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20mil AD255C Antenna PCB 2 layer Immesion Silver Printed Circuit Boards

20mil AD255C Antenna PCB 2 layer Immesion Silver Printed Circuit Boards

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
AD255C
PCB Size:
32.91mm X 40.41mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immesion Silver
Layer Count:
2-layer
PCB Thickness:
20 Mil
Highlight:

AD255C Antenna PCB

,

20mil AD255C Antenna PCB

,

AD255C Immesion Silver Printed Circuit Boards

Product Description

Introducing a newly shipped Antenna PCB based on AD255C. The AD255C Antenna PCB is an exceptional product designed to deliver outstanding performance and reliability for a wide range of microwave and RF applications in telecommunication infrastructure. With its advanced features and innovative design, this PCB is a game-changer in the world of antenna laminates.

 

Featuring glass-reinforced, PTFE based materials, the AD255C provides controlled dielectric constant, low loss performance, and remarkable passive intermodulation (PIM) performance. The woven glass reinforcement ensures excellent circuit processability and enables high yield circuit board fabrication, ensuring optimal quality and efficiency.

 

Key Features:
- Very low loss PTFE and ceramic filled composite for superior performance
- Dielectric constant of 2.55 with tight tolerance at 10 GHz/23°C, ensuring precise operation
- 0.0013 loss tangent at 10GHz and base station frequencies at 10 GHz/23°C, minimizing signal loss
- Decomposition Temperature (Td) greater than 500°C, ensuring durability under extreme conditions
- Low profile copper for enhanced circuit efficiency
- Moisture Absorption of only 0.03%, maintaining stability and reliability
- Coefficient of Thermal Expansion (CTE) in X-axis of 34 ppm/°C, Y-axis of 26 ppm/°C, and Z-axis of 196 ppm/°C, minimizing stress and ensuring reliable performance

 

Benefits:
1. Lower Insertion Loss: The AD255C Antenna PCB offers significantly lower insertion loss compared to traditional PCB substrates, ensuring efficient signal transmission and reception.

 

2. Low PIM for Antenna Applications: With exceptional PIM performance, this PCB minimizes interference and provides clear and reliable communication.
 

3. Phase Stability: The excellent Thermal Coefficient of Expansion Ratio (TCEr) ensures phase stability, allowing for consistent performance over a wide range of temperatures.
 

4. Compatibility: The AD255C Antenna PCB is compatible with standard PTFE-based PCB processing, making it easy to integrate into existing systems.

 

Electrical Properties AD255C Units Test Conditions Test Method
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.55 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
Dielectric Constant (design) 2.60 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -110 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 7.4 x 108 Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 3.6 x 107 Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 911 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 34 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 26 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.35 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.4
(13.6)
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 8.1/6.6 (55.8/45.5) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 930/818 (6,412/5,640) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.03/0.07 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.03 % E1/105 +D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716

 

PCB Stackup:
This PCB features a 2-layer rigid construction with a copper layer thickness of 35 μm. The AD255C laminate, with a thickness of 0.508 mm (20mil), provides the ideal substrate for optimal performance. The second copper layer, also 35 μm thick, completes the stackup, ensuring durability and stability.

 

PCB Construction Details:
- Board dimensions: This antenna PCB measures 32.91mm x 40.41mm, providing a compact yet powerful solution for various applications.
- Minimum Trace/Space: With a minimum trace/space of 4/4 mils, this PCB enables precise routing and efficient use of space.
- Minimum Hole Size: The AD255C supports a minimum hole size of 0.25mm, allowing for versatile component integration.
- Finished board thickness: The finished board thickness is 0.6mm, providing a compact and lightweight solution.
- Finished Cu weight: The outer layers of this PCB feature 1oz (1.4 mils) copper weight, ensuring robust conductivity.
- Via plating thickness: The vias are plated with a thickness of 20 μm, facilitating reliable signal transmission.
- Surface finish: The AD255C Antenna PCB comes with an immersion silver surface finish, ensuring excellent conductivity and corrosion resistance.
- Top Silkscreen: The top silkscreen is presented in white, providing clear labeling and identification.
- Bottom Silkscreen: No bottom silkscreen is included, simplifying the design and maximizing efficiency.
- Top Solder Mask: The top solder mask is green, providing electrical insulation and protecting the copper traces.
- Bottom Solder Mask: No bottom solder mask is applied, allowing for easy soldering and rework.
- 100% Electrical Test: Each PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring quality and reliability.

 

PCB Material: Glass-reinforced, PTFE based Composites
Designation: AD255C
Dielectric constant: 2.55 (10 GHz)
Dissipation Factor 0.0013 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

20mil AD255C Antenna PCB 2 layer Immesion Silver Printed Circuit Boards 0

 

PCB Statistics:
This Antenna PCB features a compact design with 15 components, 29 total pads, 17 thru-hole pads, and 12 top SMT pads. Additionally, it includes 21 vias and supports 2 nets, providing versatile connectivity options.

 

Accepted Standard and Availability:
The AD255C Antenna PCB complies with the IPC-Class-2 standard, ensuring adherence to industry-leading quality and reliability guidelines. This exceptional PCB is available worldwide, making it easily accessible for your specific project needs.

 

Typical Applications:
The AD255C Antenna PCB is the perfect choice for various applications, including:
- Cellular infrastructure base station antenna: Ensure reliable and efficient communication in cellular networks.
- Automotive telematics antenna systems: Enhance connectivity and performance in automotive telematics applications.
- Commercial satellite radio antenna: Achieve superior signal reception and transmission in satellite radio systems.

 

Experience the power of the AD255C Antenna PCB and unlock a new level ofperformance and reliability in your RF and microwave applications. With its exceptional features, advanced materials, and meticulous construction, this PCB is ready to revolutionize your antenna systems. Order now and discover the difference the AD255C Antenna PCB can make in your projects worldwide.

products
PRODUCTS DETAILS
20mil AD255C Antenna PCB 2 layer Immesion Silver Printed Circuit Boards
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
AD255C
PCB Size:
32.91mm X 40.41mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immesion Silver
Layer Count:
2-layer
PCB Thickness:
20 Mil
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

AD255C Antenna PCB

,

20mil AD255C Antenna PCB

,

AD255C Immesion Silver Printed Circuit Boards

Product Description

Introducing a newly shipped Antenna PCB based on AD255C. The AD255C Antenna PCB is an exceptional product designed to deliver outstanding performance and reliability for a wide range of microwave and RF applications in telecommunication infrastructure. With its advanced features and innovative design, this PCB is a game-changer in the world of antenna laminates.

 

Featuring glass-reinforced, PTFE based materials, the AD255C provides controlled dielectric constant, low loss performance, and remarkable passive intermodulation (PIM) performance. The woven glass reinforcement ensures excellent circuit processability and enables high yield circuit board fabrication, ensuring optimal quality and efficiency.

 

Key Features:
- Very low loss PTFE and ceramic filled composite for superior performance
- Dielectric constant of 2.55 with tight tolerance at 10 GHz/23°C, ensuring precise operation
- 0.0013 loss tangent at 10GHz and base station frequencies at 10 GHz/23°C, minimizing signal loss
- Decomposition Temperature (Td) greater than 500°C, ensuring durability under extreme conditions
- Low profile copper for enhanced circuit efficiency
- Moisture Absorption of only 0.03%, maintaining stability and reliability
- Coefficient of Thermal Expansion (CTE) in X-axis of 34 ppm/°C, Y-axis of 26 ppm/°C, and Z-axis of 196 ppm/°C, minimizing stress and ensuring reliable performance

 

Benefits:
1. Lower Insertion Loss: The AD255C Antenna PCB offers significantly lower insertion loss compared to traditional PCB substrates, ensuring efficient signal transmission and reception.

 

2. Low PIM for Antenna Applications: With exceptional PIM performance, this PCB minimizes interference and provides clear and reliable communication.
 

3. Phase Stability: The excellent Thermal Coefficient of Expansion Ratio (TCEr) ensures phase stability, allowing for consistent performance over a wide range of temperatures.
 

4. Compatibility: The AD255C Antenna PCB is compatible with standard PTFE-based PCB processing, making it easy to integrate into existing systems.

 

Electrical Properties AD255C Units Test Conditions Test Method
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.55 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
Dielectric Constant (design) 2.60 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -110 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 7.4 x 108 Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 3.6 x 107 Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 911 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 34 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 26 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.35 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.4
(13.6)
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 8.1/6.6 (55.8/45.5) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 930/818 (6,412/5,640) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.03/0.07 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.03 % E1/105 +D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716

 

PCB Stackup:
This PCB features a 2-layer rigid construction with a copper layer thickness of 35 μm. The AD255C laminate, with a thickness of 0.508 mm (20mil), provides the ideal substrate for optimal performance. The second copper layer, also 35 μm thick, completes the stackup, ensuring durability and stability.

 

PCB Construction Details:
- Board dimensions: This antenna PCB measures 32.91mm x 40.41mm, providing a compact yet powerful solution for various applications.
- Minimum Trace/Space: With a minimum trace/space of 4/4 mils, this PCB enables precise routing and efficient use of space.
- Minimum Hole Size: The AD255C supports a minimum hole size of 0.25mm, allowing for versatile component integration.
- Finished board thickness: The finished board thickness is 0.6mm, providing a compact and lightweight solution.
- Finished Cu weight: The outer layers of this PCB feature 1oz (1.4 mils) copper weight, ensuring robust conductivity.
- Via plating thickness: The vias are plated with a thickness of 20 μm, facilitating reliable signal transmission.
- Surface finish: The AD255C Antenna PCB comes with an immersion silver surface finish, ensuring excellent conductivity and corrosion resistance.
- Top Silkscreen: The top silkscreen is presented in white, providing clear labeling and identification.
- Bottom Silkscreen: No bottom silkscreen is included, simplifying the design and maximizing efficiency.
- Top Solder Mask: The top solder mask is green, providing electrical insulation and protecting the copper traces.
- Bottom Solder Mask: No bottom solder mask is applied, allowing for easy soldering and rework.
- 100% Electrical Test: Each PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring quality and reliability.

 

PCB Material: Glass-reinforced, PTFE based Composites
Designation: AD255C
Dielectric constant: 2.55 (10 GHz)
Dissipation Factor 0.0013 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

20mil AD255C Antenna PCB 2 layer Immesion Silver Printed Circuit Boards 0

 

PCB Statistics:
This Antenna PCB features a compact design with 15 components, 29 total pads, 17 thru-hole pads, and 12 top SMT pads. Additionally, it includes 21 vias and supports 2 nets, providing versatile connectivity options.

 

Accepted Standard and Availability:
The AD255C Antenna PCB complies with the IPC-Class-2 standard, ensuring adherence to industry-leading quality and reliability guidelines. This exceptional PCB is available worldwide, making it easily accessible for your specific project needs.

 

Typical Applications:
The AD255C Antenna PCB is the perfect choice for various applications, including:
- Cellular infrastructure base station antenna: Ensure reliable and efficient communication in cellular networks.
- Automotive telematics antenna systems: Enhance connectivity and performance in automotive telematics applications.
- Commercial satellite radio antenna: Achieve superior signal reception and transmission in satellite radio systems.

 

Experience the power of the AD255C Antenna PCB and unlock a new level ofperformance and reliability in your RF and microwave applications. With its exceptional features, advanced materials, and meticulous construction, this PCB is ready to revolutionize your antenna systems. Order now and discover the difference the AD255C Antenna PCB can make in your projects worldwide.

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