logo
products
PRODUCTS DETAILS
Home > Products >
Lead Free Multilayer Printed Circuit Board E glass coated
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Contact Us
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Contact Now
Lead Free Multilayer Printed Circuit Board E glass coated
  • name
  • name
  • name
  • name

Lead Free Multilayer Printed Circuit Board E glass coated

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-502.V1.0
Base Material:
High-Tg And High Thermal Reliability Epoxy Resin
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
Highlight:

Lead Free Multilayer Printed Circuit Board

,

E Glass Coated Printed Circuit Board

,

Hybrid PCB Printed Circuit Board

Product Description

 

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

 

Lead Free Multilayer Printed Circuit Board E glass coated 0

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

 

Our PCB Capability (TU-768)

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg High-Tg and High Thermal Reliability Epoxy Resin
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Lead Free Multilayer Printed Circuit Board E glass coated 1

 

Typical Properties of TU-768

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 190°C    
Tg (DSC) 180°C   > 170°C
Tg (TMA) 170°C E-2/105  
Td (TGA) 350°C   > 340°C
CTE x-axis 11~15 ppm/°C   N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min   > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 4.3    
Loss Tangent (RC 50%) @10GHz 0.018    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 4.4 / 4.3   < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3   N/A
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.019 /0.018   < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023   N/A
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %

 

Tags: 

FR4 PCB Board,  

6 Layer FR4 PCB Board,  

Mobile Broadband Gold Finger PCB

Recommended Products
Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold

Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold

Contact Now
Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Contact Now
0.5mm FR4 PCB Board Thin Circuit Board For GPS Tracker

0.5mm FR4 PCB Board Thin Circuit Board For GPS Tracker

Contact Now
High Temperature 8 Layer FR4 PCB Board For Satellite Radio

High Temperature 8 Layer FR4 PCB Board For Satellite Radio

Contact Now
Hybrid PCB 10mil RO4350B And FR4 5 Layer PCB With Immersion Gold For 2.4 Ghz Antenna

Hybrid PCB 10mil RO4350B And FR4 5 Layer PCB With Immersion Gold For 2.4 Ghz Antenna

Contact Now
Thin Printed Circuit Board 0.6mm Double Sided PCB on FR-4 with HASL Lead Free

Thin Printed Circuit Board 0.6mm Double Sided PCB on FR-4 with HASL Lead Free

Contact Now
Thick Printed Circuit Board 3.0mm Double Sided PCB Built On FR-4 With Immersion Gold

Thick Printed Circuit Board 3.0mm Double Sided PCB Built On FR-4 With Immersion Gold

Contact Now
Heavy Copper PCB High Power Circuit Board Built On FR-4 With 3 Oz Copper

Heavy Copper PCB High Power Circuit Board Built On FR-4 With 3 Oz Copper

Contact Now
Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

Contact Now
Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

Contact Now
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

Contact Now
products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Lead Free Multilayer Printed Circuit Board E glass coated
  • name
  • name
  • name
  • name
Lead Free Multilayer Printed Circuit Board E glass coated
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-502.V1.0
Base Material:
High-Tg And High Thermal Reliability Epoxy Resin
Layer Count:
Double Layer, Multilayer, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
Surface Finish:
Bare Copper, HASL, ENIG, OSP, Immersion Tin, Immersion Silver Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Lead Free Multilayer Printed Circuit Board

,

E Glass Coated Printed Circuit Board

,

Hybrid PCB Printed Circuit Board

Product Description

 

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

 

Lead Free Multilayer Printed Circuit Board E glass coated 0

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

 

Our PCB Capability (TU-768)

High Tg Lead Free Multi-layer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg High-Tg and High Thermal Reliability Epoxy Resin
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Lead Free Multilayer Printed Circuit Board E glass coated 1

 

Typical Properties of TU-768

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 190°C    
Tg (DSC) 180°C   > 170°C
Tg (TMA) 170°C E-2/105  
Td (TGA) 350°C   > 340°C
CTE x-axis 11~15 ppm/°C   N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min   > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 4.3    
Loss Tangent (RC 50%) @10GHz 0.018    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 4.4 / 4.3   < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3   N/A
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.019 /0.018   < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023   N/A
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %

 

Tags: 

FR4 PCB Board,

6 Layer FR4 PCB Board,

Mobile Broadband Gold Finger PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.