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1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold

1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-60TC
PCB Size:
54.19mm X 34.47mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.3 Mm
Highlight:

1OZ Immersion Gold Printed Circuit Board

,

RF-60TC Immersion Gold Printed Circuit Board

,

5mil Immersion Gold Printed Circuit Board

Product Description

Introducing the Advanced High-Frequency PCB for Power and Antenna Applications-RF-60TC PCB. RF-60TC is a cutting-edge high-frequency material designed to meet the demands of high-power RF and microwave applications. This thermally conductive, ceramic-filled, glass-reinforced PTFE laminate offers exceptional performance for applications requiring lower operating temperatures, improved gains, and efficiencies in miniaturized antenna designs. RF-60TC sets a new standard in the 6.15 DK market by providing excellent dielectric heat dissipation and remarkably low dielectric losses.

 

Key Features of RF-60TC:

1. Glass Reinforced PTFE Ceramic Composites:
RF-60TC incorporates advanced glass-reinforced PTFE ceramic composites, ensuring superior performance and reliability in high-power applications.

 

2. Precise Dielectric Constant (Dk) of 6.15 at 10 GHz:
With a stable Dk of 6.15 at 10 GHz, RF-60TC guarantees consistent electrical performance across a wide range of frequencies, enabling accurate signal propagation.

 

3. Low Dissipation Factor:
RF-60TC boasts a low dissipation factor of 0.002 at 10 GHz and 23°C, allowing for efficient power transfer while minimizing energy loss.

 

4. Thermal Coefficient of Dk:
The material exhibits a thermal coefficient of Dk of -3.58 ppm/°C during a temperature range of -50°C to 150°C, ensuring stable electrical characteristics even under varying thermal conditions.

 

5. Excellent Thermal Conductivity:
RF-60TC offers high thermal conductivity values, providing enhanced heat transfer and allowing for additional design margin. It helps extend the lifetime of active components and improves long-term reliability. The thermal conductivity values are 0.9 W/M*K (unclad), 1.0 W/M*K (0.5oz copper), and 1.05 W/M*K (1oz copper).

 

6. Low Moisture Absorption:
With a moisture absorption rate of only 0.03%, RF-60TC maintains its electrical and mechanical properties, ensuring consistent performance over time.

 

7. Dimensional Stability and CTE:

RF-60TC features low coefficients of thermal expansion (CTE) with X-axis and Y-axis values of 9.9 ppm/°C and a Z-axis value of 40 ppm/°C. This excellent dimensional stability enables the construction of high layer count multilayer PCBs with improved plated through hole reliability.

 

RF-60TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   6.15 ± 0.15   6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.002   0.002
TcK   ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength (MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength (CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength (MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength (CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus (MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio (MD) ASTM D 3039/IPC-TM-650 2.4.19   0.155   0.155
Peel Strength (1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity (CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity (C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE (X, Y axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 9.9 ppm/°C 9.9
CTE (Z axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 40 ppm/°C 40
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td (2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td (5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94   V-0   V-0

 

Benefits of RF-60TC:

- Improved loss tangent for better signal integrity.
- High thermal conductivity for efficient heat dissipation.
- Enhanced dimensional stability for reliable performance.
- Low Z-axis CTE of 40 ppm/°C for reduced stress on components.
- Excellent adhesion to metal for secure connections.
- Stable Dk over frequency and temperature for consistent performance.
- Low moisture absorption for long-term reliability.

 

PCB Construction Details:
This 2-layer rigid PCB constructed with a copper layer thickness of 35 μm on both sides. The RF-60TC substrate has a thickness of 0.127 mm (5 mils), providing the desired electrical properties. The board dimensions are 54.19mm x 34.47mm (1PCS) with a tolerance of +/- 0.15mm, ensuring precise dimensions for your specific requirements. The PCB undergoes 100% electrical testing prior to shipment, ensuring its reliability and adherence to quality standards.

 

PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold 0

 

PCB Statistics:

This RF PCB features 14 components and a total of 32 pads, including 21 thru-hole pads and 11 top SMT pads. It includes 21 vias and has 3 nets, offering flexibility in circuit connections.

 

Artwork and Quality Standards:

RF-60TC PCBs are compatible with Gerber RS-274-X artwork files and are manufactured to meet the IPC-Class-2 quality standard, guaranteeing reliability and consistent performance. They are available for worldwide purchase, allowing engineers and manufacturers from all regions to benefit from their exceptional quality.

 

Typical Applications of RF-60TC:

Experience the exceptional performance and reliability of RF-60TC in your high-power amplifiers, miniaturized antennas, GPS devices, filters, couplers, dividers, and satellites. Order RF-60TC PCBs today and take your designs to new heights of efficiency and performance.

products
PRODUCTS DETAILS
1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-60TC
PCB Size:
54.19mm X 34.47mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.3 Mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

1OZ Immersion Gold Printed Circuit Board

,

RF-60TC Immersion Gold Printed Circuit Board

,

5mil Immersion Gold Printed Circuit Board

Product Description

Introducing the Advanced High-Frequency PCB for Power and Antenna Applications-RF-60TC PCB. RF-60TC is a cutting-edge high-frequency material designed to meet the demands of high-power RF and microwave applications. This thermally conductive, ceramic-filled, glass-reinforced PTFE laminate offers exceptional performance for applications requiring lower operating temperatures, improved gains, and efficiencies in miniaturized antenna designs. RF-60TC sets a new standard in the 6.15 DK market by providing excellent dielectric heat dissipation and remarkably low dielectric losses.

 

Key Features of RF-60TC:

1. Glass Reinforced PTFE Ceramic Composites:
RF-60TC incorporates advanced glass-reinforced PTFE ceramic composites, ensuring superior performance and reliability in high-power applications.

 

2. Precise Dielectric Constant (Dk) of 6.15 at 10 GHz:
With a stable Dk of 6.15 at 10 GHz, RF-60TC guarantees consistent electrical performance across a wide range of frequencies, enabling accurate signal propagation.

 

3. Low Dissipation Factor:
RF-60TC boasts a low dissipation factor of 0.002 at 10 GHz and 23°C, allowing for efficient power transfer while minimizing energy loss.

 

4. Thermal Coefficient of Dk:
The material exhibits a thermal coefficient of Dk of -3.58 ppm/°C during a temperature range of -50°C to 150°C, ensuring stable electrical characteristics even under varying thermal conditions.

 

5. Excellent Thermal Conductivity:
RF-60TC offers high thermal conductivity values, providing enhanced heat transfer and allowing for additional design margin. It helps extend the lifetime of active components and improves long-term reliability. The thermal conductivity values are 0.9 W/M*K (unclad), 1.0 W/M*K (0.5oz copper), and 1.05 W/M*K (1oz copper).

 

6. Low Moisture Absorption:
With a moisture absorption rate of only 0.03%, RF-60TC maintains its electrical and mechanical properties, ensuring consistent performance over time.

 

7. Dimensional Stability and CTE:

RF-60TC features low coefficients of thermal expansion (CTE) with X-axis and Y-axis values of 9.9 ppm/°C and a Z-axis value of 40 ppm/°C. This excellent dimensional stability enables the construction of high layer count multilayer PCBs with improved plated through hole reliability.

 

RF-60TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   6.15 ± 0.15   6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.002   0.002
TcK   ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength (MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength (CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength (MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength (CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus (MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio (MD) ASTM D 3039/IPC-TM-650 2.4.19   0.155   0.155
Peel Strength (1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity (CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity (C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE (X, Y axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 9.9 ppm/°C 9.9
CTE (Z axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 40 ppm/°C 40
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td (2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td (5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94   V-0   V-0

 

Benefits of RF-60TC:

- Improved loss tangent for better signal integrity.
- High thermal conductivity for efficient heat dissipation.
- Enhanced dimensional stability for reliable performance.
- Low Z-axis CTE of 40 ppm/°C for reduced stress on components.
- Excellent adhesion to metal for secure connections.
- Stable Dk over frequency and temperature for consistent performance.
- Low moisture absorption for long-term reliability.

 

PCB Construction Details:
This 2-layer rigid PCB constructed with a copper layer thickness of 35 μm on both sides. The RF-60TC substrate has a thickness of 0.127 mm (5 mils), providing the desired electrical properties. The board dimensions are 54.19mm x 34.47mm (1PCS) with a tolerance of +/- 0.15mm, ensuring precise dimensions for your specific requirements. The PCB undergoes 100% electrical testing prior to shipment, ensuring its reliability and adherence to quality standards.

 

PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold 0

 

PCB Statistics:

This RF PCB features 14 components and a total of 32 pads, including 21 thru-hole pads and 11 top SMT pads. It includes 21 vias and has 3 nets, offering flexibility in circuit connections.

 

Artwork and Quality Standards:

RF-60TC PCBs are compatible with Gerber RS-274-X artwork files and are manufactured to meet the IPC-Class-2 quality standard, guaranteeing reliability and consistent performance. They are available for worldwide purchase, allowing engineers and manufacturers from all regions to benefit from their exceptional quality.

 

Typical Applications of RF-60TC:

Experience the exceptional performance and reliability of RF-60TC in your high-power amplifiers, miniaturized antennas, GPS devices, filters, couplers, dividers, and satellites. Order RF-60TC PCBs today and take your designs to new heights of efficiency and performance.

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