Introducing the RT/duroid 6035HTC PCB, a high-performance solution designed for high power RF and microwave applications. Manufactured using Rogers Corporation's advanced high-frequency circuit materials, this PCB offers exceptional reliability and power handling capabilities.
Features:
DK: 3.5 +/- 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0013 at 10 GHz/23°C
Thermal Coefficient of Dielectric Constant: -66 ppm/°C
Moisture Absorption: 0.06%
Thermal Conductivity: 1.44 W/m/K at 80°C
CTE (Coefficient of Thermal Expansion): X-axis: 19 ppm/°C, Y-axis: 19 ppm/°C, Z-axis: 39 ppm/°C
| Property |
RT/duorid 6035HTC |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant,εProcess |
3.50±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign |
3.6 |
Z |
|
8 GHz - 40 GHz |
Differential Phase Length Method |
| Dissipation Factor |
0.0013 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε |
-66 |
Z |
ppm/℃ |
-50 ℃to 150℃ |
mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity |
108 |
|
MΩ.cm |
A |
IPC-TM-650, 2.5.17.1 |
| Surface Resistivity |
108 |
|
MΩ |
A |
IPC-TM-650, 2.5.17.1 |
| Dimensional Stability |
-0.11 -0.08 |
CMD MD |
mm/m (mils/inch) |
0.030" 1oz EDC foil Thickness after etch '+E4/105 |
IPC-TM-650 2.4.39A |
| Tensile Modulus |
329 244 |
MD CMD |
kpsi |
40 hrs @23℃/50RH |
ASTM D638 |
| Moisure Absorption |
0.06 |
|
% |
D24/23 |
IPC-TM-650 2.6.2.1 ASTM D570 |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) |
19 19 39 |
X Y Z |
ppm/℃ |
23℃ / 50% RH |
IPC-TM-650 2.4.41 |
| Thermal Conductivity |
1.44 |
|
W/m/k |
80℃ |
ASTM C518 |
| Density |
2.2 |
|
gm/cm3 |
23℃ |
ASTM D792 |
| Copper Peel Stength |
7.9 |
|
pli |
20 sec. @288 ℃ |
IPC-TM-650 2.4.8 |
| Flammability |
V-0 |
|
|
|
UL 94 |
| Lead-Free Process Compatible |
Yes |
|
|
|
|
Benefits:
High Thermal Conductivity: Enables efficient heat dissipation and lower operating temperatures for high-power applications.
Excellent High Frequency Performance: Low insertion loss and reliable thermal stability of traces ensure optimal signal integrity.
Superior Power Handling: Designed to handle high power RF and microwave applications with exceptional reliability.
The RT/duroid 6035HTC PCB is a 2-layer rigid PCB with a copper layer thickness of 35 μm on each side and an RT/duroid 6035HTC core thickness of 0.254 mm (10 mils). With board dimensions of 42.91mm x 108.31mm, it provides ample space for your designs while maintaining a compact form factor.
This PCB supports intricate and precise circuit designs, offering a minimum trace/space of 4/5 mils and a minimum hole size of 0.3mm. It has a finished board thickness of 0.3mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, ensuring durability and reliability.
| PCB Material: |
Ceramic-filled PTFE composites |
| Designation: |
RT/duroid 6035HTC |
| Dielectric constant: |
3.50±0.05 |
| Layer count: |
Double Layer, Multilayer, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Laminate thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
The RT/duroid 6035HTC PCB undergoes rigorous testing, with 100% electrical testing performed prior to shipment, meeting IPC-Class-2 quality standards. It is available worldwide, ensuring easy access to this high-performance solution.
With 35 components, 112 total pads, 74 thru-hole pads, 38 top SMT pads, and 64 vias, the RT/duroid 6035HTC PCB offers versatility and flexibility for your designs. It finds applications in high-power RF and microwave amplifiers, power amplifiers, couplers, filters, combiners, and power dividers.
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