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10mil RT Duroid 6035HTC PCB Double-layer Black Silkscreen Immersion Gold

10mil RT Duroid 6035HTC PCB Double-layer Black Silkscreen Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RT/duroid 6035HTC
PCB Size:
42.91mm X 108.31 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.3 Mm
Highlight:

10mil RT duroid 6035HTC PCB

,

Double-layer RT duroid 6035HTC PCB

,

Immersion Gold RT duroid 6035HTC PCB

Product Description

Introducing the RT/duroid 6035HTC PCB, a high-performance solution designed for high power RF and microwave applications. Manufactured using Rogers Corporation's advanced high-frequency circuit materials, this PCB offers exceptional reliability and power handling capabilities.

 

Features:

DK: 3.5 +/- 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0013 at 10 GHz/23°C
Thermal Coefficient of Dielectric Constant: -66 ppm/°C
Moisture Absorption: 0.06%
Thermal Conductivity: 1.44 W/m/K at 80°C
CTE (Coefficient of Thermal Expansion): X-axis: 19 ppm/°C, Y-axis: 19 ppm/°C, Z-axis: 39 ppm/°C

 

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Benefits:

High Thermal Conductivity: Enables efficient heat dissipation and lower operating temperatures for high-power applications.

 

Excellent High Frequency Performance: Low insertion loss and reliable thermal stability of traces ensure optimal signal integrity.

 

Superior Power Handling: Designed to handle high power RF and microwave applications with exceptional reliability.

 

The RT/duroid 6035HTC PCB is a 2-layer rigid PCB with a copper layer thickness of 35 μm on each side and an RT/duroid 6035HTC core thickness of 0.254 mm (10 mils). With board dimensions of 42.91mm x 108.31mm, it provides ample space for your designs while maintaining a compact form factor.

 

This PCB supports intricate and precise circuit designs, offering a minimum trace/space of 4/5 mils and a minimum hole size of 0.3mm. It has a finished board thickness of 0.3mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, ensuring durability and reliability.

 

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

10mil RT Duroid 6035HTC PCB Double-layer Black Silkscreen Immersion Gold 0

 

The RT/duroid 6035HTC PCB undergoes rigorous testing, with 100% electrical testing performed prior to shipment, meeting IPC-Class-2 quality standards. It is available worldwide, ensuring easy access to this high-performance solution.

 

With 35 components, 112 total pads, 74 thru-hole pads, 38 top SMT pads, and 64 vias, the RT/duroid 6035HTC PCB offers versatility and flexibility for your designs. It finds applications in high-power RF and microwave amplifiers, power amplifiers, couplers, filters, combiners, and power dividers.

products
PRODUCTS DETAILS
10mil RT Duroid 6035HTC PCB Double-layer Black Silkscreen Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RT/duroid 6035HTC
PCB Size:
42.91mm X 108.31 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.3 Mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

10mil RT duroid 6035HTC PCB

,

Double-layer RT duroid 6035HTC PCB

,

Immersion Gold RT duroid 6035HTC PCB

Product Description

Introducing the RT/duroid 6035HTC PCB, a high-performance solution designed for high power RF and microwave applications. Manufactured using Rogers Corporation's advanced high-frequency circuit materials, this PCB offers exceptional reliability and power handling capabilities.

 

Features:

DK: 3.5 +/- 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0013 at 10 GHz/23°C
Thermal Coefficient of Dielectric Constant: -66 ppm/°C
Moisture Absorption: 0.06%
Thermal Conductivity: 1.44 W/m/K at 80°C
CTE (Coefficient of Thermal Expansion): X-axis: 19 ppm/°C, Y-axis: 19 ppm/°C, Z-axis: 39 ppm/°C

 

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Benefits:

High Thermal Conductivity: Enables efficient heat dissipation and lower operating temperatures for high-power applications.

 

Excellent High Frequency Performance: Low insertion loss and reliable thermal stability of traces ensure optimal signal integrity.

 

Superior Power Handling: Designed to handle high power RF and microwave applications with exceptional reliability.

 

The RT/duroid 6035HTC PCB is a 2-layer rigid PCB with a copper layer thickness of 35 μm on each side and an RT/duroid 6035HTC core thickness of 0.254 mm (10 mils). With board dimensions of 42.91mm x 108.31mm, it provides ample space for your designs while maintaining a compact form factor.

 

This PCB supports intricate and precise circuit designs, offering a minimum trace/space of 4/5 mils and a minimum hole size of 0.3mm. It has a finished board thickness of 0.3mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, ensuring durability and reliability.

 

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

10mil RT Duroid 6035HTC PCB Double-layer Black Silkscreen Immersion Gold 0

 

The RT/duroid 6035HTC PCB undergoes rigorous testing, with 100% electrical testing performed prior to shipment, meeting IPC-Class-2 quality standards. It is available worldwide, ensuring easy access to this high-performance solution.

 

With 35 components, 112 total pads, 74 thru-hole pads, 38 top SMT pads, and 64 vias, the RT/duroid 6035HTC PCB offers versatility and flexibility for your designs. It finds applications in high-power RF and microwave amplifiers, power amplifiers, couplers, filters, combiners, and power dividers.

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