminate offers electrical performance akin to PTFE/woven glass, while leveraging the manufacturability of epoxy/glass, making it a cost-effective choice for microwave applications.
Key Features of RO4350B
The RO4350B material boasts a dielectric constant of 3.48 ± 0.05 at 10 GHz and a low dissipation factor of 0.0037, ensuring minimal signal loss. With a thermal conductivity of 0.69 W/m·K and a high glass transition temperature (Tg) of over 280 °C, this material maintains stability across a wide range of operating conditions. The thermal expansion coefficient (CTE) is closely matched to copper, providing excellent dimensional stability, which is crucial for multi-layer board constructions.
Key Features of RO4450F
The RO4450F bondply enhances the PCB’s performance, offering a dielectric constant of 3.52 ± 0.05 at 10 GHz and a dissipation factor of 0.004. With a thermal conductivity of 0.65 W/m·K and a high Tg of over 280 °C, it is perfect for handling multiple lamination cycles. This bondply is also designed for compatibility with FR-4 materials, allowing for versatile multi-layer constructions.
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
PCB Stackup
The PCB features a robust 2-layer rigid stackup:
- Copper Layer 1: 35 μm
- RO4350B Core: 1.524 mm (60 mil)
- Prepreg Bond-ply (RO4450F): 0.101 mm (4 mil)
- RO4350B Core: 1.524 mm (60 mil)
- Prepreg Bond-ply (RO4450F): 0.101 mm (4 mil)
- RO4350B Core: 1.524 mm (60 mil)
- Prepreg Bond-ply (RO4450F): 0.101 mm (4 mil)
- RO4350B Core: 1.524 mm (60 mil)
- Copper Layer 2: 35 μm
Construction Details
This PCB measures 65 mm x 65 mm (± 0.15 mm) with a finished thickness of 6.5 mm. It supports a minimum trace/space of 7/8 mils and a minimum hole size of 0.5 mm. The finished copper weight is 1 oz (1.4 mils) on the outer layers, with a via plating thickness of 20 μm. The surface finish is ENIG, while the top silkscreen is yellow and the top solder mask is green. Each board undergoes 100% electrical testing before shipment to ensure quality.
Compliance and Availability
- Artwork Format: Gerber RS-274-X
- Quality Standard: IPC-Class-2
- Availability: Worldwide
Typical Applications
This PCB is ideal for:
- Cellular base station antennas and power amplifiers
- RF identification tags
- Automotive radar and sensors
- LNBs for direct broadcast satellites
Leverage the advanced properties of Rogers RO4350B and RO4450F in your next project to ensure high reliability and performance in demanding RF applications.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
