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30 Mil TLF-35A Customized PCB Prototype Green Soldermask Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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30 Mil TLF-35A Customized PCB Prototype Green Soldermask Immersion Gold

Detailed Product Description
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Soldermask Immersion Gold PCB


Customized PCB Prototype


30 Mil PCB Prototype

Introducing our newly shipped PCB, meticulously engineered to deliver outstanding performance and reliability. This 2-layer rigid PCB features the advanced Taconic TLF-35A fiberglass Ceramic-filled PTFE composites, intended to excel in high-frequency applications where signal integrity and efficiency are paramount.


The construction of this PCB showcases precision and attention to detail. With a board dimension of 141.5mm x 90mm, each piece is provided with a tight tolerance of +/-0.15mm, ensuring consistency and accuracy. The stackup consists of a 35μm copper layer on both sides, sandwiching the TLF-35A substrate with a thickness of 0.762mm (30mil), providing a sturdy foundation for your circuitry.


Featuring a minimum trace/space of 4/5 mils. The minimum hole size is 0.5mm, facilitating ease of assembly and accommodating a wide range of components. With no blind vias, the PCB ensures seamless connectivity across the board.


At a finished board thickness of 0.88mm, this PCB strikes a balance between durability and flexibility. The 1oz (1.4 mils) outer layer copper weight offers excellent electrical conductivity. The via plating thickness of 20μm ensures robust connections throughout the circuitry. The surface finish is done with immersion gold, providing a protective layer and enhancing solderability.


Both the top and bottom sides are coated with green solder mask, providing insulation and safeguarding against environmental factors. The absence of silkscreen allows for a clean and streamlined appearance. Prior to shipment, each PCB undergoes a rigorous 100% electrical test, ensuring optimal functionality and performance.


With 137 components and 190 pads, this PCB accommodates a wide range of circuit elements. It includes 131 thru-hole pads, 43 top SMT pads, and 16 bottom SMT pads, offering flexibility in component placement. With 211 vias and 9 nets, this PCB enables seamless connectivity and efficient signal transmission.


Compliant with IPC-Class-2 standards, this PCB adheres to strict quality requirements, ensuring consistent performance and reliability. The artwork is supplied in Gerber RS-274-X format, ensuring compatibility with various design software and manufacturing processes.


Our PCBs are available worldwide, and we are committed to providing exceptional customer support. For any technical inquiries or questions, please contact Ivy at We are dedicated to delivering top-notch PCB solutions tailored to your unique requirements.


Property Test Method Units Value Units Value
Dielectric Constant @ 1.9 GHz IPC-TM650 Mod   3.50 ±0.05   3.50 ±0.05
Dissipation Factor @ 1.9 GHz IPC-TM650 Mod   0.0016   0.0016
Dissipation Factor @ 10 GHz IPC-TM650 Mod   0.0022   0.0022
Water Absorption IPC-TM 650 % 0.03 % 0.03
Peel Strength (1 oz. copper) IPC-TM 650 2.4.8 Lbs./linear inch 10 N/mm 1.8
Volume Resistivity IPC-TM 650 Mohm·cm 2.0 x 109 Mohm·cm 2.0 x 109
Surface Resistivity IPC-TM 650 Mohm 3.0 x 108 Mohm 3.0 x 108
Flexural Strength Lengthwise IPC-TM 650 650 2.4.4 psi 13000 N/mm2 90
Flexural Strength Crosswise IPC-TM 650 650 2.4.4 psi 13000 N/mm2 90
Thermal Conductivity IPC-TM 650 2.4.50 W/m/K 0.37 W/m/K 0.37
x-y CTE (50 ~ 150) IPC-TM 650 2.4.41 ppm/ 9-12 ppm/ 9-12
z CTE (50 ~ 150) IPC-TM 650 2.4.41 ppm/ 80 ppm/ 80
Flammability UL-94   V-0   V-0


PCB Material: Organic-ceramic, Woven glass reinforcement
Designation: TLF-35
Dielectric constant: 3.5
Dissipation Factor 0.0022 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


30 Mil TLF-35A Customized PCB Prototype Green Soldermask Immersion Gold 0

High-Performance PCB Material for Next-Generation Electronics


TLF-35, a fiberglass Ceramic-filled PTFE composite material from Taconic, has emerged as a leading choice for high-frequency PCB applications. With exceptional electrical properties, thermal stability, and mechanical strength, TLF-35 empowers engineers to push the boundaries of electronic design. In this article, we explore the key characteristics of TLF-35 and its significance in delivering outstanding performance and reliability.


Exceptional Electrical Performance
TLF-35, with a dielectric constant of 3.50±0.05 at 1.9GHz, offers excellent control over impedance and propagation characteristics, ensuring optimal signal integrity in high-frequency applications. Its low dissipation factor of 0.0016 at 1.9GHz and 0.0022 at 10GHz minimizes signal loss and distortion, facilitating efficient signal transmission. Furthermore, TLF-35 exhibits a volume resistivity of 2.0 x 10^9 and a surface resistivity of 3.0 x 10^8 Mohm, providing excellent electrical insulation properties for reliable circuit operation.


Superior Mechanical Strength and Thermal Stability
TLF-35 combines remarkable mechanical strength with excellent thermal stability, making it suitable for demanding environments. With a flexural strength of 13,000 psi (90 M/mm^2) both lengthwise and crosswise, TLF-35 ensures structural integrity and resistance to bending or breaking. Its low water absorption rate of 0.03% enhances dimensional stability and prevents degradation due to moisture.


The material's thermal conductivity of 0.37 W/m/K enables efficient dissipation of heat, preventing overheating and maintaining optimal performance. TLF-35 exhibits a coefficient of thermal expansion (CTE) of 9-12 ppm/°C in the x-y direction and 80 ppm/°C in the z direction (50-150°C), ensuring minimal dimensional changes and reducing the risk of stress-induced failures in varying temperature environments.


Reliable and Safe
TLF-35 prioritizes reliability and safety with its exceptional peel strength of 10 Lbs./linear inch (1.8 M/mm) for 1oz copper, ensuring secure adhesion of copper layers. The material meets UL-94 V-0 flammability rating, providing excellent flame resistance and enhancing safety in electronic applications.


Applications and Versatility
TLF-35 finds extensive applications in high-frequency PCB projects across various industries. It is ideal for telecommunications, aerospace, and computing applications, where signal integrity and performance are critical. TLF-35 enables the development of base stations, wireless communication systems, radar systems, satellite technology, avionics, high-speed networking equipment, and advanced test and measurement instruments. Its versatility and exceptional properties make it a go-to choice for engineers seeking reliable and high-performance PCB solutions.


TLF-35, a high-performance PCB material from Taconic, empowers engineers to achieve exceptional electrical performance, mechanical strength, and thermal stability in high-frequency designs. With its outstanding properties, TLF-35 is revolutionizing the field of electronic design, enabling the realization of cutting-edge technologies and pushing the boundaries of innovation.


Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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