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20mil RF PCB RO4360G2 Double-sided 0.6mm Immersion Gold Circuit Board

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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20mil RF PCB RO4360G2 Double-sided 0.6mm Immersion Gold Circuit Board

20mil RF PCB RO4360G2 Double-sided 0.6mm Immersion Gold Circuit Board
20mil RF PCB RO4360G2 Double-sided 0.6mm Immersion Gold Circuit Board 20mil RF PCB RO4360G2 Double-sided 0.6mm Immersion Gold Circuit Board

Large Image :  20mil RF PCB RO4360G2 Double-sided 0.6mm Immersion Gold Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RO4360G2 PCB Size: 68.35mm X 41.4 Mm=1PCS
Copper Weight: 1OZ Surface Finish: Immersion Gold
Layer Count: 2 Layers PCB Thickness: 0.6mm
High Light:

RO4360G2 RF PCB Board

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20mil RF PCB Board

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Immersion Gold RF PCB Board

The newly shipped RO4360G2 2-Layer Rigid PCB is a cutting-edge product that combines performance and processing capability, making it ideal for a wide range of applications. Let's delve into the key features and benefits of this exceptional PCB:

 

Features:
- Dielectric constant (Dk) of 6.15+/- 0.15 at 10 GHz/23°C: Ensures reliable signal transmission and optimal performance.
- Dissipation factor of 0.0038 at 10 GHz/23°C: Minimizes signal loss, maintaining signal integrity.
- High Thermal Conductivity of 0.75 W/mK: Efficient heat dissipation, enhancing reliability and performance.
- Low Z-axis coefficient of thermal expansion at 28 ppm/°C: Ensures dimensional stability under varying temperatures.
- Lead-free Process Compatible, 94V-0 flammability: Environmentally friendly and meets stringent safety requirements.

 

RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23 IPC-TM-650 2.5.5.5
2.5 GHz/23
Dissipation Factor,tanδ 0.0038 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75   W/mK 50 ASTM D-5470
Volume Resistivity 4.0 X 1013   Ω.cm Elevated T IPC-TM-650 2.5.17.1
Surface Resistivity 9.0 X 1012   Ω Elevated T IPC-TM-650 2.5.17.1
Electrical Strength 784 Z V/mil   IPC-TM-650 2.5.6.2
Tensile Strength 131 (19) 97(14) X Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31) 145(21) X Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion 13 14 28 X Y Z ppm/ -50 to 288 After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280   ℃ TMA   IPC-TM-650 2.4.24.3
Td 407     ASTM D3850 using TGA
T288 >30 Z min 30 min / 125 Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08   % 50/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50 to 150 IPC-TM-650, 2.5.5.5
Density 2.16   gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91)   pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0       UL 94 File QMTS2. E102765

 

Benefits:
- Design flexibility: RO4360G2 offers design flexibility, allowing for innovative and customized applications.
- Plated through-hole reliability: Ensures robust and reliable connections for components.
- Automated assembly compatible: Facilitates efficient and streamlined manufacturing processes.
- Environmentally friendly - Lead-free process compatible: Supports eco-friendly initiatives and compliance with regulations.
- Efficient supply chain and short lead times: Cost-effective material option with quicker turnaround.

 

The RO4360G2 2-Layer Rigid PCB is designed with meticulous construction details to meet your specific requirements. The board dimensions of 68.35mm x 41.4mm provide a compact yet functional size, while the minimum trace width of 4 mils and space of 6 mils ensure precise signal routing. With a finished board thickness of 0.6mm and a finished copper weight of 1 oz (1.4 mils) on the outer layers, this PCB offers a slim profile without compromising on conductivity. The 20 μm via plating thickness and immersion gold surface finish ensure reliable electrical connections and excellent solderability. The top and bottom green solder mask provide protection and visual clarity, while the 100% electrical test before shipment guarantees quality. Additionally, the inclusion of 0.5mm vias filled with resin and capped enhances structural integrity. Supporting 11 components, 70 pads (46 thru-hole and 24 top SMT), and 35 vias, this PCB offers versatility for various applications.

 

The PCB statistics showcase its key characteristics. With 3 nets, the PCB enables multiple signal paths, and its precise design facilitates efficient interconnection. Whether you require reliable through-hole connections or surface mount technology, the RO4360G2 PCB is equipped with 46 thru-hole pads and 24 top SMT pads. The absence of bottom SMT pads ensures optimized layout options. These construction details and statistics highlight the precision, reliability, and versatility of the RO4360G2 2-Layer Rigid PCB, making it an excellent choice for diverse electronic applications.

 

Accepted Standard: IPC-Class-2.

 

PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

20mil RF PCB RO4360G2 Double-sided 0.6mm Immersion Gold Circuit Board 0

 

Applications:
- Base Station Power Amplifiers: Achieve high-performance power amplification for base stations.
- Small Cell Transceivers: Enable efficient and reliable communication in small cell transceiver systems.

 

Availability: The RO4360G2 PCB is available worldwide, ensuring accessibility for global customers.

 

Experience the power and efficiency of RO4360G2 2-Layer Rigid PCB in your next project. Contact us today to explore the limitless possibilities this exceptional PCB offers!

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)