Product Details:
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Material: | RF-60TC | PCB Size: | 54.19mm X 34.47mm=1PCS, +/- 0.15mm |
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Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
Layer Count: | 2-layer | PCB Thickness: | 0.3 Mm |
Highlight: | 1OZ Immersion Gold Printed Circuit Board,RF-60TC Immersion Gold Printed Circuit Board,5mil Immersion Gold Printed Circuit Board |
Introducing the Advanced High-Frequency PCB for Power and Antenna Applications-RF-60TC PCB. RF-60TC is a cutting-edge high-frequency material designed to meet the demands of high-power RF and microwave applications. This thermally conductive, ceramic-filled, glass-reinforced PTFE laminate offers exceptional performance for applications requiring lower operating temperatures, improved gains, and efficiencies in miniaturized antenna designs. RF-60TC sets a new standard in the 6.15 DK market by providing excellent dielectric heat dissipation and remarkably low dielectric losses.
Key Features of RF-60TC:
1. Glass Reinforced PTFE Ceramic Composites:
RF-60TC incorporates advanced glass-reinforced PTFE ceramic composites, ensuring superior performance and reliability in high-power applications.
2. Precise Dielectric Constant (Dk) of 6.15 at 10 GHz:
With a stable Dk of 6.15 at 10 GHz, RF-60TC guarantees consistent electrical performance across a wide range of frequencies, enabling accurate signal propagation.
3. Low Dissipation Factor:
RF-60TC boasts a low dissipation factor of 0.002 at 10 GHz and 23°C, allowing for efficient power transfer while minimizing energy loss.
4. Thermal Coefficient of Dk:
The material exhibits a thermal coefficient of Dk of -3.58 ppm/°C during a temperature range of -50°C to 150°C, ensuring stable electrical characteristics even under varying thermal conditions.
5. Excellent Thermal Conductivity:
RF-60TC offers high thermal conductivity values, providing enhanced heat transfer and allowing for additional design margin. It helps extend the lifetime of active components and improves long-term reliability. The thermal conductivity values are 0.9 W/M*K (unclad), 1.0 W/M*K (0.5oz copper), and 1.05 W/M*K (1oz copper).
6. Low Moisture Absorption:
With a moisture absorption rate of only 0.03%, RF-60TC maintains its electrical and mechanical properties, ensuring consistent performance over time.
7. Dimensional Stability and CTE:
RF-60TC features low coefficients of thermal expansion (CTE) with X-axis and Y-axis values of 9.9 ppm/°C and a Z-axis value of 40 ppm/°C. This excellent dimensional stability enables the construction of high layer count multilayer PCBs with improved plated through hole reliability.
RF-60TC Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 6.15 ± 0.15 | 6.15 ± 0.15 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 0.002 | 0.002 | ||
TcK | ppm/°C | -3.581 | ppm/°C | -3.581 | |
Dielectric Breakdown | IPC-650 2.5.6 | kV | 55 | kV | 55 |
Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 550 | V/mm | 21,654 |
Arc Resistance | IPC-650 2.5.1 | Seconds | >180 | Seconds | >180 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
Flexural Strength (MD) | IPC-650 2.4.4 | psi | 10,000 | N/mm2 | 69 |
Flexural Strength (CD) | IPC-650 2.4.4 | psi | 9,000 | N/mm2 | 62 |
Tensile Strength (MD) | IPC-650 2.4.19 | psi | 9,000 | N/mm2 | 62 |
Tensile Strength (CD) | IPC-650 2.4.19 | psi | 7,000 | N/mm2 | 48 |
Young’s Modulus (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | kpsi | 721 | N/mm2 | 4971 |
Poisson’s Ratio (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.155 | 0.155 | ||
Peel Strength (1 oz. ED) | IPC-650 2.4.8 | lbs/in | 8 | N/mm | 1.43 |
Thermal Conductivity (Unclad) | IPC-650 2.4.50 | W/M*K | 0.9 | W/M*K | 0.9 |
Thermal Conductivity (CH/CH) | IPC-650 2.4.50 | W/M*K | 1 | W/M*K | 1 |
Thermal Conductivity (C1/C1) | IPC-650 2.4.50 | W/M*K | 1.05 | W/M*K | 1.05 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.01 | mm/M | 0.01 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.69 | mm/M | 0.69 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.06 | mm/M | 0.06 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.8 | mm/M | 0.8 |
Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 1.0 x 108 | Mohm/cm | 1.0 x 108 |
CTE (X, Y axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 9.9 | ppm/°C | 9.9 |
CTE (Z axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 40 | ppm/°C | 40 |
Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 2.84 | g/cm3 | 2.84 |
Specific Heat | IPC-650 2.4.50 | J/gK | 0.94 | J/gK | 0.94 |
Td (2% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 930 | °C | 500 |
Td (5% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 960 | °C | 515 |
Flammability Rating | UL 94 | V-0 | V-0 |
Benefits of RF-60TC:
- Improved loss tangent for better signal integrity.
- High thermal conductivity for efficient heat dissipation.
- Enhanced dimensional stability for reliable performance.
- Low Z-axis CTE of 40 ppm/°C for reduced stress on components.
- Excellent adhesion to metal for secure connections.
- Stable Dk over frequency and temperature for consistent performance.
- Low moisture absorption for long-term reliability.
PCB Construction Details:
This 2-layer rigid PCB constructed with a copper layer thickness of 35 μm on both sides. The RF-60TC substrate has a thickness of 0.127 mm (5 mils), providing the desired electrical properties. The board dimensions are 54.19mm x 34.47mm (1PCS) with a tolerance of +/- 0.15mm, ensuring precise dimensions for your specific requirements. The PCB undergoes 100% electrical testing prior to shipment, ensuring its reliability and adherence to quality standards.
PCB Material: | PTFE based, ceramic filled fiberglass |
Designation: | RF-60TC |
Dielectric constant: | 6.15 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
PCB Statistics:
This RF PCB features 14 components and a total of 32 pads, including 21 thru-hole pads and 11 top SMT pads. It includes 21 vias and has 3 nets, offering flexibility in circuit connections.
Artwork and Quality Standards:
RF-60TC PCBs are compatible with Gerber RS-274-X artwork files and are manufactured to meet the IPC-Class-2 quality standard, guaranteeing reliability and consistent performance. They are available for worldwide purchase, allowing engineers and manufacturers from all regions to benefit from their exceptional quality.
Typical Applications of RF-60TC:
Experience the exceptional performance and reliability of RF-60TC in your high-power amplifiers, miniaturized antennas, GPS devices, filters, couplers, dividers, and satellites. Order RF-60TC PCBs today and take your designs to new heights of efficiency and performance.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848