Rogers 30mil 4350 Substrates High Performance PCB Board With 1oz Copper

When creating printed circuit boards (PCBs), several factors need to be considered, such as the choice of materials, construction details, and stackup configuration. In this article, we'll provide a comprehensive overview of these elements for a specific PCB.

The PCB material used is Rogers RO4350B hydrocarbon ceramic laminates. This material is known for its high frequency performance, low loss, and lead-free composition, making it more environmentally friendly. It has a dielectric constant of 3.48 and a dissipation factor of 0.0037 at 10 GHz. The material can operate within a temperature range of -40℃ to +85℃.

The stackup configuration for this PCB includes two layers of base copper, each with a thickness of 17um. The dielectric material used is RO4350B, with a thickness of 60mil. The base copper layers are sandwiched between the dielectric layers, resulting in a finished board thickness of 1.6mm and a finished Cu weight of 1 oz (1.4 mils) for all layers. The via plating thickness is 1 mil, and the surface finish is ENIG. The PCB does not have any top or bottom silkscreen and no silkscreen on the solder pads.

Regarding construction details, the PCB dimensions are 76.00mm x 76.00mm, with a tolerance of +/- 0.15mm. The minimum trace/space is 6/6 mils, and the minimum hole size is 0.45mm. No blind or buried vias are included in this design. The PCB contains 50 components, 73 pads, 26 thru-hole pads, 47 top SMT pads, and 0 bottom SMT pads, with 71 vias and 9 nets. The PCB has undergone 100% electrical testing to ensure its quality.

This PCB does not include impedance matching, with a tolerance of +/- 10%.

For any technical inquiries or further information, please do not hesitate to contact Ivy at sales10@bichengpcb.com.

A Comprehensive Guide to PCB Material, Stackup, and Construction Details

Properties of RO4350B PCB
 

Dielectric Constant: One of the key features of RO4350B is its dielectric constant, which is 3.48±0.05 for the process and 3.66 for the design. This makes it ideal for high-frequency applications that require low signal loss.

Dissipation Factor: RO4350B has a low dissipation factor (tan δ) of 0.0037 at 10 GHz/23℃ and 0.0031 at 2.5 GHz/23℃, making it an excellent choice for high-frequency applications that require low signal loss.

Thermal Coefficient of ε: RO4350B has a thermal coefficient of ε of +50 ppm/℃, making it more stable and reliable over a wide range of temperatures.

Volume and Surface Resistivity: The volume resistivity of RO4350B is 1.2 x 10^10 MΩ.cm (COND A), and the surface resistivity is 5.7 x 10^9 MΩ (COND A). These values are important for high-frequency applications that require excellent electrical insulation properties.

Electrical Strength: RO4350B has an excellent electrical strength of 31.2 Kv/mm (780 v/mil) at 0.51mm (0.020"), making it ideal for high-frequency applications that require high voltage insulation.

Tensile and Flexural Strength: RO4350B has a high tensile modulus of 16,767 MPa in the X direction and 14,153 MPa in the Y direction, as well as a tensile strength of 203 MPa (29.5 ksi) in the X direction and 130 MPa (18.9 ksi) in the Y direction. The flexural strength is also high at 255 MPa (37 kpsi), making it a durable and reliable material for high-frequency applications.

Coefficient of Thermal Expansion: RO4350B has a low coefficient of thermal expansion in the X and Y directions, which is important for high-frequency applications that require stable and reliable performance over a wide range of temperatures.

Tg and Td: RO4350B has a high glass transition temperature (Tg) of >280℃ TMA (A) and a decomposition temperature (Td) of 390℃ TGA. This makes it ideal for high-temperature applications.

Thermal Conductivity: RO4350B has a high thermal conductivity of 0.69 W/M/oK at 80℃, making it an excellent choice for high-frequency applications that require efficient heat dissipation.

Moisture Absorption: RO4350B has a low moisture absorption rate of 0.06% after 48 hours of immersion in water at 50℃, which is important for high-frequency applications that require reliable performance in humid environments.

Density: RO4350B has a density of 1.86 gm/cm3 at 23℃, which is important for high-frequency applications that require lightweight materials.

Copper Peel Strength: RO4350B has a high copper peel strength of 0.88 N/mm (5.0 pli), making it an ideal choice for high-frequency applications that require strong adhesion between the copper and substrate.

Flammability: RO4350B is rated (3)V-0 for flammability, making it a safe material for high-frequency applications.

Lead-free Process Compatible: RO4350B is lead-free process compatible, making it an environmentally friendly choice for high-frequency PCBs.

In conclusion, RO4350B is a high-performance material that is ideal for high-frequency PCBs. Its low signal loss, low dissipation factor, excellent electrical insulation properties, high voltage insulation, and high-temperature performance make it an excellent choice for a wide range of high-frequency applications. If you're looking for a reliable and durable material for your next high-frequency PCB, consider RO4350B.